Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032716
Kind Code:
A1
Abstract:
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, the polishing composition includes spherical abrasive grains as the abrasive grains, and includes an alkali metal salt.
Inventors:
TANABE YOSHIYUKI (JP)
ASADA MAKI (JP)
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2022/031391
Publication Date:
March 09, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C01B33/14; C09G1/02; C09K3/14
Foreign References:
| JP2020025066A | 2020-02-13 | |||
| JP2021142157A | 2021-09-24 | |||
| JP2011086713A | 2011-04-28 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
Download PDF: