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WO/2024/090178A1 |
Provided are an evaporation source, a film forming device, and a film forming method which enable suppression of variation in film-forming characteristics. An evaporation source 300 forms a film while moving relatively to a substrate,...
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WO/2024/089029A1 |
The invention relates to a method for producing a functional structure, having the steps of: providing a main part of the functional structure; and applying at least one metal layer onto a surface of the main part, wherein the surface of...
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WO/2024/091392A1 |
A method and apparatus for thermal evaporation are provided. The thermal evaporator includes an evaporator body operable for both holding and evaporating a coating material to be deposited. The evaporator body includes a cylindrical wall...
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WO/2024/091610A1 |
An evaporation system herein includes one or more evaporation assemblies, an unwinding reel, a coating drum, and a winding reel. The one or more evaporation assemblies include an evaporation body, an evaporator, and one or more external ...
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WO/2024/088451A1 |
The nanoprinting method consists in a device (1) for applying nanoparticles (4) to surface of a substrate (7), where nanoparticles (4) are prepared in a gas aggregation source (3) connected through an exit orifice (11) into a vacuum cham...
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WO/2024/088252A1 |
A long-life sputtering target material and a preparation method therefor. The long-life sputtering target material comprises a sputtering layer and a reinforcement layer which are integrally formed, the front surface of the target materi...
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WO/2024/086982A1 |
The present application provides a preparation method for a positive electrode composite aluminum current collector, comprising the following steps: providing a polymer substrate, the polymer substrate comprising a first surface and a se...
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WO/2024/086397A1 |
Catalyst sputtering-based methods of facilitating forming a membrane electrode assembly (MEA) catalyst layer are provided. The methods include forming a catalyst ink, including obtaining a powder including a plurality of support particle...
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WO/2024/084664A1 |
A semiconductor substrate comprising: a template substrate including a first seed region and a growth suppression region; and a first semiconductor part having a first base portion positioned above the first seed region and a first wing ...
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WO/2024/083470A1 |
A particle transfer system, including: a particle trap apparatus configured to trap a plurality of particles; and a particle conveyance structure configured to convey the particles in parallel from the particle trap apparatus to a substr...
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WO/2024/084878A1 |
The sputtering surface of this Au sputtering target has: surface roughness Ra with an average value of 0.1-50.0 μm, wherein the difference between the maximum value and the minimum value is 10.0 μm or less; and surface roughness Rz wit...
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WO/2024/082184A1 |
The present application discloses a preparation method for a composite membrane, and an apparatus for preparing the composite membrane. The preparation method for the composite membrane provided by an embodiment of the present applicatio...
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WO/2024/082007A1 |
The present invention broadly relates to the fabrication and processing of electronic device components on silicon which may comprise a silicon dioxide passivation layer.
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WO/2024/085089A1 |
Provided is a reflection-type mask blank having excellent strength of a surface on the reverse surface side on which a conductive film is disposed. This reflection-type mask blank comprises: a substrate; a conductive film disposed on o...
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WO/2024/080870A1 |
The present application concerns a method for manufacturing an optical waveguide. The method comprising providing a substrate, depositing an aluminium nitride waveguide core on the substrate, and arranging a cladding layer on the deposit...
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WO/2024/080251A1 |
Provided is an yttrium oxide film having Vickers hardness of 900 HV or more, in which the half width determined by an X-ray analysis of face (222) of an yttrium oxide crystal is 0.7° or more, the face (222) is predominantly aligned in t...
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WO/2024/080298A1 |
This optical multilayer body is sequentially provided with a transparent base material, an adhesion layer, a first high refractive index layer, a first low refractive index layer, a second high refractive index layer and a second low ref...
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WO/2024/077525A1 |
Disclosed herein are approaches for forming dynamic DRAM devices without trench fill voids. A method may include providing a plurality of trenches in a substrate, the plurality of trenches defining a plurality of device structures, and d...
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WO/2024/080312A1 |
Provided are a surface treatment agent that makes it possible to form a surface layer that has excellent frictional durability, an article that has a surface layer that has excellent frictional durability, and a production method for the...
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WO/2024/079890A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/080411A1 |
A deposition device according to the present embodiment may comprise: a chamber in which a space is formed; an evaporation source, which is accommodated in the chamber and has a nozzle; a laser for outputting a laser beam through the noz...
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WO/2024/081210A1 |
Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a process chamber configured to process a substrate, a substrate support comprising a heat sink configur...
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WO/2024/079891A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/079889A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/080869A1 |
The application concerns a method for manufacturing an optical waveguide. The method comprising providing a substrate, depositing an aluminium oxide waveguide core on the substrate, and arranging a cladding layer on the deposited alumini...
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WO/2024/074443A1 |
The invention relates to a method for forming a fluoride or oxylfluoride layer (1) for an optical element (2) for use in the VUV wavelength range, having the steps of: depositing an cxide layer (4) and converting the oxide layer (4) into...
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WO/2024/075909A1 |
Disclosed are an automated thin film deposition system utilizing machine learning and a thin film deposition method. The automated thin film deposition system utilizing machine learning disclosed herein is disposed in a chamber for thin ...
