Title:
WAFER POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/036012
Kind Code:
A1
Abstract:
A wafer polishing system, at least comprising one polishing unit (1), wherein the polishing unit (1) comprises a wafer transmission channel (2) and at least two polishing modules (3); and the polishing modules (3) are located on both sides of the wafer transmission channel (2). After a polishing arm of one polishing module (3) obtains a wafer from a working position in the wafer transmission channel (2), the polishing process is completed; the wafer is then placed back to the wafer transmission channel (2) along a first track (51); a wafer transfer device moves to transfer the wafer to another working position, and after a polishing arm of the other polishing module obtains the wafer from the working position along a second track (53), another polishing process is completed; and the first track (51), a moving track (52) of the wafer transfer device, and the form of the second track (53) are approximately Z-shaped. The wafer polishing system has a better stability, a high flexibility and a better polishing effect.
Inventors:
YANG YUANSI (CN)
XU XIAOYU (CN)
ZHOU ZHIPENG (CN)
XU XIAOYU (CN)
ZHOU ZHIPENG (CN)
Application Number:
PCT/CN2022/115772
Publication Date:
March 16, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
B24B37/04; B24B37/07
Foreign References:
| CN113910099A | 2022-01-11 | |||
| CN216781428U | 2022-06-21 | |||
| CN109304670A | 2019-02-05 | |||
| CN109015314A | 2018-12-18 | |||
| JP2002141317A | 2002-05-17 | |||
| TW202046433A | 2020-12-16 | |||
| CN109037101A | 2018-12-18 |
Attorney, Agent or Firm:
HANGZHOU KAIZHI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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