Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/054386
Kind Code:
A1
Abstract:
Provided is a polishing composition that makes it possible to achieve an excellent polishing removal speed with respect to a polished object while improving the surface quality of a polished surface after polishing. The polishing composition contains sodium permanganate as an oxidizing agent. The polishing composition either contains abrasive grains A having a Mohs hardness of less than 8 as abrasive grains or does not contain abrasive grains. The polishing composition can even be suitably applied when polishing a polished object formed from a high-hardness material with a Vickers hardness of 1500 Hv or more.
Inventors:
MORI YOSHIO (JP)
NAKAGAI YUICHIRO (JP)
ODA HIROYUKI (JP)
NAKAGAI YUICHIRO (JP)
ODA HIROYUKI (JP)
Application Number:
PCT/JP2022/035995
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; C09G1/04; H01L21/304
Domestic Patent References:
| WO2013054883A1 | 2013-04-18 | |||
| WO2016084561A1 | 2016-06-02 | |||
| WO2017212971A1 | 2017-12-14 | |||
| WO2019138846A1 | 2019-07-18 | |||
| WO2016072370A1 | 2016-05-12 |
Foreign References:
| JP2016092246A | 2016-05-23 | |||
| US20210238448A1 | 2021-08-05 | |||
| JP2021162177A | 2021-10-11 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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