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WO/2023/210815A1 |
The present invention is a wiring board (100) having a multilayer structure, the wiring board (100) having a plurality of buildup layers (1), wherein a surface-side buildup layer (3) formed last from among the buildup layers (1) has a fi...
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WO/2023/210425A1 |
The present invention addresses the problem of providing a conductive substrate which has excellent bending resistance, suppressed moire, and excellent conductivity. The conductive substrate according to the present invention has a sub...
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WO/2023/210567A1 |
Provided are: a resin composition that can, when formed into a cured product, suppress backside exposure; and a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, a semiconductor...
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WO/2023/210247A1 |
A wiring circuit board according to the present invention is provided with: a core layer that is formed of a magnetic body and has first and second main surfaces, which face opposite directions, and first and second lateral surfaces whic...
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WO/2023/211847A1 |
A sensor assembly for sensing a physiological characteristic includes a power source configured to deliver power to one or more components of an electrical subsystem upon deployment of the sensor assembly to a user. A power latch is conf...
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WO/2023/210756A1 |
Provided is a photosensitive resin composition or the like that is capable of achieving both low warpage and high reflectance after a reflow process. The present invention is characterized by containing (A) a carboxyl group-containing ur...
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WO/2023/205958A1 |
The present disclosure provides a flexible printed circuit. The flexible printed circuit comprises a substrate, a first conductive layer, a first protective layer and a support body. The substrate has a device region and a non-device reg...
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WO/2023/211851A1 |
A sensor assembly for sensing a physiological characteristic includes a power source, a power control switch, and a power latch configured to latch an output of the power control switch. The sensor assembly also includes a power converte...
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WO/2023/210499A1 |
The present disclosure provides: a circuit device for which manufacturing costs are low and which is capable of realizing a filter circuit that uses a coil component that has stable mutual inductance; and a filter circuit. A circuit devi...
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WO/2023/209394A1 |
An aspect of the disclosure provides an electronic device comprising: a first substrate comprising a first ground plane and a second ground plane, wherein the first ground plane and the second ground plane are arranged to provide a shiel...
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WO/2023/208437A1 |
The invention relates to an optoelectronic device comprising a carrier with a front face and a rear face. First metal structures are arranged on the front face of the carrier. An optoelectronic semiconductor chip arranged on the front fa...
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WO/2023/211797A1 |
A flexible printed circuit board includes a coil for near-field communication (NFC) and circuit components for performing other functions such as driving a display panel. By integrating the NFC coil into the flexible printed circuit boar...
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WO/2023/210526A1 |
A wiring board according to this disclosure includes a layered structure in which a plurality of insulating layers and a plurality of conductive layers are alternately layered. The plurality of conductive layers include a first signal wi...
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WO/2023/209167A1 |
The invention relates to a light module (1) of a motor vehicle signalling device, comprising an array of light sources (2) mounted on an interconnection substrate (3) that comprises a stack of insulating layers (33) alternating with cond...
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WO/2023/210918A1 |
A foldable electronic device according to one embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB); a hinge structure connecting a first housing and a second housing; a hinge housing accommodating th...
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WO/2023/210735A1 |
This ceramic wiring member (1) comprises a body (10) and an electroconductive portion (30). The body (10) includes a tabular portion (11), and a first frame portion (12) surrounding a first cavity (21). The first frame portion (12) inclu...
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WO/2023/211526A1 |
An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shield...
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WO/2023/207238A1 |
The embodiments of the present application relate to the field of electronic devices. Disclosed are an electronic device, and a circuit board and a manufacturing method therefor, which solve the problem whereby a via hole having a conduc...
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WO/2023/210338A1 |
The present disclosure provides a curable polymer able to yield a resin in which the dielectric loss tangent (Df) under high frequency conditions is effectively lowered and the glass transition temperature (Tg) is sufficiently high. This...
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WO/2023/210317A1 |
This circuit board comprises a core, a base insulation layer, a first and a second coil part, and first through fourth wiring. The core is formed of a magnetic material and has a thickness of 10 μm to 300 μm. The base insulation layer ...
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WO/2023/210930A1 |
An electronic device according to an embodiment comprises: a first printed circuit board; a first connector; a second printed circuit board including one surface and the other surface opposite thereto, the one surface being opposite to o...
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WO/2023/211601A1 |
Techniques and systems for electronic circuit board design is provided herein. An example apparatus comprises an input structure that couples an input voltage node on a circuit board to input nodes of more than one voltage regulator circ...
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WO/2023/211106A1 |
The present invention relates to a method for manufacturing a ceramic substrate. Each of upper and lower metal layers respectively bonded to upper and lower surfaces of the ceramic substrate may have a thickness of 0.3 mm to 10 mm, so as...
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WO/2023/202942A1 |
The invention provides a system (1000) comprising a printed circuit board (500), wherein: (a) the printed circuit board (500) comprises one or more electrically conductive tracks (200); the printed circuit board (500) comprises a first s...
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WO/2023/202224A1 |
The present application provides a power module and a vehicle-mounted power circuit. The power module may comprise: a first metal-clad layer substrate, a chip located on one side of the first metal-clad layer substrate, and first brazing...
