Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2024/079890
Kind Code:
A1
Abstract:
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layers stacked in an alternating manner; each first unit layer is composed of AlaCr1-a-bCebN; a is more than 0.400 but no more than 0.800; b is 0.001 to 0.100 inclusive; each second unit layer is composed of AlcV1-cN; c is 0.30 to 0.75 inclusive; and a and c satisfy the relationship a>c.

Inventors:
FUKUI HARUYO (JP)
TSUKIHARA NOZOMI (JP)
PASEUTH ANONGSACK (JP)
TABATA TOSHIHIRO (JP)
Application Number:
PCT/JP2022/038392
Publication Date:
April 18, 2024
Filing Date:
October 14, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23B27/14; B23C5/16; C23C14/06
Foreign References:
JP2004269985A2004-09-30
JP2005022023A2005-01-27
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:



 
Previous Patent: CUTTING TOOL

Next Patent: CUTTING TOOL