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WO/2023/236412A1 |
The present invention relates to a high-precision multilayer circuit board and a 3D printing preparation method therefor. The method comprises: S1, forming a stereoscopic circuit layer on the upper surface of a substrate; S2, performing ...
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WO/2023/236772A1 |
Provided in the present disclosure are a power amplifier module and a manufacturing method therefor. The power amplifier module comprises: a radio-frequency input end, a radio-frequency output end, a power amplifier chip, and an output m...
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WO/2023/238763A1 |
Provided is glass cloth with which it is possible to reduce delay time differences in printed wiring boards and to heighten the production efficiency. The glass cloth is composed of warps and wefts, wherein the warps and the wefts each h...
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WO/2023/238082A1 |
The present invention relates to: a method for manufacturing a liquid crystal polymer film having excellent strength; a liquid crystal polymer film manufactured by the method; a method for manufacturing a high-frequency circuit board mat...
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WO/2023/232702A1 |
It is described a component carrier (100), wherein the component carrier (100) comprises: i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure ...
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WO/2023/234023A1 |
The present invention provides a multilayer substrate which is not susceptible to cracking or separation at a connection part of an electrode that is provided on a ceramic layer and an interlayer connection conductor that is provided in ...
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WO/2023/233893A1 |
[Problem] To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. [Solution] This electronic component wiring structure is characterized in that a...
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WO/2023/231530A1 |
An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole exte...
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WO/2023/234411A1 |
This vehicle light source unit (31) comprises a circuit board (40), a light source (70) mounted on the front surface of the circuit board (40), and a board support member (91) on which the rear surface of the circuit board (40) is mounte...
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WO/2023/234286A1 |
Provided is a ceramic circuit substrate having a favorable adhesion with a mold resin. A ceramic circuit substrate according to an embodiment of the present invention comprises a ceramic substrate and a plurality of metal parts. The cera...
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WO/2023/234590A1 |
The present invention relates to a ceramic substrate and a manufacturing method therefor, the ceramic substrate comprising: a ceramic base; a first electrode pattern and a second electrode pattern formed on the upper and lower surfaces o...
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WO/2023/234414A1 |
Provided are: a method for bonding substrates containing polymers on the surfaces thereof; a bonding apparatus; and a laminate, applicable to high-frequency circuits in which substrates containing polymers on the surfaces thereof are fir...
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WO/2023/231776A1 |
A memory, comprising: a substrate (330), a first storage array (310) and a first redundant array (320). The first storage array (310) comprises a stack structure composed of at least one transistor and at least one capacitor unit, and th...
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WO/2023/233877A1 |
Provided is a film comprising a layer A and a layer B disposed on at least one surface of layer A. The ratio of the elastic modulus EB at 160°C of layer B to the elastic modulus EA at 160°C of layer A is 1.0 × 10-6 or greater and the ...
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WO/2023/233854A1 |
One embodiment relates to a polyamide-imide including: a structure that is derived from a compound including at least one type of compound selected from the group consisting of a diamine and a diisocyanate; and a structure that is derive...
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WO/2023/233459A1 |
This connection structure comprises a plurality of insulating wires, a base material, a plurality of to-be-connected sections disposed on the base material, and a sealing member. Each of the insulating wires has a center conductor and an...
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WO/2023/234377A1 |
This elongated laminated substrate has: a substrate that has a prescribed length; and two polymer layers that are respectively provided to the two sides of the substrate, the two polymer layers each containing a tetrafluoroethylene-based...
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WO/2023/232862A1 |
A connector device (1) comprises a housing (10) having a housing wall (100) and an opening (101) formed therein, a circuit carrier (11A-11C), which is arranged in the housing (10), and a connector element (12A-12C) to which a mating conn...
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WO/2023/232400A1 |
For an electronic module (1), in particular an electronic power module for hybrid vehicles or electric vehicles, comprising a first circuit board (10) with an upper side (11) and an underside (12) facing away from the upper side (11), wh...
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WO/2023/232648A1 |
A power electronics converter is disclosed. The power electronics converter comprises a converter commutation cell comprising a power circuit and a gate driver circuit, the power circuit comprising at least one power semiconductor switch...
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WO/2023/231369A1 |
Provided in the embodiments of the present application are a heat dissipation structure, a vehicle-mounted device, and a terminal device, which are applied to the technical field of heat dissipation. The heat dissipation structure compri...
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WO/2023/225944A1 |
A light emitting substrate (01) and a display device (1000). The light emitting substrate (01) comprises a substrate (101), a reflecting layer (100), at least one pad (201), a light emitting element (102), and a connecting portion (105),...
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WO/2023/226092A1 |
Disclosed in the present application are a display module and a mobile terminal. The display module comprises a first binding section of a display panel and a second binding section on a flexible circuit board, a second binding terminal ...
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WO/2023/228852A1 |
This electronic device comprises: a circuit board; a wire; and a terminal that is disposed on the circuit board and that electrically connects the circuit board and the wire. The terminal integrally has a misalignment prevention part for...
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WO/2023/229360A1 |
Disclosed is an interface device. The interface device includes a substrate that interfaces signals between an electronic device and a display device, wherein the substrate includes a first connector connected to the electronic device, a...
