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Title:
POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/047682
Kind Code:
A1
Abstract:
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rotates a substrate W while holding the substrate W in a horizontal posture; a hot plate 45 that heats the substrate W; and a polishing tool 96 that includes a resin body in which abrasive grains are dispersed, comes into contact with a back surface of the substrate W, which is rotating while being heated, and polishes the back surface of the substrate W by chemo-mechanical grinding.

Inventors:
ISHII HIROAKI (JP)
ISHII JUNICHI (JP)
Application Number:
PCT/JP2022/018164
Publication Date:
March 30, 2023
Filing Date:
April 19, 2022
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B24B49/14; B24B7/04; B24B41/06; B24B49/16; H01L21/304; H01L21/677
Foreign References:
JP2018160627A2018-10-11
JP2005191511A2005-07-14
JP2001162517A2001-06-19
JP2020109839A2020-07-16
JP2012166274A2012-09-06
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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