Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/058285
Kind Code:
A1
Abstract:
An information processing device (5) comprises: an information acquisition part (500) for acquiring crack generation state information that includes crack state information indicating a crack state at a time when crack has been generated on a substrate and device state information indicating the state of a polishing unit at a time when a substrate treatment process has been performed on the substrate; and a crack generation step identification part (501) for identifying a step that is the cause of the generation of crack on the substrate, by inputting the crack generation state information acquired by the information acquisition part (500) in accordance with the generation of crack on the substrate to a learning model (11) trained by machine learning of correlations each between crack generation state information and crack generation step information indicating a step that is among the steps included in the substrate treatment process and that is a cause of the generation of crack on the substrate.
Inventors:
MURATA SEIJI (JP)
Application Number:
PCT/JP2022/027180
Publication Date:
April 13, 2023
Filing Date:
July 11, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/005; B24B49/12; H01L21/02; H01L21/677
Foreign References:
| JP2020150155A | 2020-09-17 | |||
| JP2007115870A | 2007-05-10 | |||
| JP2016207868A | 2016-12-08 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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