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WO/2022/261011A1 |
The present disclosure provides a system for vertical deployment of leaching lines onto a slope of a mine leach pad. The system includes an elevated guidewire having a first end disposed at a top of the slope and a second end disposed at...
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WO/2022/259913A1 |
The present invention relates to techniques for calculating polishing rate responsiveness with respect to a change in the pressure with which a workpiece used for manufacturing a semiconductor device, such as a wafer, a substrate, or a p...
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WO/2022/259927A1 |
An electroplated wire (1) for a saw wire comprises a core wire (10) formed from tungsten or a tungsten alloy. The tensile strength of the electroplated wire (1) for a saw wire is 4800 MPa or greater. The straightness per 500 mm length of...
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WO/2022/256971A1 |
A milling cutter grinding machine, relating to the technical field of machinery, and comprising a machine body (1) and a motor mounted in the machine body (1). A grinding housing (2) and a mounting base (3) are arranged at the top of the...
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WO/2022/258983A1 |
The invention relates to a sub-aperture polishing tool, comprising a support member including an attachment feature for attachment to a sub-aperture polishing machine. At an end of the support member is a polishing head comprising: a bas...
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WO/2022/261190A1 |
The present invention provides a grinder including a housing, a drive assembly within the housing including an electric motor having a motor shaft, and an output spindle coupled to the motor shaft for rotatably driving a grinding tool. T...
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WO/2022/257489A1 |
A double-sided polishing method for an optical lens, where simultaneous polishing of upper and lower surfaces of a lens is implemented by means of arranging grinding tools at locations above and below the lens, and the grinding tools fit...
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WO/2022/257964A1 |
An active fluid jet polishing method having revolution and rotation functions. In the polishing process, a polishing liquid (5) having constant pressure passes through an eccentric nozzle of a polishing tool head (1). Under the action of...
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WO/2022/260737A1 |
Blends of abrasive media are described that can be propelled via a pressurized air stream into a surface to remove contaminants or other undesired material from the surface. In addition to other advantageous properties, the disclosed abr...
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WO/2022/257234A1 |
A cylinder grinding device and method, and a recording medium, relating to the technical field of grinding devices. The cylinder grinding device comprises a conveying disc and a conveying mechanism. The conveying disc is disposed in a gr...
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WO/2022/258973A1 |
This invention relates to a method of cleaning a railhead using a high pressure water abrasive slurry system.
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WO/2022/258940A1 |
There is provided a blade for an oscillating power tool comprising an elongate body fixed to an attachment section, wherein the elongate body is divided into two or more resiliently flexible tongue portions, each tongue portion comprisin...
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WO/2022/259813A1 |
In the present invention, the optimal value for an inter-plate distance is calculated on the basis of relationship data indicating the relationship between the flatness of a workpiece and an inter-plate distance which is the distance bet...
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WO/2022/259833A1 |
The present invention improves uniformity of a supply range of a polishing liquid when supplying the polishing liquid while moving, over a polishing pad, a polishing liquid supply head having a plurality of polishing liquid supply ports....
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WO/2022/256059A1 |
The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer ...
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WO/2022/256175A1 |
In one embodiment, a method is provided for polishing a substrate, The method generally includes receiving a plurality of dwell times of a pad conditioning disk, wherein the plurality of dwell times are to be used in a pad conditioning p...
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WO/2022/254105A1 |
The invention relates to a method for blind cutting, by water jets, of a motor case of an aerospace vehicle, the method comprising a plurality of passes (210, 230) of a high-pressure water jet along the same cutting path travelling acros...
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WO/2022/253627A1 |
The invention relates to a method comprising: - detecting (S3), using an optical sensor, an intrinsic optical feature of a lens member to be positioned on a manufacturing apparatus configured to apply an optical lens manufacturing operat...
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WO/2022/252253A1 |
A centering non-deformation hole grinding pitch circle clamp, comprising a clamp body (1); an inner cam (2) is centeringly assembled on the clamp body (1), and a plurality of centering spigots (3) and positioning curved surfaces (4) are ...
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WO/2022/255573A1 |
The present invention relates to a grinding disc to be attached to/detached from an electric grinder with high attachment efficiency and, more specifically, to a grinding disc configured to be attached to/detached from an electric grinde...
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WO/2022/253711A1 |
The invention relates to a grinding tool (1; 40; 50) which can be rotatably driven about an axis of rotation (R), comprising: a grinding belt (13) which is wound in a spiral form with a plurality of superimposed layers (L) about the axis...
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WO/2022/254856A1 |
The present invention provides a double-side polishing device for a workpiece that, during double-side polishing, can end the double-side polishing at a timing at which the shape of the entire workpiece and the outer circumferential port...
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WO/2022/252293A1 |
Disclosed is a gear-machining surface grinding device, the device comprising a bottom plate and a top cover, wherein a top housing is mounted on the top of the bottom plate, and a center line of the top housing and a center line of the b...
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WO/2022/256221A1 |
Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrat...
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WO/2022/253572A1 |
The present invention relates to a tool insert for manufacturing an object using an injection-moulding process, the proposed injection-moulding tool comprising an insert frame and at least one laminated core comprising a plurality of ind...
