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WO/2023/166923A1 |
Provided is a work machine that offers good operability. A work machine 1 comprises: a motor 6; a work unit that is driven by the motor 6 and configured so as to be able to carry out prescribed work; a microcomputer 98 for controlling th...
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WO/2023/164999A1 |
The present invention relates to the field of machining of mechanical parts. In particular, disclosed is a shot-blasting treatment device for a star wheel. The shot-blasting treatment device comprises a plurality of shots, a supporting f...
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WO/2023/165734A1 |
The invention relates to improvements in the technical field of brush manufacture. For this purpose, a device (1) for grinding bristle filaments (2) is proposed. Said device comprises a dust extraction device (5) and at least one means (...
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WO/2023/159792A1 |
The present invention relates to a diamond tool for processing a continuous fiber toughened SiC ceramic matrix composite material, and a preparation method therefor, and aims to solve the technical problems of short service life and high...
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WO/2023/163251A1 |
The present invention relates to a multi-wafer transfer apparatus for a CMP process, which is a multi-wafer transfer apparatus for supplying wafers to a CMP process apparatus, the multi-wafer transfer apparatus comprising: a robotic arm ...
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WO/2023/162714A1 |
The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, ...
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WO/2023/159692A1 |
The present invention provides a special-shaped aviation accessory grinding device. The grinding device comprises a support platform, a first rotating motor, and a second rotating motor; an output end of the first rotating motor is conne...
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WO/2023/162579A1 |
The present invention pertains to a method and system for detecting the polishing endpoint of a workpiece which is used in the production of a semiconductor device such as a wafer, a substrate or a panel. This method involves: obtaining ...
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WO/2023/162296A1 |
Provided is a machining tool which is smooth to operate, is accurate and highly precise, can cope with small to heavy loads, has a tilting direction that can be fixed, has improved centering performance of a shaft after tilting, and is c...
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WO/2023/162667A1 |
The present invention is placed in a non-operating state when suspended. A grinder 10, wherein a switch 62 is switched from the off state to the on state by moving a slide bar 64 provided in a housing 20 from the off position to the on p...
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WO/2023/162478A1 |
The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at leas...
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WO/2023/162930A1 |
The objective of the present invention is to reduce wear of polishing stones without causing a deterioration in the polishing power of the polishing stones themselves or increasing the cost. This barrel polishing method is a method for...
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WO/2023/162924A1 |
This transfer device moves, to a planetary device-type polishing part that has an internal gear and a sun gear that rotate on a support surface of a platen and that polishes the surface of a substrate facing in the thickness direction, a...
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WO/2023/157932A1 |
This gear grinding machine grinds a tooth flank (27) of a gear workpiece (23) using a grindstone tool (21) having threads (24) in the periphery thereof. In this case, a coolant (100) is supplied toward the tooth flank (27) from the upstr...
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WO/2023/156980A1 |
A nonwoven abrasive article includes a prebond composition disposed on a lofty open nonwoven fiber web, an abrasive layer disposed on and secured to at least a portion of the prebond composition. The abrasive layer comprises a binder com...
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WO/2023/158868A1 |
A method and apparatus keeps ice from interfering with the flow of cryogenic particles entrained in a flow exiting a blast nozzle during continuous operation of a particle blast system. A fluid stream having appropriate temperature, mois...
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WO/2023/158526A1 |
A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism.
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WO/2023/158481A1 |
An optical fiber polishing arm assembly comprises a base, at least one side support, an overarm, and a lock shaft. The at least one side support is operatively connected to the base and has a first radial edge with at least one notch. Th...
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WO/2023/158763A1 |
Described is a high-pressure water-powered rotary tool in a horizontal orientation used for polishing, wet-polishing, grinding, polishing, a surface or in a vertical orientation for cutting a hard material. The rotary tool is driven by a...
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WO/2023/150895A1 |
The present invention relates to a rotary adapter (100) that enables an angle grinder to be used as a straight grinder, providing greater versatility and preventing the adapter from overheating due to use and friction, said adapter compr...
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WO/2023/151245A1 |
The present invention relates to a surface friction treatment method for a ceramic reinforced aluminum-based composite material brake disc. A layer of recombinant film is formed on a friction surface of a ceramic reinforced aluminum-base...
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WO/2023/153243A1 |
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The po...
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WO/2023/152779A1 |
Work cell (100) comprising at least one automatic operating device (12) and feed means (18) configured to feed at least one tool (11, 40), characterized in that it comprises a fixed support (150) and at least one tool holder device (10) ...
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WO/2023/153705A1 |
A disk retaining holder can be conveniently retained on a disk retaining device by one touch. In addition, it is possible to prevent a disk retained by the disk retaining holder from being shaken by strong vibrations acting on the grinde...
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WO/2023/153208A1 |
An information processing device (5) includes: an information acquisition unit (500) that in a chemical mechanical polishing process of a substrate performed by a substrate processing apparatus including a polishing table rotatably suppo...
