Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/054385
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing composition which can achieve an excellent polishing/removal rate for an object of interest. Provided is a polishing composition which is intended to be used for the polishing of an object of interest. The polishing composition contains water and sodium permanganate that acts as an oxidizing agent. In some preferred aspects, the polishing composition further contains a metal salt selected from salts each composed of a cation containing a metal belonging to any one of Group 3 to Group 16 on the periodic table and an anion. The polishing composition can be preferably applied to the polishing of an object of interest that is composed of a high-hardness material having a Vickers Hardness of 1500 Hv or more.
Inventors:
MORI YOSHIO (JP)
NAKAGAI YUICHIRO (JP)
ODA HIROYUKI (JP)
NAKAGAI YUICHIRO (JP)
ODA HIROYUKI (JP)
Application Number:
PCT/JP2022/035994
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; C09G1/04; H01L21/304
Domestic Patent References:
| WO2013054883A1 | 2013-04-18 | |||
| WO2016084561A1 | 2016-06-02 | |||
| WO2017212971A1 | 2017-12-14 | |||
| WO2019138846A1 | 2019-07-18 | |||
| WO2016072370A1 | 2016-05-12 |
Foreign References:
| JP2016092246A | 2016-05-23 | |||
| US20210238448A1 | 2021-08-05 | |||
| JP2021162176A | 2021-10-11 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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