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WO/2023/205532A1 |
An information handling system includes a PCB (160), a CPU (150), a power distribution hat (130), and a heat sink (110). The PCB (160) includes a first power contact (164) on a first surface of the PCB (160) and a first ground contact (1...
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WO/2023/203750A1 |
Provided is an electronic control device that has an electronic board on which both a heat-generating component and a low-heat-resistant component are mounted and that is capable of suppressing heat transfer from the heat-generating comp...
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WO/2023/202174A1 |
The present application discloses a PCB, comprising: a metal substrate; an insulating layer that is provided on one side of the metal substrate, the insulating layer being provided with a through hole; a circuit layer that is provided th...
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WO/2023/204167A1 |
A ceramic circuit board according to an embodiment comprises a ceramic substrate and metal sheets joined to either surface of the ceramic substrate. At least one of the metal sheets joined to either surface of the ceramic substrate is a ...
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WO/2023/203906A1 |
This resin composition comprises an epoxy resin (A) and an inorganic filler (B), wherein the epoxy resin (A) contains a liquid epoxy resin (A-1); the inorganic filler (B) contains a carbon-containing inorganic filler (B-1) having a carbo...
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WO/2023/204054A1 |
A ceramic circuit substrate according to an embodiment comprises: a ceramic substrate; a metal circuit; and a metal member. The metal circuit is provided on one surface of the ceramic substrate. The thickness of the metal circuit is 1 mm...
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WO/2023/203904A1 |
The present invention achieves both wet heat resistance and tensile elongation. A two-pack type curable polyurethane resin composition according to an embodiment comprises a first component, which comprises polyols and a terpene resin,...
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WO/2023/205538A1 |
A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to defi...
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WO/2023/203649A1 |
This circuit board (10) is equipped with a plurality of connection parts to which components can be connected. The plurality of connection parts includes a first connection part (14), a second connection part (15), and a third connection...
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WO/2023/204073A1 |
A light-emitting device of the present invention comprises: an insulating substrate that has a substantially rectangular upper surface shape and has one or a plurality of first cutouts formed in one side surface among a set of opposing s...
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WO/2023/205287A1 |
The image capture device includes a receptacle defined within a housing and an optic system that is removably connected with the receptacle and configured to generate thermal energy. The image capture device includes a heatsink positione...
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WO/2023/203330A1 |
An aerosol provision system has a pressure sensing apparatus. The pressure sensing apparatus has a circuit board (6) and a pressure sensor (8). A first side of the pressure sensor is in fluid communication with a mouthpiece (16) of the a...
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WO/2023/203294A1 |
One aspect of the invention relates to a process for manufacturing a printed circuit board (1), said process comprising a step of depositing a conductive material (5), by means of an additive-manufacturing device, on a first conductive t...
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WO/2023/204099A1 |
In the present invention, the reference conductor layer overlapping an eleventh interlayer connection conductor among a first reference conductor layer and a second reference conductor layer is provided with a first opening overlapping a...
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WO/2023/199802A1 |
Provided are: a liquid composition containing a thermosetting resin and silica particles, wherein (1) the silica particle d50 and specific surface area are in specific ranges, and the composition viscosity is in a specific range, (2) the...
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WO/2023/200778A1 |
A method for fabricating a printed gel-electronic circuit includes depositing a conductive material on a substrate, depositing first gel over the conductive material on the substrate, air-drying the first gel, depositing second gel over ...
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WO/2023/200219A1 |
A circuit board, according to an embodiment, comprises: an insulating layer; a circuit layer disposed on the insulating layer; and a protective layer disposed on the insulating layer, wherein the circuit layer includes a 1-1 pad and a 1-...
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WO/2023/199887A1 |
Provided is a disk-shaped coil that can increase connection reliability and make an insulating layer less prone to collapse in the manufacturing process. This disk-shaped coil comprises at least one disk-shaped coil part having insulat...
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WO/2023/197513A1 |
The present application discloses a printed circuit board. The printed circuit board comprises: a first conductive layer; a second conductive layer, the second conductive layer and the first conductive layer being stacked; a first connec...
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WO/2023/199885A1 |
This wiring board comprises: a board having a first surface and a second surface positioned on the opposite side to the first surface; a plurality of mesh wiring portions which are spaced apart from each other and are arranged on the fir...
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WO/2023/201030A2 |
Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. Th...
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WO/2023/199803A1 |
Provided are: a liquid composition including a thermosetting resin, first silica particles, second silica particles, and a solvent, wherein the first silica particles have a median size d50 of 1.5 to 20.0 μm, with the product of the med...
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WO/2023/198460A1 |
The invention relates to a circuit board unit (10), in particular for use for a zone control device for a vehicle, having two circuit boards (12, 14) and a plurality of rod-shaped plug-in contact pins (32) each having two spring contact ...
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WO/2023/199693A1 |
A laminate according to the present invention has a structure in which a plurality of liquid crystal polymer layers including a first liquid crystal polymer layer, a second liquid crystal polymer layer, and a third liquid crystal polymer...
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WO/2023/199658A1 |
According to the present invention, the centers of a plurality of first columnar conductors, the centers of a plurality of second columnar conductors, the centers of a plurality of third columnar conductors, and the centers of a pluralit...
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