Title:
PROCESSING DEVICE AND METHOD FOR MANUFACTURING PROCESSED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/281817
Kind Code:
A1
Abstract:
The present invention simplifies the configuration of a device and reduces the footprint, and reduces the size of an accommodation space for a sliced workpiece. This processing device comprises: processing tables 2A, 2B that hold a sealed substrate W; a first holding mechanism 3 that holds the sealed substrate W to carry the sealed substrate W to the processing tables 2A, 2B; a processing mechanism 4 that cuts and slices the sealed substrate W held on the processing tables 2A, 2B; an accommodating box 5 in which the sealed substrate W sliced by the processing mechanism 4 is dropped and accommodated; a second holding mechanism 6 that holds a product P to carry the product P from the processing tables 2A, 2B to the accommodating box 5; a carrying movement mechanism 7 that extends in the arrangement direction of the processing tables 2A, 2B and the accommodating box 5 and has a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a processing movement mechanism 8 that moves the processing mechanism 4 on a horizontal surface in a first direction along the transfer shaft 71 and in a second direction perpendicular to the first direction.
Inventors:
FUKAI MOTOKI (JP)
KATAOKA SHOICHI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
YAMAMOTO YUKO (JP)
KATAOKA SHOICHI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
YAMAMOTO YUKO (JP)
Application Number:
PCT/JP2022/009929
Publication Date:
January 12, 2023
Filing Date:
March 08, 2022
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B24B27/06; B24B55/06; B26D7/18; H01L21/301
Foreign References:
| JP2017152582A | 2017-08-31 | |||
| JP2013116532A | 2013-06-13 | |||
| JP2019136810A | 2019-08-22 | |||
| JP2018101649A | 2018-06-28 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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