DOUBLE-SIDED POLISHING DEVICE

WIPO Patent Application WO/2023/139945

A1

The present invention is a double-sided polishing device for a wafer and has an upper platen and a lower platen, said double-sided polishing device being characterized in that: the upper platen is provided with a plurality of platen through holes between the rotational center and the peripheral edge thereof; a polishing cloth is provided to a polishing surface on the upper platen which faces the lower platen; holes having a diameter equal to or larger than the diameter of the platen through holes are provided in the polishing cloth at positions corresponding to the plurality of platen through holes; a resin hollow plug having a window material on the upper surface thereof and having a plug through hole is inserted into each of the platen through holes in the upper platen; and a wafer thickness measuring mechanism that is capable of optically measuring, through the plug through holes, the thickness of the wafer in real time during polishing is further provided above the upper platen. It is thus possible to provide a double-sided polishing device that exhibits excellent thickness measurement accuracy and that can eliminate concerns about metal impurities, flaws, and particles.

AMAGAI SHIRO (JP)
HASHIMOTO HIROMASA (JP)

PCT/JP2022/044597

July 27, 2023

December 02, 2022

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SHINETSU HANDOTAI KK (JP)

B24B37/013; B24B37/08; B24B37/12; B24B37/26; B24B49/04; B24B49/12; H01L21/304

JP2013223908A	2013-10-31
JP2021146475A	2021-09-27
JP2018506182A	2018-03-01
JP2019181632A	2019-10-24

YOSHIMIYA Mikio et al. (JP)

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