Title:
POLISHING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/047683
Kind Code:
A1
Abstract:
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liquid to a back surface of the substrate W, and thereby removing a film formed on the back surface of the substrate W; and a polishing step, after removal of the film on the back surface of the substrate W, for bringing a polishing tool 96 into contact with the back surface of the rotating substrate W to polish the back surface of the substrate W by chemo-mechanical grinding, the polishing tool 96 having a resin body in which abrasive grains are dispersed.
Inventors:
ISHII HIROAKI (JP)
ISHII JUNICHI (JP)
ISHII JUNICHI (JP)
Application Number:
PCT/JP2022/018165
Publication Date:
March 30, 2023
Filing Date:
April 19, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B24B49/14; B24B7/04; B24B27/033; B24B41/06; B24B49/12; B24B49/16; H01L21/304
Foreign References:
| JPH06275480A | 1994-09-30 | |||
| JP2018160627A | 2018-10-11 | |||
| JP2021041472A | 2021-03-18 | |||
| JP2003282509A | 2003-10-03 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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