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Title:
CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/135673
Kind Code:
A1
Abstract:
This CMP polishing solution contains abrasive grains, an iron ion supply agent, an organic acid, an oxidizing agent, and an aqueous liquid medium, the abrasive grains including silica particles that have sulfo groups and silica particles that are free of sulfo groups.

Inventors:
INOUE KEISUKE (JP)
ONO HIROSHI (JP)
Application Number:
PCT/JP2022/000662
Publication Date:
July 20, 2023
Filing Date:
January 12, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2019181399A12019-09-26
WO2016117559A12016-07-28
Foreign References:
JP2021509768A2021-04-01
JP2020025005A2020-02-13
JP2021127442A2021-09-02
JP2020115501A2020-07-30
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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