Title:
POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILM
Document Type and Number:
WIPO Patent Application WO/2023/127898
Kind Code:
A1
Abstract:
In one embodiment, provided is a polishing liquid composition for a silicon oxide film, the polishing liquid composition being capable of improving the smoothness of a polished substrate surface while maintaining polishing speed. The present disclosure relates to a polishing liquid composition for a silicon oxide film. In one embodiment, this polishing liquid composition contains: cerium oxide particles (component A); a water-soluble anionic polymer (component B); an unsaturated cyclic compound (component C); and an aqueous medium, wherein component B has an aromatic group in the molecule, and component C has a functional group represented by formula (I) or formula (II) in the cyclic skeleton thereof.
Inventors:
SUGAHARA MASATO
YAMAGUCHI NORIHITO
YAMAGUCHI NORIHITO
Application Number:
PCT/JP2022/048279
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Foreign References:
| JP2021005704A | 2021-01-14 | |||
| JP2020183481A | 2020-11-12 | |||
| JP2020080399A | 2020-05-28 | |||
| JP2003041239A | 2003-02-13 | |||
| JP2021166254A | 2021-10-14 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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