Title:
ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/058852
Kind Code:
A1
Abstract:
According to one embodiment, an electronic device housing comprises a metal frame, wherein the surface of the metal frame has a gloss value of 1 to 10 gloss unit (Gu), the maximum height in a plurality of uneven parts arranged on the surface has a range of 0.1 to 2.3 ㎛, the maximum depth of troughs between the plurality of uneven parts has a range of 0.1 to 1.8 ㎛, and the number of the plurality of uneven parts per unit area of 1 cm2 has a range of 90 to 200.
Inventors:
KIM HYUNSOO (KR)
KIM GOEUN (KR)
KIM INKYU (KR)
PARK HYESUN (KR)
LEE HEESUNG (KR)
HEO YOUNGJUN (KR)
JUNG YOUNGSOO (KR)
KIM GOEUN (KR)
KIM INKYU (KR)
PARK HYESUN (KR)
LEE HEESUNG (KR)
HEO YOUNGJUN (KR)
JUNG YOUNGSOO (KR)
Application Number:
PCT/KR2022/010323
Publication Date:
April 13, 2023
Filing Date:
July 15, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/04; B24C3/08; C23F1/32
Foreign References:
| KR20200035861A | 2020-04-06 | |||
| KR20120057645A | 2012-06-05 | |||
| JP2010084198A | 2010-04-15 | |||
| KR20140006220A | 2014-01-16 | |||
| KR20140014044A | 2014-02-05 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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