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WO/2023/074819A1 |
[Problem] To provide a removal method that makes it possible to remove laminated material from a silicon wafer surface very efficiently and inexpensively with a simple device, without negative effects on the environment and without causi...
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WO/2023/070710A1 |
Disclosed in the present disclosure is a polishing device for bearing production, comprising a bottom plate and a double shaft motor. An inner polishing assembly is mounted at one end of an output shaft of the double shaft motor, and the...
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WO/2023/073330A1 |
A method for manufacturing a dental or medical tool the method comprising the steps of positioning a p re-fluted blank (14) including a stem (24) and a shank (22) within a machine (30), using a probe to identify a position and/or an orie...
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WO/2023/072451A1 |
The invention relates to a method for determining a position of an optical waveguiding core body (1) of an optical waveguide (10) to be machined on a numerically controlled machine tool (100), wherein the optical waveguide (10) comprises...
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WO/2023/070152A1 |
Disclosed herein is an apparatus for continuous removal of particles from a mixture of air and particles, the apparatus comprising: a separating means being configured to remove particles from the mixture of air and particles and to disc...
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WO/2023/074963A1 |
The present invention relates to an apparatus for processing a side surface of a display glass substrate, the apparatus enabling an optimal processing orientation of a glass substrate introduced to a work position to be maintained when a...
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WO/2023/074027A1 |
The purpose of the present disclosure is to provide polishing control in which propagation loss of an optical fiber which was laterally polished is equalized, by providing a function for monitoring the propagation loss of the optical fib...
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WO/2023/070189A1 |
A dental apparatus for generating a jet of gas mixed with solid powder particles, comprised of a hand piece connected to a powder feeder, and attached by a supply cable to a source of electricity, compressed gas and liquid. The tip of th...
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WO/2023/074231A1 |
The present invention relates to a polishing device and a polishing method. This polishing device comprises a holding stage (4), a polishing head (14), and a control device (1). The control device (1) comprises a determination unit (1d) ...
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WO/2023/076100A1 |
The invention provides methodology for final finishing of hard surfaces such as diamond surfaces. In this method, a smooth pad having a surface roughness of about 0.2 nm to about 100 nm, having, for example a thickness ranging from about...
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WO/2023/075759A1 |
A workpiece centering gauge for a grinding machine includes a link having a first pivot configured to couple with the grinding machine; a first encoder that measures an angle of the link at the first pivot; a second pivot included with t...
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WO/2023/073249A1 |
A workpiece holding head (10) has a housing (50), in/on which a holding arrangement (48) and a support arrangement (49) for an optical workpiece (14) are accommodated. The holding arrangement has a rubber-elastic sealing sleeve (52) whic...
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WO/2023/073951A1 |
The purpose of the present disclosure is to provide polishing control in which propagation loss of an optical fiber which was laterally polished is equalized, by providing a function for monitoring the propagation loss of the optical fib...
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WO/2023/069198A1 |
The present disclosure provides a new corrosion control chemistry for use in ruthenium (Ru) chemical -mechanical polishing (CMP) processes. More specifically, the present disclosure provides an improved CMP slurry chemistry and CMP proce...
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WO/2023/067214A1 |
The present invention relates to an electrolytic medium for electropolishing and electropolishing method with said medium, the electrolytic medium comprising solid electrolyte particles comprising: solid particles able to retain liquid, ...
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WO/2023/066880A1 |
The invention relates to a method for determining the shape of a bezel (16) of an eyeglass frame rim (11), comprising: - a step of acquiring the shape of a longitudinal contour of the bezel, - a step of calculating or pointing out a posi...
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WO/2023/069583A1 |
A metering valve for introducing media into a pressurized fluid includes media passaging having a media inlet for receiving media and a media outlet for dispensing media toward the pressurized fluid. The media passaging defines a flow pa...
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WO/2023/068848A1 |
A surface inspection device for a steel plate is disclosed. The surface inspection device for a steel plate, according to an embodiment of the present invention, may be provided to comprises: a grinding unit which includes a grindstone f...
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WO/2023/069160A1 |
Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that ...
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WO/2023/068164A1 |
Problem: To provide a method for manufacturing a sliding member, a method for manufacturing a damper, a sliding member, a damper, and a method for adjusting ride comfort that improve retention of lubricant oil between sliding members whi...
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WO/2023/066310A1 |
Disclosed are a device and method for rail web rust removal before steel rail welding. The device comprises a rust removal power apparatus and a grinding and rust removal apparatus; the grinding and rust removal apparatus comprises a rus...
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WO/2023/066179A1 |
A deburring mechanism and a deburring assembly. The deburring mechanism comprises a frame (1), a first deburring set (21) and a second deburring set (22). The frame (1) has a first side plate (11) and a second side plate (12), and the fi...
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WO/2023/069623A1 |
An abrasive backing is generally provided. In some embodiments, the abrasive backing includes a base sheet, comprising wood fibers, synthetic fibers, cellulose filaments, a saturant, wherein the saturant includes two or more latex polyme...
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WO/2023/066824A1 |
Disclosed is a retainer (10) for processing optical workpieces each having two workpiece surfaces and a workpiece rim therebetween. The retainer comprises a holding assembly (72) and a support assembly (73) for the workpiece. A rubber-el...
