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WO/2022/199939A1 |
The method and the device are used for processing a shaft (16) of an apparatus (20) which supports the shaft (16) in rotation. The device is provided with a drive unit (32) which can be attached to the apparatus (20) and has a drive elem...
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WO/2022/201648A1 |
[Problem] To provide a workpiece holding device with which it is possible to precisely process a workpiece. [Solution] A holding unit 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W being pr...
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WO/2022/196786A1 |
Provided are a method for manufacturing a GaAs wafer having excellent OF orientation stability even for a GaAs wafer having an off angle, and a GaAs wafer group. A method for manufacturing a GaAs wafer, including: a polishing step for pe...
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WO/2022/196132A1 |
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor sub...
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WO/2022/193050A1 |
A transmission mechanism for toy production, comprising a toy transmission platform (1). A transmission rail side frame I (2) is fixedly mounted on the left side of the top of the toy transmission platform (1), a transmission rail side f...
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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2022/195493A1 |
A polishing and/or sanding head (9) comprises: a primary disc (10) which is axially hollow; a rotating shaft (12) which is rotatably received in the internal cavity of the primary disc (10) and designed in such a way as to receive a rota...
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WO/2022/197347A1 |
A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is pos...
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WO/2022/057945A9 |
An engagement and release device having a range of motion, and an angle grinder having same. The engagement and release device comprises a first movable device (7), a displacement buffer assembly, and a second movable device (10). The di...
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WO/2022/196050A1 |
The digital projector according to an embodiment includes: a light source for irradiating a workpiece with light; a low-magnification camera mechanism for imaging a projected image of the workpiece produced by being irradiated by the lig...
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WO/2022/195907A1 |
[Problem] To provide an apparatus for machining a brittle plate and a method for machining a brittle plate, with which it is possible to reduce the effort and time required for manually aligning a machining wheel with a brittle plate aft...
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WO/2022/196631A1 |
Provided are a polishing head and a polishing treatment device with which uneven polishing of a substrate surface being polished, such as partial insufficient polishing or over-polishing, is prevented, with which a further improvement in...
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WO/2022/195931A1 |
The present invention automatically replaces a holding plate for holding a workpiece and is provided with: a processing mechanism 4 that performs processing on a sealed board W; a plate reception part 24 that receives a holding plate M1 ...
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WO/2022/197132A1 |
A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped...
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WO/2022/194511A1 |
The invention relates to a method for cleaning a surface, more particularly a surface of an optical element, comprising: providing a liquefied gas (31) in the form of liquefied CO2; producing a solid in the form of CO2 snow from the liqu...
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WO/2022/188555A1 |
A multifunctional electric tool. The tool comprises a tool drive mechanism, which can move around the axis of an output shaft and comprises at least one hanging and fastening device, a clamping device and a locking device, wherein the ha...
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WO/2021/213174A9 |
Disclosed in some embodiments of the present application are a polishing head management system and method. In the present application, the polishing head management system comprises a storage device, a pick-and-place device, and a data ...
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WO/2022/189569A1 |
A guard for a rotatable wheel of a power tool is disclosed. The guard comprises a shroud which is configured to partially enclose the wheel and a port disposed at a circumferential position on the shroud, via which debris generated by th...
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WO/2022/192412A1 |
Knife sharpener systems and methods are provided. In one exemplary embodiment, a knife sharpening system can include a support structure configured to hold a knife having a handle and a blade extending therefrom, and a carriage assembly ...
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WO/2022/189104A1 |
The invention relates to a method for separating or recovering materials from electrodes, comprising the steps of: - providing a substrate, in particular an electrode substrate, to which a coating has been applied; - at least partially s...
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WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
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WO/2022/191229A1 |
The present invention provides a temporary fixing agent and a temporary fixing product comprising the temporary fixing agent. The present invention is a temporary fixing agent used to temporarily fix a member to be polished, wherein the ...
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WO/2022/192234A1 |
A venturi cartridge regulating device for an air-particle dispensing system is provided, which is designed to be pre-assembled and installed in a chamber capable of atmospheric pressurization to regulate the required proportions of air a...
