WAFER POLISHING SYSTEM AND WAFER TRANSFER METHOD

WIPO Patent Application WO/2023/125916

A1

Disclosed in the present invention is a wafer polishing system, comprising polishing units. Each polishing unit comprises a wafer transfer channel and a polishing module; the polishing module comprises a polishing platform and a polishing arm, and the polishing arm can drive a wafer to move relative to the polishing platform; the wafer transfer channel is provided with at least two work stations, and a wafer loading/unloading table can move between the work stations; a transmission structure is provided between adjacent polishing units, a wafer is transferred between work stations of the adjacent polishing units along a first track, and the first track falls on wafer transfer channels; and/or a wafer loading/unloading table can move between adjacent polishing units; and/or a transfer structure is provided between a polishing unit and an external transition table, a wafer is transferred between work stations of the polishing unit and the external transition table along a second track, and the second track falls on a wafer transfer channel. Further disclosed in the present invention is a wafer transfer method. In the present invention, tracks all fall on wafer transfer channels, so that no other space is occupied, and the layout is reasonable; the process is flexible, and the processing efficiency is high; the transfer stability is high.

XU XIAOYU (CN)
DENG YAOMIN (CN)

PCT/CN2022/143854

July 06, 2023

December 30, 2022

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HANGZHOU SIZONE ELECTRONIC TECH INC (CN)

B24B29/02; H01L21/304

CN110026879A	2019-07-19
CN109514421A	2019-03-26
CN109304665A	2019-02-05
US6343979B1	2002-02-05
CN105598827A	2016-05-25

HANGZHOU KAIZHI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)

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