MULTI-LEVEL & MULTI-SCALE MIMO BEAMFORMER USING COGNITIVE ASIC FRONT-END -MODULE S

Technical field

[ 0001 ] The present disclosure relates generally to the field of electromagnetic wave transmission and reception, and in particular to a multiple-input , multiple-output (MIMO) circuit board for transmitting and/or receiving electromagnetic waves .

Background art

[ 0002 ] A large-scale beam forming network is traditionally built using a large BOB with antenna elements on the front and beam forming and splitting electronics on the rear . This comes with a lot of problems :

- A new large custom circuit board is required for every single array change whether it be redistribution of antenna elements or change in array si ze . This means that a new configuration can very expensive ( costing thousands of euros ) with many hours of development work .

- The yield of the array can be low i f there is a single manufacturing issue .

- The layer stack for a board is highly complex given the number of control signals that are required .

- Thermal management is tough when so much power i s dissipated in a single board .

- Channel to channel isolation is poor in such a design .

- MIMO Auto-Correlation and Cross-Correlations

- Energy-Ef ficient

- Fast Digital control and Synchroni zation .

Summary of Invention [ 0003 ] Multi-Level and Multi-Scale Multi- Input-Multi-Out (MIMO) Beamforming systems integrating Cognitive AS IC Front- End-Modules are proposed . This new adaptive and scalable architecture solution leads to the following attributes which solve the aforementioned issues/problems :

- The proposed system makes use of hierarchical design . A module is built which provides unitary 8 channels Transmit and Receive Font-End-Modules . This module is assembled into an 8x8 formation to make 64 channels ( in Transmit and Receive modes ) . Four of these modules can then be used to create a 256 element array . Combining 8 of the resulting assembly leads to 512 element array . This hierarchical system allows the testing and validation to be done at a module level and reduce the risk associated with handling a large MIMO arrays . This Multi-Scale partitioning integration and assembly strategy .

- The Multi-Scale and Multi-Level integration and assembly uses Cognitive-AS IC solution embedding Correlation-based Signal-Processing for array MIMO systems . AS IC-embedded Connectors are introduced for co-design and co-integration of adaptive Front-End-Modules including Correlation-Tuners ( CT ) with Antenna-in-Package (AiP ) modules . The CT functionality is used for real-time interf erences/couplings mitigation . AS IC-embedded connectors are used for building scalable and conformal Beamforming antenna-arrays for MIMO/Massive-MIMO applications .

Brief description of drawings

[ 0004 ] The foregoing features and advantages , as well as others , will be described in detail in the following description of speci fic embodiments given by way of illustration and not limitation with reference to the accompanying drawings , in which :

[ 0005 ] Figure 1 illustrates a multi-level and multi-scale MIMO architecture with partitioned states according to an embodiment of the present disclosure ;

[ 0006 ] Figure 2A illustrates a circuit board of Figure 1 in more detail according to an embodiment of the present disclosure ;

[ 0007 ] Figure 2B illustrate a multi-level and multi-scale MIMO architecture with correlated partitioned states according to an embodiment of the present disclosure ;

[ 0008 ] Figure 3 illustrates a multi-level and multi-scale MIMO architecture with adaptive array sampling according to an embodiment of the present disclosure;

[ 0009 ] Figure 4 illustrates a unitary 1x8 transmit-receive module with isolated pockets and energy-harvesting according to an embodiment of the present disclosure ;

[ 0010 ] Figure 5 illustrates a unitary 1x8 transmit-receive module with thermal harvesting using heat-pipes according to an embodiment of the present disclosure ;

[ 0011 ] Figure 6 illustrates a unitary 1x8 transmit-receive module with isolated pockets and energy-harvesting according to an embodiment of the present disclosure ;

[ 0012 ] Figure 7 illustrates an 8x8 transmit-receive system with heat-sink and reconfigurable surface or volume according to an embodiment of the present disclosure ;

[ 0013 ] Figure 8 illustrates an 8x8 transmit-receive system with single-beam configuration according to an embodiment of the present disclosure ; [ 0014 ] Figure 9 illustrates an 8x8 transmit-receive system with multi-beam configuration according to an embodiment of the present disclosure ;

[ 0015 ] Figure 10 is a graph illustrating return loss as a function of frequency for an 8x8 Elements Antenna Using WLCSP RDL AiP Technologies , according to an embodiment of the present disclosure ;

[ 0016 ] Figure 11 illustrates build-up of a 1024 MIMO array based on MOSAIC-partitioning according to an embodiment of the present disclosure ;

[ 0017 ] Figure 12 illustrates an 8x8 transmit-receive system with a multi-beam 6- faced cubic configuration according to an embodiment of the present disclosure ;

[ 0018 ] Figure 13A illustrates an 8x8 transmit-receive system with multi-beam lens-based configuration according to an embodiment of the present disclosure ;

[ 0019 ] Figure 13B illustrates part of the system of Figure 13A in more detail according to an embodiment of the present disclosure ;

[ 0020 ] Figure 14 illustrates an 8x8 transmit-receive system with spin-wave array according to an embodiment of the present disclosure ;

[ 0021 ] Figure 15 illustrates an 8x8 transmit-receive system with circular and cylindrical arrays partitioning according to an embodiment of the present disclosure ;

[ 0022 ] Figure 16 illustrates an 8x8 transmit-receive system with metasurface and metavolume Configuration according to an embodiment of the present disclosure ;

