Title:
POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION SYSTEM, POLISHING DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2023/162579
Kind Code:
A1
Abstract:
The present invention pertains to a method and system for detecting the polishing endpoint of a workpiece which is used in the production of a semiconductor device such as a wafer, a substrate or a panel. This method involves: obtaining a polishing monitoring value which expresses the degree of workpiece (W) polishing progress when polishing a workpiece (W); generating time-series data which expresses a change in the polishing monitoring value which corresponds to the workpiece (W) polishing time; inputting polishing monitoring values (VF1, VF2) and polishing times (TF1, TF2), which constitute characteristic data points (FP1, FP2) included in the time-series data, into a trained model (34); and outputting a polishing endpoint prediction time from the trained model (34).
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Inventors:
SHIMIZU YUKO (JP)
MITANI RYUICHIRO (JP)
MITANI RYUICHIRO (JP)
Application Number:
PCT/JP2023/002674
Publication Date:
August 31, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B24B49/16; H01L21/304
Domestic Patent References:
| WO2020235581A1 | 2020-11-26 |
Foreign References:
| JP2021194748A | 2021-12-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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