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WO/2024/095812A1 |
The present invention provides a circuit board which is configured such that gaps in a wiring pattern are filled with a resin and in which attachment of the resin to the surface of the wiring pattern is easily prevented or suppressed. ...
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WO/2024/094901A1 |
The present disclosure relates to a circuit board for transmitting and/or receiving electromagnetic waves, the circuit board comprising : - a linear array of N connectors, where N is equal to at least four, each connector being suitable ...
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WO/2024/096377A1 |
A heating fiber having a plurality of through holes comprises a fiber fabric, a fiber circuit, and a heating element pattern. The fiber circuit includes a first wire and a second wire. Each of the first and second wires is formed by weav...
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WO/2024/096131A1 |
This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second...
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WO/2024/094434A1 |
There is described a component carrier (100), comprising: i) a stack (101) comprising at least two electrically conductive layer structures (130, 130') and at least one electrically insulating layer structure (102); ii) a plurality of co...
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WO/2024/093585A1 |
The present disclosure provides a display device. The display device comprises a display panel, a flexible circuit board, and a driving chip; the display panel comprises a display region and a non-display region bent to the back side of ...
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WO/2024/094430A1 |
There is described a component carrier (100), comprising: i) a stack (110) comprising at least two electrically conductive layer structures (130, 131) and at least one electrically insulating layer structure (102); ii) an electrically co...
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WO/2024/097676A1 |
Systems and methods are disclosed for routing differential communication lines to different integrated circuits based on printed circuit board (PCB) unit variants. In one example, a system for routing signals comprises a location for mou...
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WO/2024/076802A3 |
In-Substrate Structures (ISS) and isolation regions, including, but not limited to Through Metal Vias (TMV), Dielectric Isolation Vias (DIV), and Dielectric Isolation Pockets (DIP) formed in a metal substrate to provide enhanced operatio...
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WO/2024/093022A1 |
A fine-line circuit board based on a semi-additive process, a preparation method therefor, a surface treatment method, and a use, which relate to the technical field of chip packaging. An embodiment comprises the following steps: 1) carr...
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WO/2024/045735A9 |
Embodiments of the present application provide a computing node and a computing apparatus. The computing node comprises a mainboard and a current conducting structure, and an electronic device is mounted on a first surface of the mainboa...
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WO/2024/095422A1 |
The purpose of the present invention is to provide an electronic control device with which the long-term reliability of the soldered section between a leadless package and a circuit board can be ensured. An electronic control device 1 co...
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WO/2024/095641A1 |
Provided are: a polymer film comprising a layer A and a layer B provided on at least one surface of the layer A, wherein the layer A comprises a polymer having a dielectric tangent of 0.01 or less, the layer B has a moisture permeability...
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WO/2024/095742A1 |
The present disclosure provides a curable composition from which it is possible to obtain a resin which has excellent adhesiveness to substrates, which has excellent heat resistance, and in which the dielectric loss tangent (Df) at high ...
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WO/2024/097615A1 |
A ball-grid-array assembly (BGA assembly) includes: a printed circuit board having: outer Non-Solder-Mask-Defined (NSMD) pads that are positioned close to edges, including close to a plurality of corners, of the BGA footprint on the prin...
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WO/2024/094544A1 |
There is described a single component carrier (100), comprising: a stack (101) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (102), wherein the at least one...
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WO/2024/095967A1 |
A wiring board according to an embodiment of the present invention comprises: a first wiring board 11 including first insulating layers 111, first conductor layers 112, and first via conductors 113; and a second wiring board 12 including...
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WO/2024/089380A1 |
A controlled environment agriculture lighting assembly includes RGBs arranged in series with each other, each PCB including a PCB substrate having at least one lighting channel comprising LEDs mounted to the substrate, and a plurality of...
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WO/2024/090410A1 |
Provided is a resin composition with which a novel cured product can be achieved. Also provided are the cured product, a prepreg, a metal-foil-clad laminate board, a resin composite sheet, and a printed wiring board. The resin compositio...
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WO/2024/090990A1 |
Disclosed is an electronic device comprising wirings. The electronic device according to various embodiments of the present invention, which comprises a plurality of wirings carrying DC power and at least one RF signal, may comprise: an ...
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WO/2024/090409A1 |
Provided are: a resin composition capable of providing a novel cured product; a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; and a printed wiring board. The present invention provides a resin composition...
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WO/2024/087697A1 |
A layout scheme of a data transmission wiring, and a main board and an electronic device. The data transmission wiring comprises a first clock pair signal line (20), a first data pair signal line (30) and a first matching line (41). The ...
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WO/2024/091846A1 |
Single-chip solutions and related methods that result in much higher capacitance densities than is achievable with current on-chip solutions and which reduce consumption of planar area of a mounting structure. Embodiments of the present ...