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WO/2022/188055A1 |
The present invention relates to a method for manufacturing a glass wafer of high quality, a glass wafer, which preferably can be or is manufactured by such a method, a glass part ele-ment, which preferably is or can be a part of such a ...
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WO/2022/187880A1 |
The invention relates to a device for machining panels, in particular a device for seaming glass panes, having a grinding head (4) which comprises a rotary drive and a grinding means (5) that can be rotatably driven thereby about a rotat...
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WO/2022/192871A1 |
An abrasive article comprises an abrasive portion having annular shape defined by an inner annular surface, the abrasive portion including abrasive particles contained in a bond material, and wherein the abrasive portion comprises at lea...
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WO/2022/189169A1 |
The invention relates to a method and a device for grinding a stamping cover (906) of a sheet-processing machine (01), the sheet-processing machine (01) having at least one stamping unit (900) with at least one stamping cylinder (901) an...
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WO/2022/189352A1 |
The invention relates to a method for automatically centering an ophthalmic lens (10), comprising steps of: - positioning the ophthalmic lens on a holder, - acquiring at least one image of the ophthalmic lens received on the holder by me...
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WO/2022/190771A1 |
The present invention pertains to managing a polishing device for polishing wafers, and in particular, pertains to a technique for measuring a physical quantity on the surface of a wafer being polished by the polishing device. The polish...
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WO/2022/183957A1 |
A composite plate, comprising a first plate (5) and a second plate (16). Stripes (14) are formed on a first side surface of the first plate, a first side surface of the second plate is connected to the first side surface of the first pla...
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WO/2022/187074A1 |
A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The chemical mechanical polishing sy...
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WO/2022/187146A1 |
Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. Fo...
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WO/2022/187105A1 |
Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrat...
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WO/2022/186346A1 |
The present invention addresses the problem of obtaining a machining tool capable of effectively cooling machining heat and a machining device using the machining tool. This machining device is a machining tool 100 having a rotation axis...
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WO/2022/186993A1 |
During polishing of a substrate a sequence of measured values is received from an in-situ motor torque monitoring system. Positions on the substrate of the region of lower coefficient of friction are calculated for at least two measured ...
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WO/2022/183735A1 |
A composite panel, comprising a first panel body (5) and a second panel body (16). Stripes (14) are formed on a first side surface of the first panel body (5); a first side surface of the second panel body (16) is connected to the first ...
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WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
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WO/2022/187721A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2022/187720A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2022/187249A1 |
A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to f...
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WO/2022/186992A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so ...
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WO/2022/186745A1 |
An abrasive tool (200) for a floor grinder, the abrasive tool (200) comprising an attachment plate (230) arranged to releasably attach to a tool holder of the floor grinder, the abrasive tool (200) also comprising an abrasive tool sectio...
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WO/2022/183225A1 |
The invention relates to an apparatus for machining the running edges (12) of a sporting device (9), more particularly a ski or a snowboard, comprising a transport apparatus (6), which can be temporarily connected to the sporting device ...
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WO/2022/185734A1 |
A blasting machine for projecting an abrasive material onto an object comprises a projection unit for projecting the abrasive material, and a collection unit for collecting the projected abrasive material. The collection unit is capable ...
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WO/2022/187025A1 |
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first mod...
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WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
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WO/2022/186347A1 |
The present invention addresses the problem of obtaining a machining tool capable of effectively removing, from a machining place, machining chips formed during machining of a workpiece. The problem is solved by a machining tool of the p...
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WO/2022/187057A1 |
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camer...
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WO/2022/185793A1 |
Provided is a means for being able to reduce the abrasive grain residue on the surface of an object to be polished after polishing. The polishing composition of the present invention is a polishing composition including abrasive grains a...
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WO/2022/187055A1 |
A method for optimizing polishing includes, for each respective retaining ring of a plurality of retaining rings mounted on a particular carrier head, performing measurements for a bottom surface of the respective retaining ring mounted ...
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