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Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/149162
Kind Code:
A1
Abstract:
An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of supply of a substrate processing fluid that is supplied from a substrate processing fluid supply unit (222, 242a, 245a), in processing of a substrate (W) which is performed by a substrate processing device (2); and a state prediction unit (501) that predicts substrate processing fluid supply position information corresponding to the substrate processing fluid supply information by inputting the substrate processing fluid supply information to a learning model which has learned, by machine learning, correlations between substrate processing fluid supply information and substrate processing fluid supply position information, said substrate processing fluid supply position information indicating the supply position of the fluid that is supplied by the substrate processing fluid supply unit when the substrate processing device operates.

Inventors:
MIYAZAKI MITSURU (JP)
KONDO DAICHI (JP)
Application Number:
PCT/JP2023/000378
Publication Date:
August 10, 2023
Filing Date:
January 11, 2023
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/00; B24B49/00; H01L21/02
Domestic Patent References:
WO2017090505A12017-06-01
Foreign References:
JP2021125654A2021-08-30
JP2021132183A2021-09-09
JP2012204451A2012-10-22
JP2020145289A2020-09-10
JP2020061403A2020-04-16
JP2018157149A2018-10-04
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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