Title:
MULTI-WAFER TRANSFER APPARATUS FOR CMP PROCESS
Document Type and Number:
WIPO Patent Application WO/2023/163251
Kind Code:
A1
Abstract:
The present invention relates to a multi-wafer transfer apparatus for a CMP process, which is a multi-wafer transfer apparatus for supplying wafers to a CMP process apparatus, the multi-wafer transfer apparatus comprising: a robotic arm which can move in the up-and-down and left-and-right directions and is connected to a rotatable rotating shaft; and a transfer module which is connected to one end of the robotic arm, wherein: the transfer module comprises an upper plate fixing base, a middle base bonded to the bottom of the upper plate fixing base, a vision protection cover disposed under the middle base, and a lower plate fixing base disposed under the vision protection cover; a radially-shaped multi-wafer pickup unit for simultaneously holding four or more wafers by suction is included under the lower plate fixing base; the multi-wafer pickup unit includes a vacuum suction portion and a pad; and a vision inspection device for inspecting, during the CMP process, whether wafers are damaged is included within the vision protection cover.
Inventors:
PARK JONG-IK (KR)
Application Number:
PCT/KR2022/002799
Publication Date:
August 31, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
SEJUNG ROBOT CO LTD (KR)
International Classes:
H01L21/677; B24B37/34; B25J11/00; B25J15/00; B25J15/06; B25J19/04; G01N21/95; H01L21/67; H01L21/683
Foreign References:
KR101616464B1 | 2016-04-29 | |||
KR102274693B1 | 2021-07-07 | |||
KR20010097278A | 2001-11-08 | |||
KR101850336B1 | 2018-05-31 | |||
US20130045546A1 | 2013-02-21 |
Attorney, Agent or Firm:
SANG-D HARMONY PATENT & LAW FIRM (KR)
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