Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE-LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/149161
Kind Code:
A1
Abstract:
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (241) operates; and a state prediction unit (501) which predicts substrate holding mechanism part state information for the operation state information by inputting the operation state information to a training model for which a correlation between the operation state information and the substrate holding mechanism part state information is trained through machine learning, the substrate holding mechanism part state information indicating the states of substrate holding mechanism parts (241a, 241c, 241e) when the substrate processing device (2) operates in the operation state indicated by the operation state information.
Inventors:
MIYAZAKI MITSURU (JP)
KONDO DAICHI (JP)
KONDO DAICHI (JP)
Application Number:
PCT/JP2023/000371
Publication Date:
August 10, 2023
Filing Date:
January 11, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/30; B24B41/06; B24B49/00; H01L21/02
Domestic Patent References:
| WO2021117685A1 | 2021-06-17 |
Foreign References:
| JP2007294920A | 2007-11-08 | |||
| JP2020061469A | 2020-04-16 | |||
| JP2020109839A | 2020-07-16 | |||
| JP2021152762A | 2021-09-30 | |||
| JP2021132140A | 2021-09-09 | |||
| JP2006004992A | 2006-01-05 | |||
| US20190162675A1 | 2019-05-30 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
Download PDF: