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WO/2023/138060A1 |
A double-track welding system. A first track (300) is detachably mounted on a first side of a weld seam of a workpiece, and a second track (400) is detachably mounted on a second side of the weld seam of the workpiece (600). The first tr...
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WO/2023/138421A1 |
An online detection method and system for the surface condition of a polishing pad. The online detection method comprises the following steps: an optical sensor (1) moving above a polishing pad (2), so as to acquire distance information ...
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WO/2023/140146A1 |
The present invention provides a means which makes it possible to polish a target object at a high polishing rate and also makes it possible to maintain the surface quality of the polished target object at a good level. The present inv...
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WO/2023/140814A1 |
It's a plating method using friction technique. A steel brush using for melting by friction. Steel brush on a grinder machine melting a metal stick taking and plating on a surface by melting by friction heat. This method also can used to...
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WO/2023/139834A1 |
A chuck device (2) is configured to hold a wafer (W) during planarization of the wafer employing anodization. The chuck device includes a chuck cover (22), a suction section (23), and an energization section (24). The suction section (23...
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WO/2023/140450A1 |
The present invention provides a method for manufacturing a polishing pad window, a polishing pad window manufactured by the method, and a polishing pad including the window, the method comprising the steps of: a) producing a mixture by ...
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WO/2023/134279A1 |
A separation and recycling system for an abrasive subjected to rail grinding using a high-pressure abrasive water jet, comprising an abrasive primary separation module, an abrasive drying module, an abrasive secondary separation module a...
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WO/2023/134788A2 |
The present invention relates to the field of polishing apparatuses, and relates in particular to a surface smart polishing apparatus. A clamping apparatus clamps a plurality of workpieces to be polished, and drives the workpieces to rot...
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WO/2023/137329A1 |
Methods of forming a cutting element include leaching a diamond table of the cutting element and subsequent to leaching the diamond table of the cutting element, forming a chamfer on the diamond table of the cutting element at an interfa...
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WO/2023/135673A1 |
This CMP polishing solution contains abrasive grains, an iron ion supply agent, an organic acid, an oxidizing agent, and an aqueous liquid medium, the abrasive grains including silica particles that have sulfo groups and silica particles...
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WO/2023/135031A1 |
The invention relates to a sanding or polishing machine (10a; 10b; 10c; 10d; 10e), in particular a portable sanding or polishing machine (10a; 10b; 10c; 10d; 10e), advantageously an eccentric or orbital sander, having a housing unit (14a...
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WO/2023/135118A1 |
This disclosure generally relates to a grinding jig (1) for holding a blade (100) of a tool in a grinding machine (200), the grinding machine (200) comprising a grinding means (210) and a support means (220). The grinding jig (1) compris...
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WO/2023/137029A2 |
Abrasive devices suitable for use in cylinder style floor cleaning machines for the purpose of deep cleaning, restoring, honing and/or polishing are described. The abrasive devices include an elongated body and abrasive structures extend...
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WO/2023/135194A1 |
The present invention relates to a computer-implemented method for defining a production correction model, to a memory device for storing the production correction model, to a computer-implemented method for determining a production corr...
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WO/2023/134108A1 |
Provided is a new energy guide rail-type steel rail cleaning integrated system, comprising: a horizontal movement guide rail assembly, a vertical movement guide rail assembly, and a cleaning head assembly. By means of the coordination be...
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WO/2023/137228A1 |
A buffer and self-feeding apparatus includes a polishing device, a pump assembly, a pressurized reservoir, a collapsible cartridge, and a backing plate. The polishing device provides rotational energy to the backing plate as the backing ...
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WO/2023/136760A1 |
A fire-fighting lance comprising: a first inlet for providing high-pressure fluid to a longitudinally extending first fluid conduit; an abrasive tank for receiving an abrasive medium, the abrasive tank having a longitudinal axis of exten...
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WO/2023/135862A1 |
This cutting device is supplied with process water from a water supply facility outside of the cutting device. The cutting device comprises a cutting unit, a supply unit, a detection unit, an adjustment unit, and a control unit. The cutt...
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WO/2023/130871A1 |
A lower chamfering device, comprising a seat cylinder (100), a first power assembly (200), a second power assembly (300), a transmission shaft assembly (400), and a grinding wheel (500), wherein the seat cylinder comprises a cylinder bod...
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WO/2023/131075A1 |
Disclosed in the present invention is a polishing pad finishing apparatus, comprising: a connecting arm that horizontally extends; a finishing head unit, provided at one end of the connecting arm and used for finishing a polishing pad; a...
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WO/2023/132696A1 |
A management server for supporting remote control of a lens edger through a user terminal, according to embodiments of the present invention, comprises: a communication system which performs remote control of the lens edger using the use...
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WO/2023/133196A2 |
An adaptable belt sander may comprise: a tool holder; a housing; a drive system comprising a first gear and a second gear configured to engage the first gear, the second gear coupled to a shaft; and a belt system comprising a belt extend...
