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Patent Searching and Data


Title:
POLISHING PAD FINISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/131075
Kind Code:
A1
Abstract:
Disclosed in the present invention is a polishing pad finishing apparatus, comprising: a connecting arm that horizontally extends; a finishing head unit, provided at one end of the connecting arm and used for finishing a polishing pad; and a base unit, provided at the other end of the connecting arm, movably connected to the connecting arm, and used for driving the connecting arm to drive the finishing head unit to vertically move up and down, so that the finishing head unit is close to or far away from the polishing pad in a direction tending to be perpendicular to the polishing pad. The present invention can stably achieve uniform and stable positive pressure in a finishing process and ensure the consistency of a polishing finishing process; the apparatus is not a motion amplification mechanism, and can effectively reduce the impact effect of the finishing head unit on the polishing pad in the process of moving to the polishing pad; and no amplification effect is realized, and the consistency of the working station state of the finishing head unit is more easily ensured.

Inventors:
HE HONGXIU (CN)
YANG YUANSI (CN)
ZHOU ZHIPENG (CN)
Application Number:
PCT/CN2022/144028
Publication Date:
July 13, 2023
Filing Date:
December 30, 2022
Export Citation:
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Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
B24B37/04; B24B53/017
Foreign References:
CN114012605A2022-02-08
JPH10217102A1998-08-18
CN108453618A2018-08-28
CN101623849A2010-01-13
CN107350961A2017-11-17
JPH11114803A1999-04-27
Attorney, Agent or Firm:
HANGZHOU KAIZHI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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