SLURRY COMPOSITION FOR FINAL POLISHING OF SILICON WAFER FOR REDUCING NUMBER OF SURFACE DEFECTS AND HAZE AND FINAL POLISHING METHOD USING SAME

Title:

SLURRY COMPOSITION FOR FINAL POLISHING OF SILICON WAFER FOR REDUCING NUMBER OF SURFACE DEFECTS AND HAZE AND FINAL POLISHING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2023/282475

Kind Code:

A1

Abstract:

The present invention relates to: a slurry composition for final polishing of a silicon wafer, which reduces haze and the number of defects in the surface of an object to be polished and has excellent performance; and a final polishing method using same, the slurry composition comprising 1-20 wt% of colloidal silica as abrasive particles, 0.03-0.5 wt% of a surfactant, 0.1-10 wt% of a pH adjuster, 0.02-2 wt% of a water-soluble thickener, 0.05-0.2 wt% of a chelating agent, and 0.1-1 wt% of an organic base.

Inventors:

KIM SEONG HWAN (KR)
LEE SEUNG HUN (KR)
LEE SEUNG HYUN (KR)

Application Number:

PCT/KR2022/008078

Publication Date:

January 12, 2023

Filing Date:

June 08, 2022

Export Citation:

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Assignee:

YOUNG CHANG CHEMICAL CO LTD (KR)

International Classes:

C09K3/14; B24B37/10; C09G1/02; C09G1/04; H01L21/306

Domestic Patent References:

WO2012036087A1

2012-03-22

Foreign References:

KR20170118690A	2017-10-25
KR20060097786A	2006-09-18
KR20110040721A	2011-04-20
JP2014151424A	2014-08-25
KR102358134B1	2022-02-08

Attorney, Agent or Firm:

HAEDAM IP GROUP (KR)

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