[ 0023 ] Figure 17 illustrates an 8x8 transmit-receive system with auto-calibration functionality according to an embodiment of the present disclosure ; [ 0024 ] Figure 18 illustrates an 8x8 transmit-receive system with splitting/combining partitioned states according to an embodiment of the present disclosure ;

[ 0025 ] Figure 19 illustrates an 8x8 transmit-receive system with controlled fan thermal-management according to an embodiment of the present disclosure ;

[ 0026 ] Figure 20 illustrates an 8x8 transmit-receive system with fan- free thermal harvesting according to an embodiment of the present disclosure ;

[ 0027 ] Figure 21A illustrates an aggregation of beamformer modules without up/down-converters using time and frequency domain based correlators according to an embodiment of the present disclosure ;

[ 0028 ] Figure 21B illustrates an aggregation of beamformer modules with up/down-converters using time and frequency domain based correlators according to an embodiment of the present disclosure ;

[ 0029 ] Figure 22 illustrates a single polari zation, single beam configuration according to an embodiment of the present disclosure ;

[ 0030 ] Figure 23 illustrates a switched polari zation, single beam configuration according to an embodiment of the present disclosure ;

[ 0031 ] Figure 24 illustrates a dual polari zation, single beam per polari zation configuration according to an embodiment of the present disclosure ;

[ 0032 ] Figure 25 illustrates a dual polari zation, dual beam configuration according to an embodiment of the present disclosure ;

[ 0033 ] Figure 26 illustrates the buildup of a correlationbased 512 MIMO array based on MOSAIC-partitioning assembled using scalable re-distribution-layers according to an embodiment of the present disclosure ;

[ 0034 ] Figure 27A illustrates smart-transitions with low- loss composite-waveguiding for RF/mmWave MIMO systems in RX and TX according to an embodiment of the present disclosure ;

[ 0035 ] Figure 27B illustrates smart-transitions with low- loss composite-waveguiding for RF/mmWave MIMO systems including 3D Sensors according to an embodiment of the present disclosure ;

[ 0036 ] Figure 28 illustrates a multi-beam correlator front- end-module for MIMO adaptive-array signal-processing using EVM metrics according to an embodiment of the present disclosure ;

[ 0037 ] Figure 29 illustrates a system for interferometric correlation-based energy sensing according to an embodiment of the present disclosure ;

[ 0038 ] Figure 30 illustrates a scalable 8x8 beamformer mounted on a robotic system according to an embodiment of the present disclosure ;

[ 0039 ] Figure 31 illustrates a system for dual-beam correlation measurements according to an example embodiment of the present disclosure ; and

[ 0040 ] Figure 32 illustrates a system for correlation-based EVM millisecond testing according to an embodiment of the present disclosure .

Description of embodiments

[ 0041 ] Like features have been designated by like references in the various figures . In particular, the structural and/or functional features that are common among the various embodiments may have the same references and may dispose identical structural , dimensional and material properties . [0042] For the sake of clarity, only the operations and elements that are useful for an understanding of the embodiments described herein have been illustrated and described in detail.

[0043] Unless indicated otherwise, when reference is made to two elements connected together, this signifies a direct connection without any intermediate elements other than conductors, and when reference is made to two elements coupled together, this signifies that these two elements can be connected or they can be coupled via one or more other elements .

[0044] In the following disclosure, unless indicated otherwise, when reference is made to absolute positional qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or to relative positional qualifiers, such as the terms "above", "below", "higher", "lower", etc., or to qualifiers of orientation, such as "horizontal", "vertical", etc., reference is made to the orientation shown in the figures.

[0045] Unless specified otherwise, the expressions "around", "approximately", "substantially", "nearly" and "in the order of" signify within 10 %, and preferably within 5 %.

[0046] Figure 1 illustrates a multi-level and multi-scale multiple-input, multiple-output (MIMO) architecture 100, for example having partitioned states, according to an embodiment of the present disclosure.

[0047] The MIMO architecture 100 for example comprises one or more circuit boards 102 each configured to transmit and/or receive electromagnetic wave signals for example having frequencies in the range 1 to 150 GHz. Each circuit board 102 for example comprises an input I/P, and N input/output 107, where N is for example equal to 8 in the example of Figure 1, but is for example equal to at least 4.

[0048] The N input /output s of the circuit board 102 are for example coupled to corresponding input/outputs 108 of an emission and/or reception interface 106 comprising for example emitting and/or transmitting elements and/or an emitting and/or receiving surface or volume. For example, the interface 106 is implemented by antennas, by a metasurface or metavolume, by one or more spinwave sensors, by one or more nanotubes, and/or by one or more microtubules.

[0049] The MIMO architecture 100 may comprise a single circuit board 102, or a stack 103 of M circuit boards, where M is for example equal to at least two. In the example of Figure 1, the architecture 100 comprises a stack of 8 circuit boards .

[0050] In the case that the MIMO architecture 100 comprises multiple circuit boards 102, a splitter 110 is for example provided for splining an input signal IN into an input signal to each of the circuit boards 102.

[0051] Each circuit board 102 for example comprises a signal processing circuit 104, which is for example implemented by an ASIC (Application Specific Integrated Circuit) , such as a cognitive ASIC, which is configured to generate the signals to each of the N input/outputs of the circuit board 102. For example, in some embodiments, the circuit 104 receives the input signal I/P after it has been split into two signals by a splitter 105. Each circuit board 102 also for example comprises a DC-DC converter and adaptative body-biasing (ABB) circuit 112 and a low voltage differential signaling converter and control circuit 114. The MIM architecture 100 for example comprises a control and power circuit 116 configured to provide , for example supply voltages and control signals to the circuits 112 and 114 .

