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Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/048265
Kind Code:
A1
Abstract:
A polishing pad including a polishing layer that is a molded product of a polyurethane composition, in which the polyurethane composition comprises 90 to 99.9% by mass of a thermoplastic polyurethane containing a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and 0.1 to 10% by mass of a hygroscopic polymer, and the molded product has a hardness of 75 to 90 when measured with a type-D durometer in accordance with JIS K 7215.

Inventors:
GOSHI YUKO (JP)
KATO MITSURU (JP)
SUGIOKA TAKASHI (JP)
Application Number:
PCT/JP2022/035517
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B24B37/24; C08G18/76; C08J5/14; C08L75/04; C08L101/12; H01L21/304
Domestic Patent References:
WO2012077592A12012-06-14
Foreign References:
JP2021053748A2021-04-08
JP2016215368A2016-12-22
JP2007059745A2007-03-08
Attorney, Agent or Firm:
EGAWA Masaru (JP)
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