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WO/2023/131378A1 |
The invention relates to particulate treatment articles for treating surfaces of products, particularly 3D-printed products, particularly for smoothing and/or cleaning, particularly by way of a blast method, wherein the particulate treat...
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WO/2023/133110A1 |
Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pa...
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WO/2023/132165A1 |
Provided is a novel dresser capable of imparting high flatness to a polishing pad. A dresser for a surface of a polishing pad is provided, comprising a circular dressing surface having a diameter DCD and facing the pad surface, and pel...
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WO/2023/123602A1 |
Disclosed is a rotary wafer exchange system; the rotary wafer exchange system comprises a tray assembly and at least one wafer exchange apparatus; said tray assembly comprises a rotary shaft and at least two trays used for holding wafers...
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WO/2023/129567A1 |
. Pad conditioning brushes are described. In particular, pad conditioning brushes including a carrier layer and a plurality of abrasive particle-free brush bristles extending from the carrier layer are described. The carrier layer and th...
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WO/2023/130051A1 |
An abrasive article including a backing; a plurality of shaped abrasive particles overlying the backing; where the abrasive article further has: 1) a Swarf Mode Gray Value of less than 25 for cumulative material removed of at least 500 g...
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WO/2023/126760A1 |
Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compress...
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WO/2023/127155A1 |
This numerical control device comprises: a calculation unit that calculates, from a machining program, a start point and an end point of a reciprocating movement of a feed shaft; a control unit that synchronous controls, between the star...
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WO/2023/129779A1 |
A cutting element includes a substrate and a volume of polycrystalline diamond (PDC) on the substrate. The PDC volume has a front cutting face, a lateral side surface, and a cutting edge between the front cutting face and the lateral sid...
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WO/2023/125916A1 |
Disclosed in the present invention is a wafer polishing system, comprising polishing units. Each polishing unit comprises a wafer transfer channel and a polishing module; the polishing module comprises a polishing platform and a polishin...
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WO/2023/126854A1 |
Polishing pads include a polishing layer having a thickness and including a polymer having a working surface and a second surface opposite the working surface are described. In particular, polishing pads where the working surface include...
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WO/2023/130059A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/127279A1 |
Provided is a filter member having a filter that exhibits a long filter life and that can maintain a particle concentration in a particle-containing liquid being filtered. The filter member has a filter that has an opening diameter that ...
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WO/2023/130052A1 |
An abrasive article including: a backing layer including a front fill overlying a backing, wherein the backing layer including the front fill comprises (1) a surface roughness of not greater than 100 microns or (2) an average thickness/r...
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WO/2023/130053A1 |
An abrasive article includes a backing; a make coat overlying the backing; and a plurality of abrasive particles overlying the backing and at least partially contained in the make coat; and a make coat thickness ratio (Tg/Ta) of not grea...
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WO/2023/130082A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/130088A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/126761A1 |
A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on ...
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WO/2023/126271A1 |
The invention relates to a grinding means, in particular a grinding disc, for grinding a workpiece, having an, in particular flexible, support element (13), having a plurality of grinding elements (15) for grinding a workpiece, and havin...
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WO/2023/127601A1 |
The present invention predicts the occurrence of a waviness anomaly. This waviness prediction device comprises: a data input unit for receiving input of waviness data which is obtained by measuring the waviness of a polishing target surf...
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WO/2023/130015A1 |
An abrasive article can include a core and an abrasive component attached to the core. The abrasive component may include a body including a leading end and a trailing end, wherein the leading end has a width greater than a width of the ...
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WO/2023/123603A1 |
Disclosed in the present invention is a wafer post-processing device, comprising a driving mechanism, which vertically clamps a wafer and drives same to rotate; a supply arm, which swings on a side face of the wafer and supplies liquid t...
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WO/2023/123207A1 |
The present invention aims to provide a process method for improving the surface smoothness of a combustion turbine blade profile surface, and is capable of improving the smoothness of a blade profile surface without destroying traces fo...
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WO/2023/127898A1 |
In one embodiment, provided is a polishing liquid composition for a silicon oxide film, the polishing liquid composition being capable of improving the smoothness of a polished substrate surface while maintaining polishing speed. The p...
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WO/2023/130111A1 |
Methods for forming a polycrystalline diamond compact (PDC) drill bit from catalyst-free synthesized polycrystalline diamonds are described. The polycrystalline diamonds are deposited within a mold. In some cases, a matrix body material ...
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WO/2023/127775A1 |
[Problem] To provide a composition which maintains the hydrophilicity and does not lose dispersibility or film properties even in an environment having a thermal history, while being adaptable to the heat generation during polishing. [So...
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WO/2023/119703A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/117745A1 |
The present invention relates to a method of making a diamond composite wherein a diamond green body is together with an infiltrant is placed onto a graphite crucible and wherein the graphite crucible is placed onto a carbon source such ...
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