[ 0052 ] As illustrated on the right-hand side in Figure 1 , each circuit board 102 for example comprises a connector 118 configured to receive the input signal I /P, and a connector 120 configured to transmit each of the output signals O/P . For example , the connectors are implemented by an RF connector, such as an SMPM ( Sub-Miniature Push-on Micro ) connector .

[ 0053 ] Figure 2A illustrates a circuit board of Figure 1 in more detail according to an embodiment of the present disclosure . The connector 118 for example comprises a pin connected via a conductive trace to an input of the processing circuit 104 . Corresponding input/outputs of the processing circuit 104 are coupled to each of the connectors 120 providing the input/output signals 107 .

[ 0054 ] Among other components , the circuit 112 ( SMART BIAS ING) is for example formed in one portion 201 of the circuit board 102 , and in another portion 202 of the circuit board 102 , a digital signal processing circuit ( Smart DSP ) 204 is for example formed . The first and second portions 201 , 202 are for example separated from each other by an electromagnetic shielding in which the conductive trace between the connector 118 and the processing device 104 is formed .

[ 0055 ] Figure 2B illustrate a multi-level and multi-scale MIMO architecture 200 with correlated partitioned states according to an embodiment of the present disclosure . In particular, the architecture 200 for example comprises a first circuit board 102 in a partition state 1 ( Partition State- 1 ) , and a second circuit board 102 in a partition state 2 ( Partition State-2 ) . The circuit boards 102 are for example coupled to a correlation-based combining/ splitting circuit 202 configured to interface with the circuit boards via the connectors 120 of each circuit board 102 . For example , the circuit 202 is coupled to an RF/mmWave correlator circuit 204 , comprising a controller 206 , for example implemented by FPGA ( Field Programmable Gate Array) . The controller 206 is for example coupled via probe-array controller GPIO ( General- Purpose Input/Output ) lines 207 to a spectrum analyzer 212 ( Scope Spectrum [VNA] ) , such as a vector network analyzer, the lines 207 for example comprising a VNA Trig output line 208 and a VNA Trig Input line 210 . The spectrum analyzer 212 is further coupled to the correlator circuit 204 , and to a user application 214 via an application interface (API ) 216 .

[ 0056 ] Figure 3 illustrates a multi-level and multi-scale MIMO architecture 300 with adaptive array sampling according to an embodiment of the present di sclosure . For example , the emission and/or reception interface 106 is coupled to a plurality of circuit boards 102 ( three in the example of Figure 3 ) and to a cognitive correlator circuit 304 , comprising a controller 306 , for example implemented by FPGA. The controller 306 is for example coupled via probe-array controller GPIO lines 307 to an adaptive array-based sampling circuit 312 . The lines 307 for example comprise a VNA Trig output line 308 and a VNA Trig Input line 310 . The sampling circuit 312 is further coupled to the correlator circuit 304 , and to a user application 314 via an application interface (API ) 316 .

[ 0057 ] Figure 4 illustrates a unitary 1x8 transmit-receive module implemented by the circuit board 102 , with isolated pockets and energy-harvesting according to an embodiment of the present disclosure . In particular, Figure 4 is a perspective view showing the isolated portions 201 , 202 , which are for example shielded by a metallic and/or resin-based shielding portion 406 that extends over the trace linking the connector 118 to the processing circuit 104 (hidden in Figure 4 ) , this shielding also for example providing shielding for the processing circuit 104 (AS IC Shielding) . While not illustrated in Figure 4 , a lid is for example fitted over the circuit board 102 of Figure 4 , which that raised metallic/resin-based shielding sections that extend around each of the portions 201 , 202 are closed, thereby creating an isolated pocket for each portion 201 , 202 with Faraday-Cage isolation . For example , the shielding sections are formed at least partially of an RF shielding resin . Furthermore , the channels transmitted over traces to each of the connectors 120 are for example isolated by a waveguiding implementation of Faraday-Cages I solation 404 , that for example provides channel-to-channel coupled below - 100 dB .

[ 0058 ] The module of Figure 4 also for example comprises supports 408 extending from each of the sides of the module substantially in line with the processing device 104 . The supports 408 for example provide support for heat-pipes (not illustrated in Figure 4 ) used for thermal energy harvesting .

[ 0059 ] Figure 5 illustrates a unitary 1x8 transmit-receive module 500 with thermal harvesting using heat-pipes according to an embodiment of the present disclosure . In particular, the perspective view of Figure 5 illustrates the circuit board 102 of Figure 4 with a lid 502 positioned on it , the lid for example forming a heat sink with isolation management . For example , the lid includes a trench formed in line with the supports 408 , such that heat-pipes 504 for energy harvesting can be placed in the trench and be supported by the supports 408 .

[ 0060 ] Figure 6 illustrates the unitary 1x8 transmit-receive module 500 with isolated pockets and energy-harvesting according to an embodiment of the present disclosure . In particular, Figure 6 illustrates the underside of the module 500 , and illustrates the heat-pipes 504 . For ease of illustration, the supports 408 are not illustrated .

