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WO/2024/072343A1 |
The invention is related with a Cu(Ag) film production method in an electrochemical coating method in a mixture of green components such as choline chloride and ethylene glycol, achieved Cu(Ag) film can be used in the coating of circuit ...
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WO/2024/070531A1 |
A capacitor element 1 comprises: capacitor parts 10 each comprising an anode plate 11 including a porous part 11B disposed on at least one main surface of a core 11A, a dielectric layer 13 disposed on the surface of the porous part 11B, ...
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WO/2024/066646A1 |
A printed circuit board via hole structure and a printed circuit board. The printed circuit board via hole structure comprises signal holes (200) and at least one ground via hole (100). The signal holes and the ground via hole penetrate ...
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WO/2024/070628A1 |
A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first...
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WO/2024/070319A1 |
The purpose of the present invention is to provide a glass substrate with which it is possible to form a through-electrode provided with excellent transmission characteristics, and a multilayer wiring substrate equipped with such a glass...
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WO/2024/072186A1 |
A semiconductor package according to an embodiment comprises: an insulation layer; a plurality of electrode parts including a through-part extending therethrough from the upper surface of the insulation layer to a partial area thereof; a...
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WO/2024/070320A1 |
The purpose of the present invention is to provide: a glass substrate in which it is possible to form a through-electrode having favorable transmission properties; and a multilayer wiring substrate equipped with said glass substrate. A...
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WO/2024/068536A1 |
The invention relates to a switching apparatus (1) for a printed circuit board (14), the switching apparatus (1), for applying signal lines to a board-to-board connector (8), comprising: - a plurality of connection pins (2) for a board-t...
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WO/2024/072042A1 |
An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board disposed in the housing; a first component and a second component disposed on one surface of the circuit board; a shieldi...
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WO/2024/070518A1 |
This wiring board comprises a first base material having a first main surface, a second base material having a second main surface, a first wire disposed on the first main surface, and a second wire disposed on the second main surface. T...
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WO/2024/070883A1 |
A semiconductor module according to one aspect of the present disclosure comprises: a first substrate; a second substrate; and a third heat dissipation member. The first substrate is provided with a first semiconductor element on one mai...
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WO/2024/070470A1 |
The present invention provides a silicon nitride sintered body which enables firing at low temperatures, while having high strength. A silicon nitride sintered body according to one embodiment of the present invention contains 0.1% by ma...
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WO/2024/070775A1 |
The present invention addresses the problem of providing a laminate which has excellent low-k dielectric properties, low water absorption, and adhesion. A laminate according to the present invention has a copper layer and a polymer layer...
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WO/2024/069152A1 |
A wearable device (10) for sports headwear, including a housing and a printed circuit board (PCB). The PCB includes alternating layers of core material substrate (141) and prepreg material substrate (142) in a stacked arrangement, wherei...
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WO/2024/071732A1 |
According to an embodiment of the present disclosure, an electronic device comprises: a housing including a first housing and a second housing; a hinge structure rotatably connecting the first housing to the second housing; and a flexibl...
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WO/2024/072220A1 |
A printing device (1) is provided herein for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a carrier surface (2s) for carrying a specimen (SB1,...
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WO/2024/071185A1 |
A release film 10 according to a first invention includes a first release layer 1 comprising a first thermoplastic resin composition, and a cushion layer 3 laminated on the first release layer 1. The thermal diffusivity coefficient in th...
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WO/2024/070240A1 |
This electronic device actively drains water which has entered into a through-hole of a printed wiring board. A connector unit 100 is provided with: a printed wiring board 30 comprising a circular through-hole 31b penetrating through an ...
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WO/2024/070591A1 |
This stretchable device comprises: a stretchable first base material; first wiring provided to a first main surface of the first base material; a second base material that faces the first base material in a first direction, which is the ...
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WO/2024/070248A1 |
Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μｍ3...
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WO/2024/067611A1 |
provided are a cathode for an oxygen treatment apparatus, an oxygen treatment apparatus, and a refrigerator. The cathode for the oxygen treatment apparatus comprises: a mesh-shaped conductive film, which is provided with at least one mov...
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WO/2024/070650A1 |
The present invention addresses the problem of providing a production method that makes it possible to produce a multilayer metasurface structure with excellent position precision between metasurface structures. A production method accor...
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WO/2024/065037A1 |
The disclosure relates to an instrumentation enclosure, and particularly a modular sensor tower comprising a plurality of modules. The modules include one or more sensor modules comprising one or more sensors and a control module compris...
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WO/2024/070415A1 |
A dispersion composition containing (A) a fluororesin powder, (B) an inorganic filler, (C) a dispersant, and (D) an organic solvent, wherein the dispersion composition satisfies that the content of component (A) is 15-40 wt% and the cont...
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WO/2024/070592A1 |
This stretchable device comprises: a stretchable first base material; first wiring provided on a first primary surface of the first base material; a second base material which faces the first base material in a first direction which is t...
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WO/2024/070595A1 |
The present invention suppresses the emission of noise from a motor drive circuit to improve EMC performance and mitigate cost increases. In a multilayer substrate 110 on which a motor drive circuit 150 is provided, a second conductive l...