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WO/2024/075547A1 |
Provided are: a Ni alloy film that has high oxidation resistance at high temperature even without containing Cr; and a sputtering target material for forming the Ni alloy film. This Ni alloy film comprises 9.0-25.0 atom% of Al and 1.0-...
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WO/2024/075690A1 |
In order to form a homoepitaxial thin film on the surface, which corresponds to LiNbO3 single crystal or LiTaO3 single crystal, of a substrate (2), the same composition as the single crystal is deposited on the surface, which corresponds...
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WO/2024/074441A1 |
The invention relates to a method for producing a fluoridic protective coating (11) for protecting a metallic reflection layer (12) of a reflective optical element (13) for the VUV wavelength range, comprising the step of: irradiating a ...
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WO/2024/075703A1 |
A metal mask which has a porous region and a peripheral region, wherein: the porous region has a plurality of through-holes; the peripheral region is positioned in the periphery of the porous region; the peripheral region has a stress di...
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WO/2024/074202A1 |
A mask (100) for masking a rear of an edge of a substrate (10) is described. The mask comprises a frame (110) having an opening (111) for receiving the substrate, wherein the frame has a protrusion (112) provided at an inner side (110A) ...
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WO/2024/075377A1 |
According to the present invention, a film forming device for performing film formation on a substrate is used, the device comprising: an electrostatic chuck having a suction surface for suctioning a substrate; and a detection means for ...
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WO/2024/068155A1 |
The present invention relates to a method for producing a coated tool part of a machining tool. The tool part is coated with a coating that comprises at least one Al2O3 layer containing an aluminium oxide (Al2O3), said layer having an al...
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WO/2024/070277A1 |
Provided is a conductive reflective film having improved corrosion resistance so as to prevent appearance abnormalities and enable long-term use. The conductive reflective film has a structure in which a conductive layer of silver alloy ...
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WO/2024/066955A1 |
Disclosed in the present invention are a reusable SERS (Surface Enhanced Raman Scattering) molecular test device and a method using same. The reusable SERS molecular test device comprises two glass sheets, wherein a noble metal nano film...
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WO/2024/065970A1 |
A composite deposition method for a hard oxide coating, and a coated cutting tool. The coated cutting tool comprises a cutting tool base body and a hard oxide coating; the hard oxide coating comprises multiple cathodic arc evaporation ox...
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WO/2024/069553A1 |
Metal component for high-temperature non-aqueous environments, comprising a body of metal material and a protective coating applied to an outer surface of the body of metal material, intended in use to contact a non-aqueous working fluid...
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WO/2024/071588A1 |
The objective of the present invention is to provide a hard film-coated cutting tool having excellent welding resistance and wear resistance. In order to achieve the above objective, the cutting tool provided by the present invention has...
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WO/2024/071868A1 |
A deposition mask according to an embodiment comprises a metal plate in which a first surface and a second surface opposite to the first surface are defined, wherein the metal plate comprises a deposition area and a non-deposition area, ...
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WO/2024/073368A1 |
Methods for forming a low resistivity ruthenium (Ru) thin film that include depositing ruthenium onto a substrate via ion beam deposition with assist in a process chamber having reactive and noble gas species therein. The substrate is at...
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WO/2024/071297A1 |
This surface treatment device emits negative oxygen ions to treat the surface of an object to be treated, wherein the surface treatment device emits the negative oxygen ions (O–, O2 – etc.) to oxidize the SiC content of the object to...
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WO/2023/119165A9 |
A compound, and a layered semiconductor device comprising a patterning coating provided in a first portion of a lateral aspect of the device, the patterning coating comprising the compound. The patterning coating is adapted to impact a p...
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WO/2024/071704A1 |
A deposition mask according to an embodiment comprises a metal plate including a deposition area and a non-deposition area. The metal plate has a first direction defined as the longitudinal direction and a second direction defined as the...
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WO/2024/071048A1 |
A metal mask (10) comprising a mask plate (20) and a coating member (30) that coats regions of the mask plate (20). The mask plate (20) has: one or more openings (22) for forming a membrane; and multiple marks (23) for detecting deformat...
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WO/2024/071484A1 |
The present specification relates to a method for manufacturing antiviral fabric, and antiviral fabric manufactured thereby, the method comprising the steps of: pretreating fabric; and forming a metal layer on one side or both sides of t...
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WO/2024/070473A1 |
A film formation device according to the present invention is provided with: a film formation source which discharges a film formation material toward a substrate through a mask located between the film formation source and a film-formin...
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WO/2024/071087A1 |
This mask manufacturing method comprises: a laminate preparation step for preparing a laminate including an inorganic layer containing an inorganic first surface, an inorganic second surface which is a surface on the reverse side of the ...
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WO/2024/071705A1 |
A metal plate, according to an embodiment, comprises: first regions containing iron (Fe), nickel (Ni), oxygen (O), and chromium (Cr), and including a surface; and a second region between the first regions, wherein the first regions are f...
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WO/2024/071578A1 |
A magnetron sputtering apparatus according to an embodiment of the present invention may comprise: a chamber in which a sputtering gas is held and which provides an inner space where a workpiece is placed; an ion source unit which includ...
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