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WO/2024/075703A1 |
A metal mask which has a porous region and a peripheral region, wherein: the porous region has a plurality of through-holes; the peripheral region is positioned in the periphery of the porous region; the peripheral region has a stress di...
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WO/2024/074202A1 |
A mask (100) for masking a rear of an edge of a substrate (10) is described. The mask comprises a frame (110) having an opening (111) for receiving the substrate, wherein the frame has a protrusion (112) provided at an inner side (110A) ...
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WO/2024/075377A1 |
According to the present invention, a film forming device for performing film formation on a substrate is used, the device comprising: an electrostatic chuck having a suction surface for suctioning a substrate; and a detection means for ...
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WO/2024/068155A1 |
The present invention relates to a method for producing a coated tool part of a machining tool. The tool part is coated with a coating that comprises at least one Al2O3 layer containing an aluminium oxide (Al2O3), said layer having an al...
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WO/2024/070277A1 |
Provided is a conductive reflective film having improved corrosion resistance so as to prevent appearance abnormalities and enable long-term use. The conductive reflective film has a structure in which a conductive layer of silver alloy ...
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WO/2024/066955A1 |
Disclosed in the present invention are a reusable SERS (Surface Enhanced Raman Scattering) molecular test device and a method using same. The reusable SERS molecular test device comprises two glass sheets, wherein a noble metal nano film...
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WO/2024/065970A1 |
A composite deposition method for a hard oxide coating, and a coated cutting tool. The coated cutting tool comprises a cutting tool base body and a hard oxide coating; the hard oxide coating comprises multiple cathodic arc evaporation ox...
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WO/2024/069553A1 |
Metal component for high-temperature non-aqueous environments, comprising a body of metal material and a protective coating applied to an outer surface of the body of metal material, intended in use to contact a non-aqueous working fluid...
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WO/2024/071588A1 |
The objective of the present invention is to provide a hard film-coated cutting tool having excellent welding resistance and wear resistance. In order to achieve the above objective, the cutting tool provided by the present invention has...
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WO/2024/071868A1 |
A deposition mask according to an embodiment comprises a metal plate in which a first surface and a second surface opposite to the first surface are defined, wherein the metal plate comprises a deposition area and a non-deposition area, ...
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WO/2024/073368A1 |
Methods for forming a low resistivity ruthenium (Ru) thin film that include depositing ruthenium onto a substrate via ion beam deposition with assist in a process chamber having reactive and noble gas species therein. The substrate is at...
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WO/2024/071297A1 |
This surface treatment device emits negative oxygen ions to treat the surface of an object to be treated, wherein the surface treatment device emits the negative oxygen ions (O–, O2 – etc.) to oxidize the SiC content of the object to...
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WO/2023/119165A9 |
A compound, and a layered semiconductor device comprising a patterning coating provided in a first portion of a lateral aspect of the device, the patterning coating comprising the compound. The patterning coating is adapted to impact a p...
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WO/2024/071704A1 |
A deposition mask according to an embodiment comprises a metal plate including a deposition area and a non-deposition area. The metal plate has a first direction defined as the longitudinal direction and a second direction defined as the...
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WO/2024/071048A1 |
A metal mask (10) comprising a mask plate (20) and a coating member (30) that coats regions of the mask plate (20). The mask plate (20) has: one or more openings (22) for forming a membrane; and multiple marks (23) for detecting deformat...
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WO/2024/071484A1 |
The present specification relates to a method for manufacturing antiviral fabric, and antiviral fabric manufactured thereby, the method comprising the steps of: pretreating fabric; and forming a metal layer on one side or both sides of t...
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WO/2024/070473A1 |
A film formation device according to the present invention is provided with: a film formation source which discharges a film formation material toward a substrate through a mask located between the film formation source and a film-formin...
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WO/2024/071087A1 |
This mask manufacturing method comprises: a laminate preparation step for preparing a laminate including an inorganic layer containing an inorganic first surface, an inorganic second surface which is a surface on the reverse side of the ...
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WO/2024/071705A1 |
A metal plate, according to an embodiment, comprises: first regions containing iron (Fe), nickel (Ni), oxygen (O), and chromium (Cr), and including a surface; and a second region between the first regions, wherein the first regions are f...
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WO/2024/071578A1 |
A magnetron sputtering apparatus according to an embodiment of the present invention may comprise: a chamber in which a sputtering gas is held and which provides an inner space where a workpiece is placed; an ion source unit which includ...
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WO/2024/071867A1 |
A metal plate according to an embodiment has a length (L) of 900-1,100 mm, a width (W) of 290-300 mm and a thickness (T) of 15-100 μm. The metal plate comprises invar, a unit metal plate having a unit size of L*W*X is formed by controll...
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WO/2024/071315A1 |
This method for producing a mask comprises: a laminate preparation step for preparing a laminate including a laser-blocking layer that contains a plurality of light-transmitting holes and a resin layer that covers the laser-blocking laye...
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WO/2024/066146A1 |
Disclosed in the present application are a mask frame and a mask assembly. The mask frame comprises a body and a bearing block assembly, wherein the body has an evaporation opening and an entity region around the evaporation opening; the...
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WO/2024/068143A1 |
Deposition of a material such as indium in the form of nitrided thin layers, by evaporation and dual activation using a nitrogen plasma (41) and an electron beam (42).