[ 0061 ] Figure 7 illustrates an 8x8 transmit-receive system 700 with heat-sink and reconfigurable surface or volume according to an embodiment of the present disclosure . In particular, in the example of Figure 7 , eight modules 500 are stacked so as to form a system having an array of 64 connectors 120 arranged in an 8 by 8 array . A heat sink 702 is for example positioned on one lateral side of the stack, a heat sink 704 is for example positioned on the opposite lateral side of the stack, a heat sink 706 is for example positioned on top of the stack, and a heat sink 708 is for example positioned on the bottom of the stack . While not visible in the perspective view of Figure 7 , the back- facing side of the stack is for example partially covered by a heat sink, and opening being provided for the connectors 118 to be accessible

[ 0062 ] In the example of Figure 7 , the emission and/or reception interface 106 is of similar dimensions to the 8 by 8 array of connectors 120 .

[ 0063 ] Figure 8 illustrates an 8x8 transmit-receive system 800 with single-beam configuration according to an embodiment of the present disclosure . For example , the emission and/or reception interface 106 is implemented by an 8 by 8 array 802 , for example implemented by a smart emitter and receiver surface of dimensions L in the x and y directions , and a pitch of 8 between the emission/reception elements 804 of the array in the x and y directions , where 8 is for example equal to between 3 and 10 mm, and for example substantially equal to 5 mm . For example , the array 802 is excited to produce a single beam (Beamforming) . [0064] Figure 9 illustrates an 8x8 transmit-receive system 900 with multi-beam configuration according to an embodiment of the present disclosure. In particular, the system 900 is similar to the system 800, except that the array 802 is configured to be excited in order to generate multi-beams (Focus Beam Energy) .

[0065] Figure 10 is a graph illustrating return loss (Return- Loss [in dB] as a function of frequency (Frequency (GHz) ) for an 8x8 Elements Antenna, such as the array 802 of Figures 8 and 9, using WLCSP RDL AiP (Antenna in Package) Technologies, according to an embodiment of the present disclosure. The curves in the graph represent the return loss at each of the 64 antennas, and it can be seen that a relatively good return loss of less than -5 dB can be obtained for the large band from 24-32GHz, and return loss of less than -15 dB can be achieved for a band of over 2 GHz in bandwidth.

[0066] Figure 11 illustrates build-up of a 1024 MIMO array based on MOSAIC-partitioning according to an embodiment of the present disclosure. In particular, Figure 11 illustrates examples of antennas implementing the emission and/or reception interface 106, including a single antenna element 1102, a 4 by 4 AiP array 1104, an 8 by 8 AiP array 1106 for example formed by four 4 by 4 arrays 1104, a 16 by 16 AiP array 1108 for example formed by four 8 by 8 arrays 1106, and a 32 by 32 AiP array 1110, for example formed by four 16 by 16 arrays 1108.

[0067] Figure 12 illustrates an 8x8 transmit-receive system 1200 with a multi-beam 6-faced cubic configuration according to an embodiment of the present disclosure.

[0068] Figure 13A illustrates an 8x8 transmit-receive system 1300 with multi-beam lens-based configuration according to an embodiment of the present disclosure. For example, the emission and/or reception interface 106 in the example of Figure 13A is implemented by a front-end module 1300 that comprises the interface 106 and a 3D sub-wavelength patterning generating multiple beams (Beam- 1 , Beam-2 , Beam-3 , Beam-4 ) as described for example in more detail in the publication WO2023/ 180344 published on 28 September 2023 in the name of the present applicant , the contents of which is hereby incorporated by reference .

[ 0069 ] Figure 13B illustrates part of the system of Figure 13A in more detail according to an embodiment of the present disclosure . In particular, Figure 13B schematically illustrates a mmWave multi-beam transmitter 1300 comprising a lattice-based selection matrix according to an example embodiment of the present disclosure . Figure 13B illustrates in particular a front-end module 1300 of Figure 13A, which for example comprises a patterned 3D lens 1302 , an optional integrated lens 1304 , and an antenna array 1306 , which is for example a phased antenna array, comprising switched antennas 1308 implementing the interface 106 . Signals generated by the antenna array 1306 are for example focused by the lens 1304 and by the patterned lens 1302 in order to form one or more beams , Figure 13B illustrating an example of the transmission of four beams Beam- 1 , Beam-2 , Beam-3 and Beam-4 .

[ 0070 ] The FEM of Figure 13B is described in more detail in the publication by S . Wane et al . entitled "Energy-Ef ficient RF-Optics Multi-Beam Systems Using Correlation Technologies : Toward Hybrid GaN-FDSOI Front-End-Modules" , IEEE 2022 , the contents of which is hereby incorporated by reference in its entirety .

[ 0071 ] The patterned lens is for example implemented as described in the publication by X . Lleshi et al . entitled "Wideband Metal-Dielectric Multilayer Microwave Absorber based on a Single Step FDM Process", 2019 49 ^th EuMC, pp . 678- 681, and/or as described in the publication by X.Lleshi et al. entitled "Design and Full Characterization of a 3-D- Printed Hyperbolic Pyramidal Wideband Microwave Absorber", HAL open science, and/or as described in the publication by Sang-Hee Shin et al. entitled "Polymer-Based 3-D Printed 140- 220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly", IEEE Access, Volume 9, 2021, the contents of these three publications being hereby incorporated by reference in their entirety.

[0072] The FEM 1300 further comprises a selection matrix 1310 configured to supply signals from multiple signal paths to the antenna array 1306. For example, the selection matrix is a multi-beam lattice-based selection matrix comprising differential switches, as described in more detail in the publication WO2023/180344. In the example of Figure 13B, the selection matrix receives signals on four paths Path 1, Path 2, Path 3 and Path 4, and directs these signals to four corresponding antennas of the antenna array, although in alternative embodiments, there could be a different number of signal paths, there for example being at least two signal paths. The signals on the signal paths are for example supplied by a signal generation circuit 1312, which is for example a cognitive SDR (software-defined radio) baseband circuit .

