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Patent Searching and Data


Title:
EVAPORATION SOURCE, FILM FORMING DEVICE, AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/090178
Kind Code:
A1
Abstract:
Provided are an evaporation source, a film forming device, and a film forming method which enable suppression of variation in film-forming characteristics.  An evaporation source 300 forms a film while moving relatively to a substrate, and is characterized by comprising: a nozzle 332 from which a material that has evaporated or sublimated by heating a film-forming material M accommodated in a material container is jetted; and a cylindrical member 333 that is disposed so as to surround the outer circumference of the nozzle 332.

Inventors:
HARA YUTARO (JP)
TAKAHASHI TATSUYA (JP)
TSUJINO KAZUYA (JP)
Application Number:
PCT/JP2023/036492
Publication Date:
May 02, 2024
Filing Date:
October 06, 2023
Export Citation:
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Assignee:
CANON TOKKI CORP (JP)
International Classes:
C23C14/24
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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