Title:
COMPOSITION, POLISHING AGENT AND METHOD FOR POLISHING BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/127775
Kind Code:
A1
Abstract:
[Problem] To provide a composition which maintains the hydrophilicity and does not lose dispersibility or film properties even in an environment having a thermal history, while being adaptable to the heat generation during polishing. [Solution] A composition which contains water, abrasive grains and a poly-N-vinyl carboxylic acid amide, wherein: the poly-N-vinyl carboxylic acid amide has a weight average molecular weight of 1,000 to 5,000,000; and the composition has a pH of 6.0 to 14.0.
Inventors:
SUGAWARA ATSUSHI (JP)
KONISHI JUN (JP)
KONISHI JUN (JP)
Application Number:
PCT/JP2022/047825
Publication Date:
July 06, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B24B37/00; C09G1/02; C09K3/14; H01L21/304
Domestic Patent References:
| WO2019181016A1 | 2019-09-26 | |||
| WO2015141687A1 | 2015-09-24 | |||
| WO2015151673A1 | 2015-10-08 | |||
| WO2020255862A1 | 2020-12-24 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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