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WO/2023/005257A1 |
A floating non-contact ultrasonic reinforced flexible sub-aperture polishing apparatus and a polishing method therefor. The polishing apparatus comprises a flexible tool (101), a horn (102), an ultrasonic transducer (103), an electricall...
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WO/2023/004961A1 |
An automatic numerical control graphite electrode and joint precision machining detection assembly and packaging line, which is composed of an automatic graphite electrode machining line (1), an automatic truss conveying type graphite jo...
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WO/2023/007938A1 |
The present invention provides a composition for chemical mechanical polishing, the composition enabling high-speed polishing of a silicon nitride film while restraining the speed of the silicon oxide film polishing, the composition also...
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WO/2023/008386A1 |
Provided is a rotary tool 10 to be attached to an output shaft of a power tool, the rotary tool 10 comprising a resin base plate 11 formed in a disc shape from a resin material, and a plurality of grindstone tips 18 disposed along a circ...
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WO/2023/001324A1 |
The invention relates to a production system (11) for grinding a first end face (7) of a tapered roller (1) for a rolling element bearing (2), comprising at least one tapered-roller carrier (3) and a grinding tool (12), wherein the at le...
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WO/2023/000208A1 |
Provided are a band saw blade sandblasting model construction method, a band saw blade sandblasting apparatus and a sandblasting method. During a sandblasting process, an opening number of a first spray gun (41) and a second spray gun (4...
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WO/2023/003625A1 |
Embodiments of the disclosure generally relate to a retaining ring assembly having an annular lower portion, and an annular upper portion. The annular lower portion includes a step feature and an interlocking feature. In some configurati...
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WO/2023/000607A1 |
Provided is an assistive processing apparatus for a special-shaped self-aligning bearing grinding machine for aerospace, comprising a transition disc (2), balance blocks (3), a pressing plate (4), a stop block assembly, and a centering s...
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WO/2023/004269A1 |
A novel pad-in-a-bottle (PIB) technology for advanced chemical-mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of ...
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WO/2023/002829A1 |
Provided is a technology that, when using a top ring, prevents the fitting parts of a band from coming out of a groove. In a top ring 10 of a polishing device 100, an outer circumferential wall 11 of a retainer member 30 and/or an oute...
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WO/2023/003947A1 |
A tool such as a wafer handler or wafer chuck can include a surface having at least one protrusion. A diamond coating is formed from diamond grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coat...
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WO/2023/003724A1 |
Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radial...
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WO/2023/003105A1 |
A brazing system according to an embodiment of the present invention, which is for brazing an object to be bonded to a base material, comprises: a turntable provided with a reception part for receiving the base material and rotatable clo...
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WO/2023/000414A1 |
Disclosed are a method and a device for curvature-adaptive cluster magnetorheological polishing of a free curved surface. The polishing method comprises the following steps: placing a workpiece to be processed in a rotating platform asse...
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WO/2023/283905A1 |
A processing and polishing apparatus for the production of medical instruments, comprising a base (1), a machine table (2), a clamping assembly and an atomizing assembly. The atomizing assembly is provided on the top of the machine table...
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WO/2023/287975A1 |
An orbital sander includes a housing, a drive unit within the housing having an electric motor defining a rotational axis, and a drive shaft coupled for co-rotation with the motor about the rotational axis having a fan rotatably coupled ...
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WO/2023/284233A1 |
A conditioner, a chemical-mechanical polishing device, and a detection method of a conditioner. The conditioner comprises a polishing portion (1) and a driving portion (2), wherein the polishing portion (1) is mounted on the driving port...
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WO/2023/286633A1 |
A metal wire made of tungsten or a tungsten alloy, wherein the number of times before the metal wire is severed when subjected to a fatigue test in accordance with JIS C6821 standard with a maximum stress of 4400 MPa is 20,000 or more.
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WO/2023/287507A1 |
Embodiments provided herein include a system and method for cleaning a first surface of a substrate using a brush carousel assembly. In one embodiment, the brush carousel assembly includes one or more rotatable brush mounting assemblies ...
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WO/2023/288053A1 |
A sanding pad comprises a laminate structure of a deformable and flexible core layer defining a first surface and an opposing second surface, each said surface having a sandpaper layer affixed thereto, whereby each said sandpaper layer i...
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WO/2023/286478A1 |
[Problem] To provide an elastic polishing material suitable for the surface treatment of a workpiece having a complicated surface shape for a metal working product such as a metal mold or a drill. [Solution] Provided is an elastic polish...
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WO/2023/280363A1 |
For polishing a workpiece (7), such as a pipe elbow, in a polishing machine (100), the workpiece (7) is automatically swivelled through a central polishing area (6) of a rota-tional polishing station (1) after adjustment of the radius of...
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WO/2023/282832A1 |
The present disclosure relates to a grinding apparatus (1) for grinding a concrete surface comprising a base unit (2) comprising a chassi (3) and at least one rotating means (4) at least partially enclosed by said chassi (3). The at leas...