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WO/2024/090291A1 |
Provided are an adhesive composition that has excellent adhesion and solder heat resistance, exerts excellent adhesion even after being exposed to high temperatures for a long period of time, and has good circuit embeddability while supp...
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WO/2024/090348A1 |
One embodiment of the present invention provides a stretchable device including: a stretchable base material; a plurality of flexible first conductive parts provided on the stretchable base material and separated from each other; and str...
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WO/2024/088555A1 |
The disclosure relates to a semiconductor package (100) comprising: an integrated circuit (140) comprising at least one first connection terminal (141) and at least one second connection terminal (143); an encapsulant (150) encapsulating...
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WO/2024/090408A1 |
The present invention provides a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, and a printed wiring board. Provided is a resin composition comprising: a polymaleimide compound (A); an...
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WO/2024/090394A1 |
Provided is a laminated structure from which a cured product having a low-roughness surface, excellent plating adhesion, and excellent heat resistance can be formed. The laminated structure according to the present invention comprises a ...
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WO/2024/089948A1 |
Provided is an electronic component and an electronic component mounting structure that can suppress cracking. This electronic component comprises a component body 10 having a length direction L, and a first external electrode 21 and a...
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WO/2024/087201A1 |
Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow elect...
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WO/2024/088494A1 |
The disclosure relates to a semiconductor package (100) comprising an electronic chip (140);an encapsulant (150) encapsulating at least part of the at least one electronic chip (140); a first metal layer (110) placed upon at least one of...
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WO/2024/088993A1 |
The invention relates to a method for producing an electrical circuit (2) for an electric motor, wherein a printed circuit board (4) with a printed circuit board cutout (16) and an electronic component (6) with an electrical connection (...
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WO/2024/087916A1 |
Disclosed in the present invention are a manufacturing method for a metallic aluminum circuit board, and a metallic aluminum circuit board and a circuit board module. The manufacturing method comprises: preparing an aluminum-coated subst...
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WO/2024/087283A1 |
The present application relates to the technical field of composite materials, and in particular, to a low-transmission-loss copper-based composite material and a preparation method therefor, a PCB and an electronic component. The low-tr...
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WO/2024/092246A1 |
Electronic stickers comprising at least one electronic component and conductive pads in electrical contact with the electronic component are provided. The electronic components are associated with a first side of the sticker, and an adhe...
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WO/2024/090396A1 |
The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according...
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WO/2024/087238A1 |
The present invention relates to a glass-based backlight plate for Mini LED display and a manufacturing method. The glass-based backlight plate comprises two glass circuit boards each having circuit surfaces on both sides, wherein the tw...
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WO/2024/090364A1 |
[Problem] To provide a multilayer body which has excellent heat dissipation performance in the thickness direction, excellent thermal diffusibility in the in-plane direction, and excellent electrical insulation performance in the thickne...
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WO/2024/090510A1 |
[Problem] The present invention provides a multilayer body which is capable of efficiently forming an insulating layer that has achieved a good balance between excellent via formability and high dielectric characteristics. [Solution] D...
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WO/2024/089430A1 |
A switching unit for a power control unit is disclosed, comprising at least one power supply node for connection to a power supply, at least one load node for connection to a load, an electrical current path configured to connect the at ...
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WO/2024/088470A1 |
The aim of the invention is to reduce the complexity required to mechanically connect at least two printed circuit board plug connectors together in a reversible manner. This is achieved by a device (1) which has at least one introductio...
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WO/2024/088486A1 |
The aim of the invention is to provide a reliable measuring behaviour in a wide variety of environmental conditions using structurally simple means. This is achieved in that a sensor (1) for measuring a distance or a position, in particu...
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WO/2024/085620A1 |
A camera module according to an embodiment comprises: a first substrate having a first terminal part; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device which is disposed on the...
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WO/2024/084847A1 |
In the present invention, a spacer (1) having a columnar shape is mounted such that a circular conductor pattern (5) corresponding to a bottom end surface (1b) of the spacer (1) is formed on a circuit board (4), a resist (6) is formed ar...
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WO/2024/084830A1 |
Provided is an electronic device capable of preventing cracking in a base material that occurs from a starting point between metal wiring patterns in a flexible portion of a multilayer wiring board. An electronic component is mounted on ...
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WO/2024/085511A1 |
A smart IC substrate, according to an embodiment, comprises: a base including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; an...
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WO/2024/085047A1 |
A multilayer polyimide film (10) comprises a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) that is disposed on at least one surface of the non-thermoplastic polyimide layer (11). The thermoplastic polyim...
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WO/2024/051603A9 |
The present application relates to the technical field of electronic devices, provides an electronic device, and solves the problem of interference to antenna signals caused by coupling inside electronic products. The electronic device c...
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WO/2024/085727A1 |
The present invention relates to a board for electronic parts, a method for manufacturing the board for electronic parts, and a display and a semiconductor device which include the board, the board comprising: a substrate including at le...
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WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
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