Title:
MEASURING WAFER COMPRISING SENSOR AND METHOD FOR USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/190771
Kind Code:
A1
Abstract:
The present invention pertains to managing a polishing device for polishing wafers, and in particular, pertains to a technique for measuring a physical quantity on the surface of a wafer being polished by the polishing device. The polishing device includes a polishing table (5) and a polishing head (7). This method for measuring a physical quantity in a polishing device involves using the polishing head (7) to press a measuring wafer (100) comprising a sensor (112) against a polishing pad (2) on the polishing table (5), and using the sensor (112) to measure the physical quantity.
Inventors:
KATO YOSHIKAZU (JP)
Application Number:
PCT/JP2022/005597
Publication Date:
September 15, 2022
Filing Date:
February 14, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B49/10; B24B37/005; B24B37/10; H01L21/304
Foreign References:
| JP2020175450A | 2020-10-29 | |||
| JP2005159147A | 2005-06-16 | |||
| JP2014122914A | 2014-07-03 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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