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WO/2023/279443A1 |
The present invention relates to a positioning protection structure for a grinding robot. The present invention relates to the technical field of grinding robots. The positioning protection structure is composed of a grinding placement s...
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WO/2023/283525A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/283582A1 |
Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area ...
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WO/2023/283559A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a motor to generate relative motion between the platen and the c...
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WO/2023/281763A1 |
[Problem] To provide: a differential pressure-eliminating bag that can be used to replace the gas inside of an inert gas circulation-type blasting device with an inert gas while being capable of maintaining a constant pressure inside of ...
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WO/2023/282475A1 |
The present invention relates to: a slurry composition for final polishing of a silicon wafer, which reduces haze and the number of defects in the surface of an object to be polished and has excellent performance; and a final polishing m...
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WO/2023/281461A1 |
A method for treating contaminating and/or contaminated material (1), in particular radioactive material deriving from decommissioning of activated and/or contaminated components of nuclear plants comprises a step of cutting the material...
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WO/2023/283526A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and t...
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WO/2023/283555A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against a polishing surface of the polishing pad, and a motor to generate relative moti...
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WO/2023/281817A1 |
The present invention simplifies the configuration of a device and reduces the footprint, and reduces the size of an accommodation space for a sliced workpiece. This processing device comprises: processing tables 2A, 2B that hold a seale...
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WO/2023/280201A1 |
A manual ingot bonding method for a 12-inch semiconductor wafer, comprising the following preparation steps: S1, marking the circle center of an end face on the end face of a seed crystal end of an ingot (9), and recording same as point ...
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WO/2023/281660A1 |
This dressing device is provided with: a dressing mechanism capable of performing dressing on the grinding groove of a grindstone having a spirally continuous grinding groove; and a control unit for controlling the operation of the dress...
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WO/2022/011402A9 |
The invention relates to a device for sharpening blades (1) comprising: a base (2) with a sharpening means (3); an arm (7) which at one end is mounted on a carrier (5) so as to be pivotable about a pivot axis (6) and which has at least t...
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WO/2023/280872A1 |
A method of additive manufacturing for manufacturing an abrasive article (1) layer-by-layer. The method comprises depositing a layer of slurry (4), wherein the slurry (4) comprises a mixture comprising a liquid and abrasive particles, an...
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WO/2023/278430A1 |
Disclosed herein are components, systems, and methods for accessing and disassembling components of hazardous articles. A cutting head of a fluid jet system generates a fluid jet that exits an outlet toward a workpiece to be cut by the f...
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WO/2023/272366A1 |
This invention refers to a knife sharpening device (200), a knife replacement method and a knife replacement system (100). The knife sharpening device (200) comprises a control board (212) configured to connect an external network to the...
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WO/2023/278703A1 |
A vacuum sander includes a head assembly. A handle attachment is rotatable coupled to a drive to allow selective rotation of the handle attachment relative to the drive and a debris shroud about a first axis. The drive is rotatable relat...
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WO/2023/279053A1 |
Embodiments of sanding systems and methods for using and making the same may include providing a sanding system, comprising a body and a core. The body may be defined by at least a plurality of faces including a proximal face and a dista...
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WO/2023/279064A1 |
An abrasive article can include a body including agglomerated first abrasive particles and unagglomerated second abrasive particles contained in a bond material. The first abrasive particles can include chromium oxide. The second abrasiv...
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WO/2023/277103A1 |
A production method according to the present disclosure comprises: a grinding step in which a group 13 element nitride crystal is contained in an opening of a plate-like carrier, and at least one main surface of the crystal is ground; an...
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WO/2023/273644A1 |
A polishing machine (100), an adjustment tool (200), and a gap adjustment method. The polishing machine (100) comprises: a body (110), at least one working assembly (300), and a pad removal assistance apparatus (400) correspondingly prov...
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WO/2023/279072A1 |
An abrasive article can include a body including a first portion coupled to a second portion in a radial plane. The body can include a central opening extending in an axial direction of the body through the first portion and through the ...
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WO/2023/279024A1 |
An abrasive article including a bonded abrasive body having a certain Homogeneity Factor and a multimodal distribution of abrasive particle sizes where the particles size of a first mode is no greater than 80% of a particle size of a sec...
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WO/2023/272560A1 |
A pure rolling generation grinding machining apparatus for an equal common normal gear helix template, using a dividing table (10-1) to accurately control the angle between oilstone grinding working surfaces (1-1-1) and a base cylinder a...
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WO/2022/271270A1 |
A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structure...
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WO/2022/268614A1 |
This disclosure relates to a rotary abrasive machining tool comprising a hub with a plurality of axially extending radial slots in an outer circumference thereof, and a plurality of abrasive segments, typically polycrystalline diamond, l...
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WO/2022/271596A1 |
A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top p...
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