Title:
POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENTS, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/145572
Kind Code:
A1
Abstract:
The present invention provides: a polishing agent which has high selectivity between a silicon oxide film and a silicon nitride film, while being suppressed in aggregation of abrasive grains, the aggregation being a cause of polishing scratches; an additive solution for polishing agents; and a polishing method which enables a high-speed polishing, while being suppressed in polishing scratches. The present invention provides a polishing agent which contains abrasive grains, a water-soluble polymer and water, wherein: the water-soluble polymer is a copolymer of a monomer (A) that is one selected from among unsaturated dicarboxylic acids, derivatives thereof, and salts of the unsaturated dicarboxylic acids or the derivatives, and a monomer (B) that is other than the monomer (A); the monomer (B) contains an ethylenic double bond but does not contain an acidic group; and the acid value of the water-soluble polymer is 200 mgKOH/g to 450 mgKOH/g.
Inventors:
FUKUI HIROKA (JP)
Application Number:
PCT/JP2023/001335
Publication Date:
August 03, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B24B37/00; H01L21/304; C09G1/02; C09K3/14
Foreign References:
| JP2019087660A | 2019-06-06 | |||
| JP2010153576A | 2010-07-08 | |||
| JP2007324606A | 2007-12-13 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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