Title:
CUTTING DEVICE, AND METHOD FOR MANUFACTURING CUT PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/062866
Kind Code:
A1
Abstract:
This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of the dressing board. The control unit is configured to control the imaging unit to image a plurality of first regions of the dressing board in order, and, on the basis of imaging results of the imaging unit, determine whether or not there is a cut line in each of the plurality of first regions. Two first regions adjacent to each other among the plurality of first regions are spaced apart from each other with a second region therebetween. The control unit, on the basis of whether or not there is a cut line in each of the plurality of first regions, decides whether or not it is necessary to determine whether or not there is a cut line in the second region.
Inventors:
SAKAMOTO SHINJI (JP)
Application Number:
PCT/JP2022/022616
Publication Date:
April 20, 2023
Filing Date:
June 03, 2022
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B24B53/00; B24B27/06; B24B49/12; B24B53/12; H01L21/301
Foreign References:
| JP2011009652A | 2011-01-13 | |||
| JP2021142616A | 2021-09-24 | |||
| JP2016203352A | 2016-12-08 | |||
| JP2021013984A | 2021-02-12 | |||
| JP2013022713A | 2013-02-04 | |||
| JP2015164750A | 2015-09-17 | |||
| JP2017168575A | 2017-09-21 | |||
| JP2014135424A | 2014-07-24 |
Attorney, Agent or Firm:
FUJIWARA Satoshi et al. (JP)
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