Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/048266
Kind Code:
A1
Abstract:
Provided is a polishing pad comprising a polishing layer that is a molded article of a polyurethane composition. The polyurethane composition contains 90-99.9 mass% of a thermoplastic polyurethane containing a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and contains 0.1-10 mass% of a moisture-absorbing polymer. The molded article has a hardness, using a type D durometer conforming to JIS K 7215, of at least 60 but less than 75.
Inventors:
GOSHI YUKO (JP)
KATO MITSURU (JP)
SUGIOKA TAKASHI (JP)
KATO MITSURU (JP)
SUGIOKA TAKASHI (JP)
Application Number:
PCT/JP2022/035519
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B24B37/24; C08G18/76; C08J5/14; C08L75/04; C08L101/12; H01L21/304
Domestic Patent References:
| WO2012077592A1 | 2012-06-14 |
Foreign References:
| JP2021053748A | 2021-04-08 | |||
| JP2016215368A | 2016-12-22 | |||
| JP2007059745A | 2007-03-08 |
Attorney, Agent or Firm:
EGAWA Masaru (JP)
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