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Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/047684
Kind Code:
A1
Abstract:
A substrate processing apparatus 1 comprises: an indexer robot that takes a substrate W into and out of a carrier; a polishing unit 22 that polishes a back surface of the substrate while heating the substrate W; and a substrate transport robot that transports, to the polishing unit, the substrate W transported from the indexer robot. The polishing unit 22 comprises: a holding and rotating unit 35 that rotates the substrate W while holding the substrate W in a horizontal posture; a hot plate 45 that heats the substrate W; and a polishing tool 96 that comes into contact with the back surface of the substrate W, which is rotating while being heated, and polishes the back surface of the substrate W by chemo-mechanical grinding.

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Inventors:
ISHII HIROAKI (JP)
ISHII JUNICHI (JP)
Application Number:
PCT/JP2022/018166
Publication Date:
March 30, 2023
Filing Date:
April 19, 2022
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B24B49/14; B24B7/04; B24B49/12; H01L21/304; H01L21/677
Foreign References:
JP2002231671A2002-08-16
JP2018160627A2018-10-11
JP2018140469A2018-09-13
JP2010050436A2010-03-04
JP2008155292A2008-07-10
JP2005191511A2005-07-14
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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