Title:
CHEMICAL-MECHANICAL POLISHING DEVICE AND CONTROL METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/035247
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a chemical-mechanical polishing device and a control method therefor. The chemical-mechanical polishing device comprises a polishing platform which is adapted to carry a polishing pad and drive the polishing pad to move; and a polishing head which is adapted to drive an object to be polished to rotate about the central axis of the polishing head between the polishing head and the polishing pad; a metal measuring member which is arranged such that the metal measuring member remains fixed relative to the axial position of the polishing head; and a sensor which is disposed on the polishing platform and is adapted to at least obtain a signal value of the metal measuring member caused by an eddy current effect on the sensor. By means of providing the metal measuring member, the thickness of the polishing pad can be determined in real time. Once the thickness of the polishing pad can be precisely determined, the thickness of a metal film can be accurately and precisely obtained, and the obtained thickness of the metal film is further used for closed-loop control, thus the planarization uniformity and precision of a silicon wafer can be significantly improved. In addition, the addition of the metal measuring member does not require a large structural adjustment to the original chemical-mechanical polishing device, so the planarization uniformity and precision of a silicon wafer can be significantly improved at low cost. Moreover, in the foregoing means, it is not necessary to calibrate sensor parameters after each time the polishing pad and polishing solution are replaced, thereby improving the ease of use of the device.
Inventors:
ZHAO LINXIAN (CN)
WANG HAIFENG (CN)
MA XIEGUANG (CN)
WANG HAIFENG (CN)
MA XIEGUANG (CN)
Application Number:
PCT/CN2021/117815
Publication Date:
March 16, 2023
Filing Date:
September 10, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
B24B37/10
Foreign References:
| CN205237796U | 2016-05-18 | |||
| CN106826533A | 2017-06-13 | |||
| CN106466807A | 2017-03-01 | |||
| CN106853609A | 2017-06-16 | |||
| CN106625201A | 2017-05-10 | |||
| CN102049733A | 2011-05-11 | |||
| US6951503B1 | 2005-10-04 |
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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