Title:
POLISHING DEVICE USING ROBOT, AND POLISHING METHOD THEREBY
Document Type and Number:
WIPO Patent Application WO/2023/038183
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a technology for automatically performing a polishing process by using a robot and controlling the polishing process in real time by monitoring a current value of a spindle in real time. A polishing device using a robot, according to an embodiment of the present invention, comprises: a polishing robot which is a robot having a plurality of links and operating with multiple degrees of freedom; a polishing unit which is coupled to an end of the polishing robot and polishes the surface of an object to be polished; a surface roughness measurement unit which is coupled to the polishing robot and measures the surface roughness of a portion of the surface of the object to be polished immediately before being polished by the polishing unit; and a control unit which receives information on a change in a motor current that is a current supplied to the polishing unit, receives information on the surface roughness of the object to be polished from the surface roughness measurement unit, and transmits a control signal to the polishing unit so as to stop the operation of the polishing unit by using each piece of information.
Inventors:
KIM SEONG HYEON (KR)
KIM TAE GON (KR)
NAM JUNG SOO (KR)
LEE SEOK WOO (KR)
SHIN KANG U (KR)
KIM TAE GON (KR)
NAM JUNG SOO (KR)
LEE SEOK WOO (KR)
SHIN KANG U (KR)
Application Number:
PCT/KR2021/013377
Publication Date:
March 16, 2023
Filing Date:
September 29, 2021
Export Citation:
Assignee:
KOREA INST IND TECH (KR)
International Classes:
B24B49/02; B24B47/12; B24B49/10; B25J9/06; B25J11/00; B25J13/08; G06N20/00; H02K11/27
Foreign References:
| JPH05104436A | 1993-04-27 | |||
| KR20170045111A | 2017-04-26 | |||
| KR20210087398A | 2021-07-12 | |||
| JPH11245164A | 1999-09-14 | |||
| JPH113877A | 1999-01-06 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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