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WO/2023/150995A1 |
A mesh conveyor cleaning device, comprising a frame body (1), wherein the frame body (1) is provided with a mesh belt conveyor (2), a brush roller (4) and a collecting tank (3); the collecting tank is located below a discharge end (25); ...
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WO/2023/150991A1 |
A vibration grinding machine, comprising a support (1). A grinding mechanism (2) and a first vibration mechanism (3) for driving the grinding mechanism (2) to vibrate are arranged on the support (1), a separation mechanism (4) and a seco...
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WO/2023/152667A1 |
A method of grinding an article is described. The method includes the steps of pre-measuring a grinding allowance before start of a grinding process to obtain a pre-measured grinding allowance, calculating a grinding index based on the p...
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WO/2023/154505A1 |
Fiber-reinforced polymer (FRP) tappets or lifters and methods of designing and producing tappets are described. The methods described herein provide FRP tappet having reduced mass compared to conventional metal tappets thereby increasing...
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WO/2023/152294A1 |
The invention relates to a method for cleaning at least one surface (11) of a workpiece (10) made at least partially of wood, wood-based material, plastic or the like, of a consumable (19) to be attached to the workpiece (10) and/or of a...
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WO/2023/149434A1 |
A polishing layer containing polyurethane, the elongation at break of the polyurethane at a tension speed of 50mm/min after undergoing 50°C water-based saturation swelling being less than 100%; a polishing pad comprising said polishing ...
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WO/2023/149162A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of ...
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WO/2023/149161A1 |
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (24...
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WO/2023/149507A1 |
This processing machine comprises: a tool for machining a workpiece; and a depth camera which is installed such that the workpiece lies within an image capturing range thereof, and which captures an image of the depth of a subject. A pos...
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WO/2023/146485A1 |
The present invention relates to providing ease of operation by means of the conical motor shaft (1) and the practical fixing bolts and apparatus thereof that are developed accordingly, without the need of showing an effort for individua...
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WO/2023/143785A1 |
The invention relates to a tool interface device (10a; 10b; 10c) for an insert tool (12a; 12b; 12c) in order to connect the insert tool (12a; 12b; 12c) to a tool receptacle (14a; 14b; 14c) of a machine tool (16a; 16b; 16c), comprising at...
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WO/2023/145572A1 |
The present invention provides: a polishing agent which has high selectivity between a silicon oxide film and a silicon nitride film, while being suppressed in aggregation of abrasive grains, the aggregation being a cause of polishing sc...
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WO/2023/142727A1 |
The present invention provides a ceramic housing, a preparation method therefor, and an electronic device. The ceramic housing has a rough surface, the rough surface comprises a patterned area, the patterned area is provided with a textu...
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WO/2023/145933A1 |
The present invention relates to: a method for manufacturing a resin sheet, the method comprising at least step P for deforming a sheet-shaped resin modeled article formed by a 3D printer to obtain a compressed sheet by applying pressure...
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WO/2023/142579A1 |
A chemical-mechanical combined machining method for a silicon carbide surface, comprising the following steps: first mounting a grinding and polishing tool (1) and silicon carbide (2) on a machine table of grinding and polishing equipmen...
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WO/2023/144645A1 |
The present disclosure relates to the field of superfinishing technology. In particular, the present disclosure relates to an apparatus (100) for performing finishing operation on a ball screw (40). The apparatus (100) comprises a holder...
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WO/2023/146483A1 |
The present invention is a water tank (6) structure positioned under the counter in corrosion and polishing machines and relates to transition of dense puddle coming from a multi-processed area between the gradual labyrinths by coming to...
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WO/2023/146808A1 |
Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an elec...
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WO/2023/146486A1 |
The subject of the invention is an irrigation system in corrosion and polishing machines (8) and relates to cooling of the discs by preventing the heating, burning and corrosion problems of the process-induced discs by ensuring that the ...
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WO/2023/146487A1 |
The present invention relates to an ability of processing that can be directed in all directions, by transferring the rotational movement of the shaft (5) to a cord with a steel flexible cut shaft end (10.1) thereof, by means of a change...
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WO/2023/137773A1 |
The present invention provides a micro-part surface modification device, comprising a strengthening module, a roll-to-roll vibration piece module, a water supply module and a laser module. The strengthening module comprises a shell and s...
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WO/2023/137928A1 |
An intelligent plane polishing method, comprising a workbench (1), a feeding and clamping robot, and a polishing head (3). The workbench (1) has a high-precision base surface, and a front end and a side surface each are provided with a f...
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WO/2023/139945A1 |
The present invention is a double-sided polishing device for a wafer and has an upper platen and a lower platen, said double-sided polishing device being characterized in that: the upper platen is provided with a plurality of platen thro...
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WO/2023/140873A1 |
A sanding apparatus and method for treating work surfaces with abrasive material is provided. The apparatus is a standard oscillating sanding apparatus having sanding pads positioned thereon. The pads are configured to apply abrasive act...
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WO/2023/139124A1 |
The invention relates to a double-side grinding machine (10), comprising a first machine part (16) with a first grinding disc (18) and a second machine part (20) with a second grinding disc (22), wherein a distance between the first grin...
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