Title:
POLISHING COMPOSITION, CONCENTRATED SOLUTION OF POLISHING COMPOSITION, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/140146
Kind Code:
A1
Abstract:
The present invention provides a means which makes it possible to polish a target object at a high polishing rate and also makes it possible to maintain the surface quality of the polished target object at a good level. The present invention is a polishing composition comprising abrasive grains and a basic compound, in which the basic compound comprises ammonia and a piperazine compound, and the content ratio C1 of the piperazine compound represented by formula (1) is more than 0% and 5.5% or less when the content of the ammonia in the polishing composition is defined as A1 (unit: % by mass) and the content of the piperazine compound in the polishing composition is defined as B1 (unit: % by mass).
Inventors:
GOTO OSAMU (JP)
TAKAMA DAIKI (JP)
TANAKA YUKI (JP)
TSUCHIYA KOHSUKE (JP)
TAKAMA DAIKI (JP)
TANAKA YUKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2023/000300
Publication Date:
July 27, 2023
Filing Date:
January 10, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Foreign References:
| JP2008147651A | 2008-06-26 | |||
| JP2017197693A | 2017-11-02 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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