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WO/2024/071026A1 |
Provided is a substrate with a conductive film which can inhibit changes in flatness in a reflective mask and a reflective mask blank for EUV lithography having a conductive film. This substrate with a conductive film includes a substr...
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WO/2024/063157A1 |
[Problem] To provide: a novel sliding member which exhibits chipping resistance and wear resistance, has excellent peel resistance, can achieve the reduction in friction, is particularly less likely to undergo chipping or cracking, and c...
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WO/2024/061152A1 |
The present application relates to the technical field of sensing, in particular to an ultrasonic sensing device and a manufacturing method therefor, for use in solving the technical problems that existing piezoelectric ultrasonic sensin...
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WO/2024/060425A1 |
The present application provides a CIGS solar cell and a preparation method therefor. The CIGS solar cell comprises a soda-lime glass substrate, a Mo back electrode, a CIGS absorption layer, a CdS buffer layer, an i-ZnO and AZO window la...
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WO/2024/060009A1 |
The present application relates to a high mechanical strength polymer thin film. The high mechanical strength polymer thin film comprises, by mass percentage, 95%-99% of polyester and 1%-5% of an auxiliary agent. The number average molec...
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WO/2024/060293A1 |
A vacuum outer plating module for a plastic ampoule. The module comprises: an electrostatic implantation assembly (110), which is used for implanting static electricity in the surface of the plastic ampoule; a sealing assembly (120), whi...
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WO/2024/062801A1 |
This film forming apparatus is provided with: a substrate supporting means which supports a substrate; an alignment means which performs an alignment of the substrate and a mask; and a vapor deposition means which discharges a vapor depo...
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WO/2024/060342A1 |
A method for improving thermal cycle reliability of an aluminum nitride direct-bonded aluminum packaging substrate, comprising: performing surface sputtering-based copper plating on an aluminum nitride direct-bonded aluminum ceramic subs...
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WO/2024/064407A1 |
An etched logo is provided at a location within the layers. This etched section is viewable to the user on the working surface as a form of insignia (logo, trademark, letters, words, serial numbers, designs, patters, artwork, and the lik...
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WO/2024/062613A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/062612A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/062802A1 |
This mask has an opening for forming a film of a pattern made of a vapor deposition material on a substrate and includes a mask body made of a non-magnetic substance and having the opening and a magnetic body formed on the mask body.
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WO/2024/062611A1 |
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layer...
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WO/2024/063431A1 |
A mask assembly, which is used in thin film processing, may comprise: a metal sheet including a grid-shaped frame area and a plurality of opening forming areas disposed inside the grid and each having a plurality of openings formed there...
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WO/2024/060292A1 |
The present invention discloses an internal vacuum coating module for a packaging lid. A convex ring for being inserted into a container protrudes from the inner top wall of the packaging lid and encloses with the inner top wall of the p...
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WO/2024/064662A2 |
A variable hardness nanocomposite coating and method for its production. The variable hardness nanocomposite coating can be applied as a single layer on metallic engine components that require a break-in to achieve physical mating of int...
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WO/2024/060423A1 |
A surface modification method and device for a CIGS solar cell. The method comprises: starting a microwave power source (131) to ionize an inert gas in a microwave plasma generation chamber (132) so as to generate microwave plasma, bring...
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WO/2024/057827A1 |
This electroconductive film comprises an electroconductive film body and a metal layer. The electroconductive film body contains a resin and an electroconductive material. The metal layer is layered on the electroconductive film body. Wh...
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WO/2024/057665A1 |
The present invention addresses the problem of providing: a metallized film that, even when a conductive thin film layer is formed on a resin surface, can be conveyed without breakage, without increasing contact resistance; and a method ...
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WO/2024/056307A1 |
The present invention relates to a cutting blade and to a method for the production thereof. The cutting blade comprises a metal substrate having a first cutting surface and a second cutting surface, which include a cutting edge, wherein...
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WO/2024/055355A1 |
A preparation method for a bismuth oxide film and a reconfigurable photoelectric logic gate. The phenomenon that the open-circuit photovoltage varies non-monotonically over the light intensity is discovered for the first time, and, by us...
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WO/2024/057802A1 |
This film forming apparatus is provided with: an evaporation source which comprises a heatable material container containing a vapor deposition material, and which forms a film on a substrate, while moving; and a control means which cont...
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WO/2024/058643A1 |
In an electronic device comprising a housing, according to various embodiments of the present disclosure, the housing may comprise: an aluminum substrate; a thermal spray coating layer formed on the aluminum substrate and including a fir...
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WO/2024/056624A1 |
Energy refeeding module (15) for a switching circuit (101) with a switching unit (24) configured to be connectable to a DC voltage source (V1) and to deliver at its output (OUT) one or a combination of the following features: iv) high va...
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WO/2024/057671A1 |
Provided are: a sputtering target for oxide semiconductor thin film formation with which can be formed an oxide semiconductor thin film suitable for an active layer with both high mobility and a high band gap; a method for producing the ...
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WO/2024/056313A1 |
A process to deposit nanolaminates on a surface of a flat substrate, the process comprising the following steps : - mounting the substrate (s) in a vacuum process system on a substrate support in a peripheral region (R) of a holder, the ...
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