Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/153208
Kind Code:
A1
Abstract:
An information processing device (5) includes: an information acquisition unit (500) that in a chemical mechanical polishing process of a substrate performed by a substrate processing apparatus including a polishing table rotatably supporting a polishing pad and a top ring for pushing the polishing pad against the substrate, acquires polishing process state information including top-ring vibration information indicating vibration of the top ring during polishing and top-ring sound information indicating sound generated from the top ring during polishing: and a state prediction unit (501) that inputs the polishing process state information acquired by the information acquisition unit (500) to a learning model (10A) that has learned, through machine learning, correlation between the polishing process state information and substrate slipping-out information indicating occurrence of slipping out of the substrate subjected to the chemical mechanical polishing process, to predict the substrate slipping-out information relative to the polishing process state information.
Inventors:
YUN SEUNGHO (JP)
Application Number:
PCT/JP2023/002243
Publication Date:
August 17, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B49/10; B24B37/10; B24B37/30; B24B37/32; G06N20/10; H01L21/304
Foreign References:
| JP2021028099A | 2021-02-25 | |||
| JP2017109281A | 2017-06-22 | |||
| JP2020170391A | 2020-10-15 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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