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WO/2023/288053A1 |
A sanding pad comprises a laminate structure of a deformable and flexible core layer defining a first surface and an opposing second surface, each said surface having a sandpaper layer affixed thereto, whereby each said sandpaper layer i...
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WO/2023/286478A1 |
[Problem] To provide an elastic polishing material suitable for the surface treatment of a workpiece having a complicated surface shape for a metal working product such as a metal mold or a drill. [Solution] Provided is an elastic polish...
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WO/2023/280363A1 |
For polishing a workpiece (7), such as a pipe elbow, in a polishing machine (100), the workpiece (7) is automatically swivelled through a central polishing area (6) of a rota-tional polishing station (1) after adjustment of the radius of...
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WO/2023/282832A1 |
The present disclosure relates to a grinding apparatus (1) for grinding a concrete surface comprising a base unit (2) comprising a chassi (3) and at least one rotating means (4) at least partially enclosed by said chassi (3). The at leas...
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WO/2023/279443A1 |
The present invention relates to a positioning protection structure for a grinding robot. The present invention relates to the technical field of grinding robots. The positioning protection structure is composed of a grinding placement s...
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WO/2023/283525A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/283582A1 |
Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area ...
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WO/2023/283559A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a motor to generate relative motion between the platen and the c...
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WO/2023/281763A1 |
[Problem] To provide: a differential pressure-eliminating bag that can be used to replace the gas inside of an inert gas circulation-type blasting device with an inert gas while being capable of maintaining a constant pressure inside of ...
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WO/2023/282475A1 |
The present invention relates to: a slurry composition for final polishing of a silicon wafer, which reduces haze and the number of defects in the surface of an object to be polished and has excellent performance; and a final polishing m...
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WO/2023/281461A1 |
A method for treating contaminating and/or contaminated material (1), in particular radioactive material deriving from decommissioning of activated and/or contaminated components of nuclear plants comprises a step of cutting the material...
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WO/2023/283526A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and t...
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WO/2023/283555A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against a polishing surface of the polishing pad, and a motor to generate relative moti...
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WO/2023/281817A1 |
The present invention simplifies the configuration of a device and reduces the footprint, and reduces the size of an accommodation space for a sliced workpiece. This processing device comprises: processing tables 2A, 2B that hold a seale...
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WO/2023/280201A1 |
A manual ingot bonding method for a 12-inch semiconductor wafer, comprising the following preparation steps: S1, marking the circle center of an end face on the end face of a seed crystal end of an ingot (9), and recording same as point ...
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WO/2023/281660A1 |
This dressing device is provided with: a dressing mechanism capable of performing dressing on the grinding groove of a grindstone having a spirally continuous grinding groove; and a control unit for controlling the operation of the dress...
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WO/2022/011402A9 |
The invention relates to a device for sharpening blades (1) comprising: a base (2) with a sharpening means (3); an arm (7) which at one end is mounted on a carrier (5) so as to be pivotable about a pivot axis (6) and which has at least t...
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WO/2023/280872A1 |
A method of additive manufacturing for manufacturing an abrasive article (1) layer-by-layer. The method comprises depositing a layer of slurry (4), wherein the slurry (4) comprises a mixture comprising a liquid and abrasive particles, an...
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WO/2023/278430A1 |
Disclosed herein are components, systems, and methods for accessing and disassembling components of hazardous articles. A cutting head of a fluid jet system generates a fluid jet that exits an outlet toward a workpiece to be cut by the f...
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WO/2023/272366A1 |
This invention refers to a knife sharpening device (200), a knife replacement method and a knife replacement system (100). The knife sharpening device (200) comprises a control board (212) configured to connect an external network to the...
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WO/2023/278703A1 |
A vacuum sander includes a head assembly. A handle attachment is rotatable coupled to a drive to allow selective rotation of the handle attachment relative to the drive and a debris shroud about a first axis. The drive is rotatable relat...
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WO/2023/279053A1 |
Embodiments of sanding systems and methods for using and making the same may include providing a sanding system, comprising a body and a core. The body may be defined by at least a plurality of faces including a proximal face and a dista...
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WO/2023/279064A1 |
An abrasive article can include a body including agglomerated first abrasive particles and unagglomerated second abrasive particles contained in a bond material. The first abrasive particles can include chromium oxide. The second abrasiv...
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WO/2023/277103A1 |
A production method according to the present disclosure comprises: a grinding step in which a group 13 element nitride crystal is contained in an opening of a plate-like carrier, and at least one main surface of the crystal is ground; an...
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WO/2023/273644A1 |
A polishing machine (100), an adjustment tool (200), and a gap adjustment method. The polishing machine (100) comprises: a body (110), at least one working assembly (300), and a pad removal assistance apparatus (400) correspondingly prov...
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WO/2023/279072A1 |
An abrasive article can include a body including a first portion coupled to a second portion in a radial plane. The body can include a central opening extending in an axial direction of the body through the first portion and through the ...
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WO/2023/279024A1 |
An abrasive article including a bonded abrasive body having a certain Homogeneity Factor and a multimodal distribution of abrasive particle sizes where the particles size of a first mode is no greater than 80% of a particle size of a sec...
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WO/2023/272560A1 |
A pure rolling generation grinding machining apparatus for an equal common normal gear helix template, using a dividing table (10-1) to accurately control the angle between oilstone grinding working surfaces (1-1-1) and a base cylinder a...
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WO/2022/271270A1 |
A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structure...
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WO/2022/268614A1 |
This disclosure relates to a rotary abrasive machining tool comprising a hub with a plurality of axially extending radial slots in an outer circumference thereof, and a plurality of abrasive segments, typically polycrystalline diamond, l...
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WO/2022/271596A1 |
A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top p...
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WO/2022/268845A1 |
Disclosed is a method for manufacturing an article (100). The method comprises assembling (202) a green body comprising cemented carbide, the green body further comprising at least one recess. The method further comprises inserting (206)...
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WO/2022/271492A1 |
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein, In particular, embodiments herein relate to a CMP polishing method including urging a ...
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WO/2022/268628A1 |
A method for manufacturing a lens element (10) comprising: - a refraction area (12) having first curvature, - a plurality of optical elements (14) located on at least part of the refraction area (12), wherein the method comprises a step ...
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WO/2022/270175A1 |
A rotatable disc-like grinding stone 5 comprises a convex grinding portion 5b in the outer peripheral portion thereof. The cross-sectional shape of the convex grinding portion 5b passing through a rotational axis 6 of the grinding stone ...
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WO/2022/269307A1 |
The invention relates to a method for cleaning an abrasive belt by means of an air knife extending continuously over the entire working width or by means of a plurality of segmented air knifes, and to a device that surrounds said air kni...
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WO/2022/268261A1 |
The invention relates to a grinding means (1) for grinding workpieces, comprising: a carrier (2), e.g. a carrier disk or a carrier strip, abrasive grains (4) applied to the carrier (2), and a binder (6) applied to the carrier (2). In ord...
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WO/2022/265826A1 |
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing el...
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WO/2022/263993A1 |
Diamond grinding wheel (1), for grinding and abrasion of stratified solid materials comprising a cutting unit (2.1) provided with a diamond crown (2.2) and: - a central tooth (3) adapted to remove plastic material or similar materials, p...
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WO/2022/263986A1 |
A coated abrasive article comprises a backing having a major surface and an abrasive layer disposed on and secured to at least a portion of the major surface of the backing. The abrasive layer comprises a binder material at least partial...
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WO/2022/262199A1 |
A burr removing apparatus for steel structure product machining. An apparatus base is fixedly welded under a machining box body, and a storage drawer is connected to the outer side of the apparatus base in a nested manner. Rectangular gu...
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WO/2022/264687A1 |
Provided is a polishing head that has: a first annular member; a blocking member that blocks an upper surface-side opening of an opening in the first annular member; a membrane that blocks a lower surface-side opening of the opening in t...
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WO/2022/261998A1 |
The present invention relates to an ultra-smooth planarization polishing method and apparatus. The apparatus comprises a base, a Z-axis driving mechanism, a revolution driving mechanism, an autorotation driving mechanism, a dynamic magne...
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WO/2022/261891A1 |
Disclosed is a fine treatment apparatus for an internal gear surface, comprising a base (1) fixedly connected to an abrasive flow device. The base (1) is provided with a port (10) connected to a discharge of the abrasive flow device. The...
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WO/2022/266138A1 |
The invention provides improved slurries for the polishing of hard materials such as those having a Mohs hardness of greater than about 6. Exemplary hard surfaces include sapphire, silicon carbide, silicon nitride, and gallium nitride, a...
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WO/2022/265967A2 |
A method and an apparatus for in-situ monitoring of chemical mechanical planarization (CMP) processes are disclosed. In one aspect, a CMP system includes a carrier configured to retain a substrate, a platen supporting a polishing pad, an...
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WO/2022/262709A1 |
An abrasive belt clamp holder used with a table-type curve saw, the abrasive belt clamp holder comprising a pin-free saw blade (1), wherein a clamp holder main body (2) is connected to each of two ends of the pin-free saw blade, a placem...
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WO/2022/262059A1 |
The present invention relates to the technical field of slender machining processing. Disclosed are a grinding machine for the surface of a slender object and a grinding method of the grinding machine. The slender object is conveyed betw...
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WO/2022/260128A1 |
The present invention proposes a substrate processing system, and a substrate processing method that can prevent deformation and contamination of a surface on the reverse side from a surface to be processed which is the object of process...
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WO/2022/256998A1 |
A drill bit grinding machine, comprising a base (1), a motor box (2) provided on the base, and a motor provided in the motor box. A grinding wheel (3) is provided at an end of an output shaft of the motor; a grinding seat (4) having a gr...
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