[0073] In some embodiments, an FPGA (field-programmable gate array) or the like is configured to receive signals from the signal generation circuit 1312 and to generate control signals for controlling unit cells of the selection matrix 1310.

[0074] In some embodiments, the FEM of the transmitter 200 is further configured to perform heat sink power harvesting and/or correlation-based EVM signal processing. [ 0075 ] In operation, the selection matrix 1310 is for example configured to propagate signals to two antennas 1308 , for example adj acent antennas , of the antenna array 1306 at the same time , the presence of the patterned lens 1302 permitting the formation of a beam that is for example relatively narrow, without the activation of additional antennas . Furthermore , in some embodiments , the selection matrix 1310 is for example configured to propagate signals to multiple pairs of adj acent antennas 1308 of the antenna array 1306 at the same time , such that multiple beams are transmitted in unison .

[ 0076 ] Figure 14 illustrates an 8x8 transmit-receive system 1400 with a spin-wave array according to an embodiment of the present disclosure . In particular, the interface 106 is for example implemented by an array of spin-wave sensors . As known by those skilled in the art , a spin-wave sensor, also known as a spin-electronic sensor, Hall-sensor, or magnetic AMR/PHR (Anisotropic Magneto-Resistance/Planar Hall Resistance ) , is a sensor that is sensitive to magnetic fields . For example , such a device is described in more detail in the European patent application published as EP3208627 by F . TERKI et al . entitled "Measurement system and method for characteri zing at least one single magnetic obj ect" , the contents of which is hereby incorporated by reference .

[ 0077 ] Figure 15 illustrates an 8x8 transmit-receive system 1500 with circular and cylindrical arrays partitioning according to an embodiment of the present disclosure . In particular, according to the example of Figure 15 , the circuit boards 102 are arranged having their n connectors 120 facing inwards towards the center of a Huygens box 1502 having reconfigurable boundaries . For example , a MIMO DUT ( Device Under Test ) is placed within the Huygens box 1502 and implemented by the system 1200 of Figure 12 . The interface 106 is formed by smart broadband probes 1504 formed around the edge of the Huygens box and coupled to the connectors 120 of the circuit boards 102 . The probes 1504 are for example surrounded by absorbers . Entropy extraction is provided towards to cognitive correlators circuit 1510 , which for example embeds stochastic co-array signal processing .

[ 0078 ] Figure 16 illustrates an 8x8 transmit-receive system

1699 with metasurface and metavolume Configuration according to an embodiment of the present disclosure . In particular, in the embodiment of Figure 16 , the system 700 is coupled to the interface 106 formed of 3D smart emitting-receiving conformal obj ects , having a 2D and 3D modulable surface or volume 1602 .

[ 0079 ] Figure 17 illustrates an 8x8 transmit-receive system

1700 in which two systems 700 are placed with their arrays of connectors 120 facing in order to perform auto-calibration functionality according to an embodiment of the present disclosure .

[ 0080 ] Figure 18 illustrates an 8x8 transmit-receive system 1800 with splitting/combining partitioned states according to an embodiment of the present disclosure . In particular, the interface 106 for example comprises a circuit board 1802 permitting the n connectors to be combined to 1 or more input/output pins 1804 , Figure 18 illustrating an example with a single such pin . A socket 1806 mounted on the board 1802 for example permit power to be supplied to the board 1802 , and a connector 1808 mounted on the board 1802 for example provides a control interface .

[ 0081 ] Figure 19 illustrates an 8x8 transmit-receive system 1900 with controlled fan thermal-management according to an embodiment of the present disclosure . In particular, the system 1900 includes the system 700 , combined with the board 802 of Figure 8 with the input/output pin 1804 , and a fan 1902 for thermal management . For example , the fan 1902 is thermally coupled to the heat pipes 504 (not visible in the view of Figure 19 ) .

[ 0082 ] Figure 20 illustrates an 8x8 transmit-receive system 2000 with fan- free thermal harvesting according to an embodiment of the present disclosure . For example , the fan 1902 of Figure 19 is replaced by an energy harvesting module (ENERGY HARVESTING) , which for example comprises an energy harvesting layer 2002 including a bottom thermal conductor 2004 , a top thermal conductor 2006 , P-N j unctions 2008 and internal connections 2012 between the conductors .

[ 0083 ] Figure 21A illustrates an aggregation 2100 of beamformer modules without up/down-converters using time and frequency domain based correlators according to an embodiment of the present disclosure . In particular, in the example of Figure 21A, a plurality of circuit boards 102 are connected by their connectors 118 to a correlator 2102 in time and frequency domains , which is for example coupled in turn to a time and frequency waveform generator 2104 and to a time and frequency domain instrument 2106 via corresponding bidirectional links .

[ 0084 ] Figure 21B illustrates an aggregation 2150 of beamformer modules with up/down-converters using time and frequency domain based correlators according to an embodiment of the present disclosure . The embodiment of Figure 21B is similar to that of Figure 21A, except that the correlator 2102 is coupled to the circuit boards 102 via up/down frequency converters 2152 .