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WO/2023/227458A1 |
An electronic device has an elongate printed circuit substrate arrangement and a row of electrical units on the elongate printed circuit substrate arrangement. An indicator unit is wireless powered for identifying a particular location o...
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WO/2023/228942A1 |
This electronic component module comprises: a base sheet; an IC chip which is mounted on one surface of the base sheet; a combination electrode which is provided on the other side surface of the base sheet and is electrically connected t...
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WO/2023/228829A1 |
Provided is a multilayer substrate which is not susceptible to fracture of a metal compound that is formed between a conductor part which is provided in a ceramic layer and an interlayer connection conductor which is provided in a thermo...
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WO/2023/225934A1 |
A printed circuit board, a display module and a driving method therefor, and a display apparatus, which relate to the technical field of display. The printed circuit board comprises a blank region and an encapsulation region. The printed...
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WO/2023/229350A1 |
A semiconductor package according to an embodiment comprises: an insulating layer; a protective layer disposed on the insulating layer; a through-electrode passing through the insulating layer; and a bump part disposed on the through-ele...
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WO/2023/229392A1 |
A semiconductor package according to an embodiment comprises: a first substrate comprising first and second pads; a first connection unit disposed on the first pad of the first substrate; a second substrate coupled to the first connectio...
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WO/2023/228626A1 |
This wiring circuit board comprises: a wiring part having a signal line; and a component mounting part on which an electronic component to be electrically connected to the signal line is to be mounted. The wiring part has a plurality of ...
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WO/2023/228891A1 |
The purpose of the present invention is to easily and inexpensively obtain an electromagnetic wave attenuation film with little shift in absorption peak frequency and little change in frequency characteristics and angular characteristics...
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WO/2023/228941A1 |
This electronic component module that is attached using a hot melt adhesive agent to a member provided with a conductor pattern comprises: a first base; a coupling electrode that is provided on a first surface of the first base for elect...
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WO/2023/228903A1 |
Provided is a liquid crystal polymer film having improved folding endurance. The liquid crystal polymer powder comprises fibrous particles formed from a liquid crystal polymer. The melt viscosity of the liquid crystal polymer powder is 1...
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WO/2023/229302A1 |
The present invention has the following configuration. The present invention relates to a low-loss flat cable signal line for an ultra-high frequency, wherein the signal line plated, by a manufacturing method using an electroplating bath...
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WO/2023/228888A1 |
A circuit component according to the present inventio is provided with: an insulating layer that is configured from a ceramic; and a conductor layer that extends within the insulating layer in the plane direction and/or in a direction th...
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WO/2023/228879A1 |
This flexible wiring board unit comprises: a first flexible wiring board that extends in a first direction; and a second flexible wiring board that extends in a second direction. The second flexible wiring board is configured to be elect...
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WO/2023/226500A1 |
An electronic device, a chip, a circuit board and an electronic apparatus, wherein an adhesion layer can be utilized to increase the interlayer bonding force between a first metal layer and a dielectric layer. The electronic device compr...
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WO/2023/229349A1 |
A semiconductor package according to one embodiment comprises a circuit board and a connection member embedded in the circuit board, wherein the circuit board comprises a first insulation layer, which does not include a reinforcing membe...
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WO/2023/228798A1 |
The present invention provides an expansion/contraction device which is provided with: an expansion/contraction base material that is stretchable; and a first electrode, a second electrode and a third electrode, which are provided on the...
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WO/2023/228465A1 |
The present invention ensures sufficient holding strength without needing a large deflection amount. This component assembly structure comprises: a plurality of tongue pieces 11, 12 that extend from a component 1, that have chevron bent ...
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WO/2023/229401A1 |
A camera module according to various embodiments may comprise: a first circuit board electrically connected to an image sensor or a circuit board including an image sensor; an actuator configured to control at least one of the position o...
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WO/2023/224021A1 |
The present invention provides: a resin composition which contains (A) one or more substances that are selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of the maleim...
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WO/2023/222388A1 |
To create a sensor arrangement (10), having a sensor portion (11) with at least one sensor (21) and having at least one electronics portion (12) with electronics (22) for controlling and/or reading out from the at least one sensor (21), ...
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WO/2023/222541A1 |
The invention relates to a plug (1) having a circuit board (2). The plug (1) can be connected to a socket (5) associated with the plug (1) in order to supply the circuit board (2) with electrical energy and/or electrical signals. The plu...
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WO/2023/223915A1 |
This circuit board comprises a base material, at least a pair of terminals provided on the base material, a bonding material which includes a metal element and is disposed on the terminals, and a wall of an insulating material that rises...
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WO/2023/222714A1 |
There is described a radio frequency, RF, module (100), comprising: i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (102); and ii) a RF fr...
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WO/2023/224770A1 |
A battery system (12) for a machine (10) includes one or more battery module cell bus bars (42) and one or more terminal bus bars (48). The one or more terminal bus bars (48) include a coupling (58) configured to couple the battery syste...
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WO/2023/224522A1 |
The invention relates to an elongated FPC (1) formed into a tubular shape, which comprises a set of conductors (s2al-2, 2bl-2) extending in the direction of the elongated FPC (1). The set of conductors (s2al-2, 2bl-2) is divided into fou...
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