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WO/2022/256157A1 |
A method and apparatus for determining a polishing pad thickness profile are described herein. A set of displacement sensors, including an arm displacement sensor and one or more conditioning disk displacement sensors are utilized to det...
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WO/2022/253571A1 |
The present invention relates to a grinding plate for a grinding disk of a grinding machine, the grinding plate comprising a main body and a hook-and-loop layer having hooks. The main body of the proposed grinding plate comprises a fibre...
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WO/2022/255924A1 |
The invention relates to a steady rest (1) for supporting an elongated workpiece (2), comprising a middle arm (4) moveable in its axial direction by a power means and two pivotally movable outer arms (5, 6). An arrangement provides a sep...
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WO/2022/254841A1 |
The present invention pertains to a double-side polishing method characterized by performing, on a wafer, first polishing using a slurry of an abrasive grain having a degree of association of less than 1.0, which is given by (volume-base...
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WO/2022/256465A1 |
Exemplary semiconductor processing systems may include a substrate support defining an aperture therethrough. The processing systems may include a light assembly having a light source that emits an optical signal that is directed toward ...
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WO/2022/251822A1 |
A brush assembly for a floor machine. The brush includes a base having a annular moat, and a plurality of cleaning element set within the annular moat and secured to the base. The moat may include a plurality of pocket sets for receiving...
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WO/2022/250208A1 |
An embodiment of the present invention provides a method for processing a wafer, the method comprising the steps of: preparing a wafer that has a notch portion formed on one side thereof; aligning the wafer by analyzing image information...
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WO/2022/251798A1 |
A tool for a floor machine. The tool includes a base having a plurality of slots, and a cleaning element provided in each of the slots. The cleaning elements are oriented along a secant or chord of the base. The cleaning elements have ab...
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WO/2022/249135A1 |
The present disclosure relates to polyurethanes comprising a reaction product of a reactive mixture including a polyol having a number average molecular weight of at least 400 Daltons, a diol chain extender having a molecular weight less...
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WO/2022/249787A1 |
According to the present invention, the wear amount of a polishing pad is measured using a simple structure. This substrate processing device 1000 comprises: a table 100 for supporting a substrate WF having a surface to be polished tha...
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WO/2022/251274A1 |
A workpiece separator system including a gripper, a heat source in thermal communication with the gripper, the heat source configured to heat a block of the workpiece causing separation of an alloy puck from the block. A method for separ...
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WO/2022/246858A1 |
An elevator accessory polishing device having a high automation degree, relating to the field of mechanical accessory polishing devices. The elevator accessory polishing device comprises a main plate (1), wherein several placing seats (2...
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WO/2022/243632A1 |
The invention relates to a sandblasting nozzle (1) comprising: * a first fluid supply pipe (2) comprising a fluid inlet (201) and a fluid outlet (202), said fluid outlet (202) comprising a first outlet port (6), and * a second sandblasti...
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WO/2022/245404A1 |
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composi...
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WO/2022/243619A1 |
The invention relates to equipment (100) for treating an annular component (10) of an aircraft turbomachine, having: a support (110) of elongate shape along an axis (X), the support comprising, at one of its ends, a mount (111) configure...
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WO/2022/246157A1 |
Determining a thickness of a layer on a wafer during a semiconductor process may include executing the process on the layer on the wafer; monitoring the wafer during the process with an in-situ spectrographic monitoring system to generat...
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WO/2022/241982A1 |
A trimming head rotating component, a polishing pad trimming head (201), and a trimmer (301). An inner ring lower gland (7) is provided in a cavity formed between a transmission film (6) and a grinding base (10), and a universal transmis...
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WO/2022/242327A1 |
An angle grinder, comprising: a housing; an electric motor supported by the housing; a switch component for controlling the starting of the electric motor; and an operation component for operating to trigger the switch component. The swi...
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WO/2022/243453A1 |
This disclosure relates to a cutting assembly comprising a disc cutter and a quick-change module for rapid replacement of the disc cutter.
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WO/2022/244421A1 |
The present invention relates to a method for producing a silicon wafer in which a silicon ingot is cut using a wire saw or a band saw to produce a main surface A and a main surface B, the method having a first cutting step for performin...
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WO/2022/244794A1 |
This method for processing a semiconductor wafer comprises: a step in which a semiconductor wafer comprising a body section and a rim section having a protruding section with a greater thickness than the body section is prepared; a step ...
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WO/2022/244617A1 |
Provided is a method for producing a resin member for a production process of electronic devices which makes it possible to suppress, for a long period of time, adhesion of an adhering substance on a surface. A method for producing a res...
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WO/2022/243623A1 |
One aspect of the invention relates to a method for treating a surface of a rod (21) of a piston (2), the rod being made of high mechanical strength alloy with a minimum hardness above 45 HRC, characterized in that it comprises the follo...
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WO/2022/241884A1 |
Disclosed in the present invention is a scheduling robot for industrial manufacturing, comprising a base and a steel pipe body. A fixed frame is fixedly connected at the top of the base; an inner wall on one side of the fixed frame is pr...
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WO/2022/243633A1 |
The invention relates to a blasting system (40) for a sandblasting device comprising: • a first sandblasting nozzle (1) comprising a first outlet port (11) and configured to blast a first sandblasting jet from the first outlet port (11...
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