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WO/2024/072172A1 |
A technology for determining an optimal cleaning cycle of a screen printer is disclosed. A device according to one aspect of the present disclosure comprises one or more processors, and one or more memories for storing instructions that,...
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WO/2024/070329A1 |
This method for manufacturing an onboard wiring board uses a board portion body (10). The method for manufacturing an onboard wiring board comprises a selecting step. In the selecting step, depending on the type of the vehicle on which a...
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WO/2024/071066A1 |
The present invention provides a metal-clad laminated plate in which the haze of an insulating resin layer is low and which has excellent visibility and light transmission and also has excellent light fastness. Provided is metal-clad l...
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WO/2024/069612A1 |
The complexity of modern automotive glazing is increasing as more and more technology is being integrated with the glazing. As the industry moves towards full autonomous electric vehicles and as consumers demand increased levels of comfo...
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WO/2024/063534A1 |
The present invention provides a polyimide varnish comprising: a first polyamic acid comprising a first block derived by polymerization of a first dianhydride acid component comprising biphenyltetracarboxylic dianhydride (BPDA) and a fir...
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WO/2024/061396A1 |
The invention relates to an inverter (1) for supplying current to an electric machine (20), in particular an electric machine (20) within a drive train (3) of a fully electric or hybrid motor vehicle (4), said inverter comprising: an inv...
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WO/2024/061467A1 |
The disclosure relates to a prepackage module (100) for embedding into a multilayer printed circuit board (PCB) (500). The prepackage module comprises: a power semiconductor component (140) comprising at least two terminals (141, 142); a...
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WO/2024/063015A1 |
A wiring board (1) according to an embodiment comprises an electric wiring portion (2) including insulating layers (21, 22, 32) and conductor layers (11, 12, 31); an optical wiring portion (3) disposed on one surface (2a) of the electric...
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WO/2024/063522A1 |
A camera module comprising: a lens holder in which lenses are disposed; a bracket disposed under the lens holder; a printed circuit board disposed at the lower portion of the bracket; and a stiffener disposed under the printed circuit bo...
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WO/2024/062975A1 |
Provided are: a ceramic substrate which, even upon reception of a thermal shock, can be prevented from suffering a defect in the heat dissipation member or the ceramic layers or from suffering a defect around the interface between the he...
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WO/2024/059928A1 |
A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and...
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WO/2024/063088A1 |
The present invention provides a heat sink-attached circuit board (50) in which a conductor layer (30) constituting a circuit and a heat sink (10) are integrated with an insulating layer (20) therebetween. The heat sink (10) comprises a ...
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WO/2024/063621A1 |
An electronic device according to an embodiment may comprise a first housing, a second housing, a display, a connection structure, and at least one processor. The connection structure may electrically connect a second conductive portion ...
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WO/2024/064586A1 |
Electronic devices that include a routing substrate with lower inductance path for a capacitor, and related fabrication methods. In exemplary aspects, to provide lower interconnect inductance for a capacitor coupled to a power distributi...
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WO/2024/061041A1 |
Disclosed in the present application is an electronic device. The electronic device provided in the present application comprises a frame, a circuit board and a radio-frequency device, wherein the frame comprises a metal member used as a...
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WO/2024/062819A1 |
The present invention provides a vehicle circuit board that enables an improvement in heat dissipation properties. Provided is a circuit board (10) to be mounted on a vehicle, said circuit board (10) comprising: a substrate (20); a fir...
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WO/2024/061724A1 |
The invention relates to a method for producing a circuit board (11) having a plurality of conductor layers (22, 26, 30) and at least one substrate layer (20, 24, 28) therebetween, comprising the steps of providing a base substrate (19),...
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WO/2024/061392A1 |
The invention relates to an electrical circuit (10) having: at least one electrically conductive conductor (12), at least one support (14), which carries the at least one electrically conductive conductor (12) and comprises an electrical...
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WO/2024/062058A1 |
A lighting device (100) including a light emitting diode (LED) spinal component (102) and a circuit board strip (120) is disclosed. The LED spinal component (102) includes an LED (104) disposed on a first circuit board (106) including fi...
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WO/2024/064542A2 |
An electronic device is disclosed. The electronic device can include a core having a top core section and a bottom core section, a laminate substrate, where the laminate substrate having a void through which the top and bottom core secti...
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WO/2024/061979A1 |
A system (200) for monitoring conveyor belts is disclosed. The system (200) includes a sensor loop stack (110) comprising conductive ink printed on a substrate layer, RFID, a transmitter (104), a detector (106), RFID-readers and circuitr...
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WO/2024/062808A1 |
The present invention makes disconnection unlikely between a wiring layer provided on a glass substrate and a TGV provided on the glass substrate. A wiring substrate (1) comprises: a glass substrate (10) which has first and second surfac...
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WO/2024/063476A1 |
A flexible printed circuit board according to an embodiment comprises: a substrate including a chip mounting area; and a circuit pattern disposed on the substrate. The circuit pattern comprises a first circuit pattern, a second circuit p...
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WO/2024/060332A1 |
A circuit structure and a method for forming same, and a memory. The circuit structure comprises a first layer-changing assembly (1), a second layer-changing assembly (2), and a coupling pad (3). The first layer-changing assembly (1) com...
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