Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/185793
Kind Code:
A1
Abstract:
Provided is a means for being able to reduce the abrasive grain residue on the surface of an object to be polished after polishing. The polishing composition of the present invention is a polishing composition including abrasive grains and a dispersion medium, wherein the abrasive grains are silica particles having an average particle size (D50) larger than 1.0 μm and a primary particle circularity of 0.90 or more.
Inventors:
WAKABAYASHI RYO (JP)
Application Number:
PCT/JP2022/002799
Publication Date:
September 09, 2022
Filing Date:
January 26, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00
Domestic Patent References:
| WO2019189610A1 | 2019-10-03 | |||
| WO2015068707A1 | 2015-05-14 | |||
| WO2019131873A1 | 2019-07-04 |
Foreign References:
| JP2010064218A | 2010-03-25 | |||
| JP2017155242A | 2017-09-07 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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