[ 0085 ] Figure 22 illustrates a single polari zation, single beam configuration according to an embodiment of the present disclosure . In particular, Figure 22 illustrates an example of a circuit 2200 implemented within the circuit board 102 for going from the single input/output 107 to multiple input/outputs , which are coupled to antennas 2206 ( implementing the interface 106 ) in the example of Figure 22 . For example , the circuit 2200 comprises a Correlation DSP 2202 comprising a Wilkinson splitter, converting the single input/output 107 to four signals provided to respective bidirectional processing circuits 2204 . Each circuit 2204 for example comprises an input switch SW coupled to the DSP 2202 and an output switch coupled to the antenna 2206 , the input and output switch allowing a selection between a transmission and a reception path, the transmission path comprising a power ampli fier ( PA) , and the reception path comprising a low noise ampli fier ( LNA) . The circuit 2200 also for example comprises a control circuit 2208 .

[ 0086 ] Figure 23 illustrates a switched polari zation, single beam configuration according to an embodiment of the present disclosure . In particular, Figure 23 illustrates an example of a circuit 2300 implemented within the circuit board 102 according to an embodiment similar to that of Figure 22 , except that each circuit 2204 comprises an additional switch SW2 coupled between the output switch and a pair of antennas 2206 .

[ 0087 ] Figure 24 illustrates a dual polari zation, single beam per polari zation configuration according to an embodiment of the present disclosure . In particular, Figure 24 illustrates an example of a circuit 2400 implemented within the circuit board 102 according to an embodiment similar to that of Figure 22 , except that there are two input/outputs 107 , and the circuit 2202 provides outputs to eight circuits 2204 .

[ 0088 ] Figure 25 illustrates a dual polari zation, dual beam configuration according to an embodiment of the present disclosure . In particular, Figure 25 illustrates an example of a circuit 2500 implemented within the circuit board 102 according to an embodiment similar to that of Figure 24 , except that there are eight circuits 2204 , each having two input/output lines coupled between the circuit 2202 and a pair of input switches .

[ 0089 ] Figure 26 illustrates the buildup of a correlationbased 512 MIMO array based on MOSAIC-partitioning assembled using scalable re-distribution-layers according to an embodiment of the present disclosure .

[ 0090 ] Figure 27A illustrates smart-transitions with low- loss composite-waveguiding for RF/mmWave MIMO systems in RX and TX according to an embodiment of the present disclosure .

[ 0091 ] In particular, Figure 27A schematically illustrate a MIMO system 2700 comprising MIMO connectori zed links for interfacing front-end modules 2702 , 2704 in transmission and reception using one or more low-loss polymer waveguides 2706 according to an example embodiment of the present disclosure . Each of the front-end modules 2702 , 2704 for example comprises , for each link, a corresponding MIMO architecture 100 configured to transmit and/or receive signals over the link . For example , Figure 27A illustrates smart-connectors with low-loss polymer-waveguiding for RF/mmWave MIMO systems in RX and TX . The arrangement of Figure 27 is for example used for calibration . The interface between the front-end modules 2702 and 2704 with the waveguides 2706 are for example performed using the multi-pin connectors , and 3D transitions ( TRANSN) that comprise a taper for progressively interfacing the metal pin of the multi-pin connector with the waveguides . The low- loss polymer waveguiding technologies are based on the solutions presented by S . Wane and N . Aflakian in the publication entitled "Photonics Chip-to-Chip Communication for Emerging Technologies : Requirements for Uni fied RE, mmWaves and Optical Sensing" , IEEE Texas Symposium on Wireless and Microwave Circuits and Systems , 2019 . A length L of each waveguide is for example in the range 10 mm to 1 m or more . In some embodiments , the length is equal to at least the wavelength of the signal to be transmitted, such that coupling between the circuits can be prevented . As represented by a cross-section in Figure 27 , each waveguide 2706 for example comprises at least two waveguides ( represented by circles ) for example implemented by hollow tunnels extending through a waveguide material , which is for example polymer based . In some embodiments the waveguides are circular in cross-section, although other forms would be possible . In some embodiments , a number w of waveguides in each waveguide 2706 is equal to the number q of pins in the multi-pin connectors used to interface with the waveguides .

[ 0092 ] Figure 27B illustrates smart-transitions with low- loss composite-waveguiding for RF/mmWave MIMO systems including 3D Sensors according to an embodiment of the present disclosure .

[ 0093 ] In particular, Figure 27B schematically illustrates a MIMO system 2750 for transmission and reception for interfacing 3D Probes/Antennas to polymer-based waveguiding structures . The system 2750 is similar to the system 2700 of Figure 27A, except that the transitions ( TRANSN) using multipin connectors are used for interfacing the MIMI architectures 100 to one or more polymer-based waveguiding structures 2706 . The polymer-based waveguiding structures are connected to MIMO FEM systems using transitions with multi-pin connectors .

[ 0094 ] Figure 28 illustrates a multi-beam correlator front- end-module 2800 for MIMO adaptive-array signal-processing using EVM metrics according to an embodiment of the present disclosure . [0095] Figure 30 illustrates a scalable 8x8 beamformer mounted on a robotic system 3000 according to an embodiment of the present disclosure.

[0096] Figure 31 illustrates a system 3100 for dual-beam correlation measurements according to an example embodiment of the present disclosure.

[0097] Figure 32 illustrates a system 3200 for correlationbased EVM millisecond testing according to an embodiment of the present disclosure.