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WO/2023/068124A1 |
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holdi...
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WO/2023/063536A1 |
The present invention relates to: an exterior panel for home appliances, having excellent reflectivity and durability and being applicable to the exterior of various home appliances; a home appliance comprising the exterior panel; and an...
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WO/2023/060403A1 |
A method and an electronic device for controlling a robotic system. The method comprises obtaining scanned data about a first junction and a second junction for welding a body frame and a roof of a bus (410), the first and second junctio...
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WO/2023/063166A1 |
Provided is a grinding device whereby the position of a workpiece surface to be processed can be efficiently and precisely measured without advance preparation such as NC program creation. The present invention has a workpiece table (1...
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WO/2023/064674A1 |
A grinding bit is provided. The grinding bit includes a shank having a central axis and a cutting body. The shank further includes a first shank end and a second shank end opposite to the first shank end. The first shank end is configure...
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WO/2023/063213A1 |
[Problem] For the purpose of eliminating bumps in the peripheries of laser marks in a wafer polishing process, the present invention provides: a polishing composition that provides a flat polished surface; and a method for polishing a wa...
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WO/2023/062334A1 |
There is provided a method of making a drill bit (10: 20) comprising a base portion (12:22) and a cutting portion (14: 24), the method comprising providing the base portion (12: 22) and the cutting portion (14: 24) as separate pieces, he...
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WO/2023/062866A1 |
This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of...
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WO/2023/062973A1 |
In a processing machine 1, a Z-axis electric motor 39 moves a main shaft 37 in a Z direction. A Z-axis position sensor 69 detects a position of the main shaft 37 in the Z direction. A rotation sensor 71 detects rotation of the main shaft...
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WO/2023/061140A1 |
A sanding machine, comprising an airflow element (11), a motor (51), and a battery pack. The airflow element (11) can rotate around a central axis (102) along a preset rotation direction to generate a chip removal airflow; the motor (51)...
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WO/2023/061510A1 |
A grinding method, being used for grinding at least one intersecting line in a valve cavity. The grinding method comprises: obtaining coordinates of M first sampling points on one intersecting line in the at least one intersecting line; ...
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WO/2023/058285A1 |
An information processing device (5) comprises: an information acquisition part (500) for acquiring crack generation state information that includes crack state information indicating a crack state at a time when crack has been generated...
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WO/2023/057838A1 |
A surface conditioning article comprises: a fabric backing having first and second opposed major sides; a lofty open nonwoven fiber web comprising entangled fibers disposed on and secured to the first major side of the fabric backing; an...
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WO/2023/058852A1 |
According to one embodiment, an electronic device housing comprises a metal frame, wherein the surface of the metal frame has a gloss value of 1 to 10 gloss unit (Gu), the maximum height in a plurality of uneven parts arranged on the sur...
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WO/2023/056704A1 |
An electric cleaning apparatus, in particular a cleaning disc for such an electric cleaning apparatus, which aims to solve the problems in the prior art of uneven water output of a cleaning disc of a cleaning apparatus and a small water ...
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WO/2023/058107A1 |
A machining device (1, 201) for machining a workpiece (W), which is supported by a workpiece supporting member (20, 30, 40, 60, 220, 230, 240), with a tool (T, T2), the machining device (1, 201) comprising a processing unit (3, 203) that...
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WO/2023/059999A1 |
The present invention discloses Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems that offer high and tunable Oxide: SiN and Oxide: Poly-Si removal selectivity, and low oxi...
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WO/2023/058751A1 |
The present invention reliably suctions a substrate regardless of the flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for suct...
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WO/2023/056324A1 |
Synthesis of triazole- and/or triazolium-based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising triazole- and/or triazolium-based polymers; and wa...
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WO/2023/054386A1 |
Provided is a polishing composition that makes it possible to achieve an excellent polishing removal speed with respect to a polished object while improving the surface quality of a polished surface after polishing. The polishing composi...
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WO/2023/050451A1 |
A base (25) for a sheet sander (10) including a baseplate (30) and a guide (60, 65). The baseplate (30) has an upper side and a lower side opposite the upper side, and the upper side defines a guide mount (40, 45). The guide (60, 65) is ...
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WO/2023/054385A1 |
The purpose of the present invention is to provide a polishing composition which can achieve an excellent polishing/removal rate for an object of interest. Provided is a polishing composition which is intended to be used for the polishin...
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WO/2023/052918A1 |
An apparatus (100) for removing an abrasive element (20) having a perimeter edge (26) delimiting an abrasive surface (22) in a machine (1) for finishing surfaces comprising a support body (10) for removably engaging the abrasive element ...
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WO/2023/056432A1 |
An abrasive article with a bonded abrasive body having a ratio of diameter to thickness of at least 10:1. The abrasive article can include secondary abrasive particles contained in a bond material, wherein the secondary abrasive particle...
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WO/2023/053476A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/053105A1 |
A pipe coating material removal apparatus, comprising a support frame, a subframe, and one or more coating material removal members. The subframe is supported by the support frame and is configured to rotate relative to the support frame...
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