[0098] Example embodiment 1 : Cognitive Front-End-Modules (FEMs) combined with Smart Emitter & Receiver Surface or Volume Interface for energy-efficient low-complexity multibeamforming systems exploiting sparse partitioned states (Fig.l, Fig.2, Fig.3) :

- Mosaic partitioning strategies exploiting the sparsity of MIMO correlation matrix, open new possibilities for combining multiple arrays into a full array state (FAS) to form one single beam, or for using them to form separate beams in the sub-array state (SAS) .

- Partitioning strategies for states configurations with channels either considered individually, all combined, or partially combined (i.e. grouped or clustered) in accordance with how the sub-arrays may be merged to form simultaneous beams.

- ASIC-embedded connectors reinforced with a base plate machined with a mechanism to allow the extremely high engage and disengage force to be overcome for MIMO/Massive- MIMO systems.

[0099] Example embodiment 2 : Faraday-Cage Isolation strategies and Thermal-Management aware integration and assembly including Energy-Harvesting solutions (Fig.4) : - According to one embodiment, the systems and methods described herein comprise a built-in isolation solution with channel-to-channel coupling below -100 dB . Isolation is for example achieved using an RF absorbing and shielding resin which can be applied to a metal plate in liquid form by means of a 3D printer style adhesion. The material is cured at temperature and when used with spacer stoppers will achieve a 100% RF seal between the metalwork and RGB. The metal lid is for example filled with RF absorber to remove any potential parasitic effects that may exist to reduce switch isolation. The gasket material is for example a material that is thermally conductive.

- Partitioning heat-pipes combined with isolated pockets for Energy-Harvesting in fan-free configuration.

[0100] Example embodiment 3: Co-integration of Beamformers and AiP (Antenna-in-Package) with Correlation-Tuners (CT) for optimal Multi-Beamforming.

[0101] Example embodiment 4 : Co-integration of Beamformers and Metasurfaces or Metavolumes (at Chip, RDL and WLCSP levels) with Correlation-Tuners (CT) for optimal MultiBeamforming .

[0102] Example embodiment 5: Example embodiment 1, 3 and/or 6 combined with interferometric synchronization using Modular MIMO Correlator Modules.

[0103] Example embodiment 6: Example embodiment 5, combined with channel state information including RRC protocol measurement accounting for determining correlation and channel calibration matrix.

[0104] Example embodiment 7 : Example embodiment 6, with EVM testing of Beamformers accounting for Beam-to-Beam correlations . [0105] Example embodiment 8 : Combination of example embodiments 1, 2, 3 and 4, with classical beamformers for hybrid analog-digital multi-beamformers.

[0106] Example embodiment 9: Combination of example embodiments 1, 2, 3 and/or 4 for correlation-based secure quantum sensing-related applications enabling correlation- aware wireless communication systems backed-up by linear and non-linear signal processing operators.

[0107] Example embodiment 10: 3D scalable integration with auto-calibration functionality. The proposed design strategy makes use of the Z direction rather than laying out parts in an XY formation. Each beam former chip will be placed onto a multi-layer board with all the appropriate decoupling capacitors. The chip will need to have local linear regulation as the voltage drop of distances will be too great and there is a probability of low frequency noise coupling. The control and power inputs will be using fast digital buses and a DC rail provided from a regulated power supply.

[0108] Example embodiment 11: The Multi-layer design will be will be mounted into a small metal module to provide heat sinking and RE isolation. The DC and control connections will be made by way of a mini connector (4 lines) . The metal module will be a block sized a tiny bit under 4 wave lengths in the X direction and half a wave length in the Y direction to allow 8 modules to be stacked to form a 8x8 (64 channels module) . The block will be slightly smaller to allow them to be easily placed alongside one another. The block diagram is shown in Figures 1, 2, 3 for single module. The RE output feed lengths will be minimized to reduce the RE loss to as little as possible.

[0109] Example embodiment 12: The proposed ASIC solution contains 2 separate 1:4 chips and requires a splitter/combiner on the input to function as a 1:8 chip. To allow for efficient Power-Supply optimizations, a DC-DC converter is for example required close to the device to minimize voltage drop and loss in the connections. Using an integrated DC-DC close to the chip means that we can raise the supply voltage to high levels (e.g., beyond 24 volts) and therefore reduce the current in the cables. This will allow us to use thinner and smaller cables to each module.

[0110] Example embodiment 13: The digital-bus communication will be converted to LVDS for transmission across to the control board. This is required because single ended signals cannot be used with such high switching currents, the ground loops will be impossible to manage. The DCDC converter can do +24V to 1.8V conversion at up to 3 Amps with 95% efficiency. An image of this is shown in Fig.2. Alternatively, Linear Tech uModule may be used which is around 70% efficient however is very small in size.

[0111] Example embodiment 14: The 8 RE connections in a row which are half a wave length apart will be centered in the row and look like that shown in Figure 5. The RE seal will protrude slightly to allow a good soldered connection to the rear of the antenna panel. The solder shall be indium solder which has a low melting point of 120C. The practical implementation used metal block will be nickel and silver plated to allow soldering. Soldering is carried out by the use of a hot plate-controlled oven. The module will be made with indents in the top to run heat pipes along it and pull the heat to the outside where a large air cooled heatsink can be placed. Some calculations have been made and the heat can successfully be pulled out. [0112] Example embodiment 15: The TX and RX feeds shown in Figure 1, 2, 3, 4 will solder directly to the radiators (antenna, metasurface, metavolumes) .

[0113] The center pin will protrude through the RGB and a solder connection made to pass the RE signal. This will provide an excellent impedance match and near perfect channel to channel isolation. The overall system will consist of the following parts:

- Splitter Board

- 8 x BEN 1 : 8 modules

- Radiator Panel

- FPGA-based DSP Control and Adaptive-Body-Bias Power supply.

[0114] Example embodiment 16: These modules shall be connected together in to a single array of 8x8 (64 elements) . The antenna panel will be of 8x8 configuration. However, the XY dimensions of this module shall allow a grid of 2x2 or even 4x4 to allow a 256 / 1024 antenna array to be created.

[0115] Example embodiment 17: The splitter board will be the main distribution network for the beam former. This is not as trivial as it sounds. The splitter board will, in some cases, require medium power amplifiers and filters to amplify the signal to a suitable level for the beam former chips. Some variable attenuators and a phase shifter may be required to allow finer global control for temperature variation. The schematic of the 8 way splitter board is shown in Fig.18.

[0116] Example embodiment 18: The control board is designed in such a way to allow Beamformer-Network control to be achieved extremely quickly. The end solution will require 8 digital-buses to be controlled simultaneously to minimize beam adjustment time. A lookup table will be required to set the configuration of the beam forming chips depending on the beam direction required.

[0117] Example embodiment 19: A novel approach will be used that is both fast and low cost. Each beam forming chips digital-bus will go to an individual DSP-microprocessor which will hold the specific calibrations for that chip. A common communications link will broadcast a setting to every DSP- microprocessor commanding a particular beam and then each chip will update its beamformer chip at the same moment. Bus speeds of 50MHz (SPI, QUAD-SPI) and higher are possible to each chip and the updating of the array should be the same regardless of the number of chips and elements that are used. This will allow unlimited scaling bound only by size and cost. The control board are built using DC-DC converters to efficiently produce the power supply for the Beamformer- Network chips. A rough view of the proposed 8x8 stack is shown in Fig.19. Heat pipes will be placed between the modules, the radiators will be on one end and the control and RE split/combine the other.

[0118] Example embodiment 20: A transmitter and/or receiver comprising :

- a first aggregator module composed of correlators (Fig.21a and Fig.21 (b) ) and a second splitting/combining module connected to distributed beamformers with and without up/down-converters , each of the beamformers being configured to transmit and/or receive electromagnetic waves, for example in the GHz range, and for example in the wavelength range 1 to 150 GHz.

[0119] Example embodiment 21: The transmitter and/or receiver of example embodiment 20, further comprising:

[0120] Example embodiment 22: a correlator coupled to each of the beamformer MIMO Input/Output channels configured to generate time and frequency domain correlations between: signals generated by a time and frequency waveform generator for transmission via any selected pair of the channels; and/or between signals received via any selected pair of the channels.

[0121] Example embodiment 23: The transmitter and/or receiver of example embodiment 20, further comprising:

- single polarization, single beam (Fig.22)

- switched polarization, single beam (Fig.23)

- dual polarization, single beam per polarization (Fig.24)

- Architecture-4: Dual polarization, Dual beam (Fig.25)

[0122] Example embodiment 24: The transmitter and/or receiver of example embodiment 23, further comprising:

- Buildup of Correlation-based massive MIMO Array based on MOSAIC-Partitioning Assembled Using Scalable Re- Distribution-Layers. Fig.27 illustrate the practical case of 512 MIMO array with synchronized correlator modules.

- Smart-Transitions with Low-Loss Composite-Waveguiding for RF/mmWave MIMO Systems (Fig.28 (a) ) in RX and TX including 3D Sensors (Fig.28 (b) ) .

- Multi-Beam Correlator Front-End-Module for MIMO Adaptive- Array Signal-Processing Using EVM (Error Vector Magnitude) Metrics .

TECHNICAL APPENDIX A: CORRELATION FUNCTIONS FOR STOCHASTIC FIELDS

[0123] The cross-correlation function of stationary stochastic signals SA(t) and SB(t) is defined by the following equation, where the brackets denote the ensemble average: [0124] Figure 29 illustrates a system 2900 for interferometric correlation-based energy-sensing.

[0125] The correlation matrix in the frequency domain can be expressed as a function of the time-windowed signal S _T (t):

C(T)

The superscript t refers to the Hermitian conjugate operation.

[0126] For a given frame, the power spectra of the signals can be deduced from the correlation matrix C(t) :

[0127] Assuming signals and noise contributions are uncorrelated, by applying the Expectation operator E [ . ] , the following relations can be derived: where P _SA and P _Noise are respectively the signal (channel A) and noise powers.

[0128] In (4) S _A and S _B refer to the signals at access terminals (or channels) A and B, and N _A and N _B are the noise contributions on channels A and B. This equation clearly shows that uncorrelated noise contributions are totally eliminated.

[0129] Thus, the uncorrelated noise power is removed based on the cross-correlation, however the signal power and the correlated noise power are not removed. As a result, the removal of the uncorrelated noise power improves the SNR, and therefore renders possible detecting signals with lower energy levels.

[0130] In the time domain, the autocorrelation (AC) of signal I _s . (antenna i) and cross-correlation (CC) functions of signals I _s . and I _s . (antenna j) can be extracted using the following expressions :

[0131] The energy density can be written as the sum of electric and magnetic energy densities:

[0132] The correlation function of the electric or magnetic field is defined as: where {X) refers to ensemble average (expectation) applied to stochastic variable X and * stands for complex conjugate.

[0133] The correlation function of the electric and magnetic energies can be deduced as: