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WO/2024/107521A1 |
A device comprising a substrate, a first integrated device coupled to a first surface of the substrate, a second integrated device coupled to the first surface of the substrate, a first passive device coupled to a second surface of the s...
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WO/2024/106433A1 |
The present disclosure provides, inter alia: a multilayer structure including an insulating adhesive layer that exhibits a low dielectric constant, a low dielectric tangent, and a low water absorption rate, the insulating adhesive layer ...
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WO/2024/106329A1 |
The present invention comprises: a substrate that includes a light source and a wiring pattern to which an electronic component is connected; and a socket housing that includes a substrate attachment part to which the substrate is attach...
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WO/2024/106066A1 |
Provided are: a wiring substrate that has excellent reliability; and a method for manufacturing the wiring substrate. The wiring substrate (1) according to one embodiment includes a glass substrate (10), a conductor layer (70), and an in...
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WO/2024/103925A1 |
Embodiments of the present application provide a circuit board and an electronic device. The circuit board comprises a first plate, a second plate, and a third plate. The first plate comprises a first surface and a second surface which a...
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WO/2024/105904A1 |
[Problem] The present invention addresses the problem of providing a method and a mechanism which are for connecting a plurality of printed boards together without requiring a connector or soldering. [Solution] The problem is resolved wi...
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WO/2024/103863A1 |
Provided in the present application are a positioning mechanism, a flexible printed circuit, an assembly and an electronic device. In the present solution, the positioning mechanism is configured to be arranged on a base body, and compri...
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WO/2024/103575A1 |
The present invention relates to a method for manufacturing a graded gold finger, comprising the following steps: step 1, leading a graded gold finger to a board edge region by means of a connecting lead wire, and making a circuit patter...
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WO/2024/107706A1 |
In some embodiments, a packaged device can include an electrical device having first and second electrodes implemented on opposite sides of a body. The electrical device can be sandwiched between first and second terminal assemblies, wit...
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WO/2024/106228A1 |
A conductive film according to the present invention includes: a base; and a conductive part provided on the main surface side of the base. The conductive part includes a body part containing a first metal, and a blackened layer covering...
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WO/2024/106787A1 |
The present invention relates to a composition for adhesion enhancement and a metal-substrate bonding method using same. The composition for adhesion enhancement according to the present invention, for example, enables chemical bonding b...
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WO/2024/103223A1 |
A display panel (500) and manufacturing method thereof are provided. The manufacturing method for manufacturing the display panel (500) comprises: providing a plurality of interposers(200); providing a plurality of display units (100); m...
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WO/2024/099871A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive power contacts used to supply to power to, for example, a medical device. The battery compar...
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WO/2024/101737A1 |
The present invention relates to a ceramic substrate for a power module and a manufacturing method thereof. A ceramic substrate for a power module according to one embodiment of the present invention may comprise: a ceramic substrate; an...
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WO/2024/099148A1 |
The present application relates to the technical field of terminal devices. Provided in the embodiments are a circuit board, an electronic device and a manufacturing method for the circuit board. The circuit board comprises an adapter bo...
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WO/2024/099778A1 |
The invention relates to a method for detecting a delamination of at least one coating (1) of a printed circuit board (2) of a field device (3) in process and automation technology, which is used to determine and/or monitor at least one ...
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WO/2024/101362A1 |
The present disclosure addresses the problem of providing: a resin composition which has enhanced moldability and enables the achievement of a cured product that has higher adhesion to a metal; a prepreg which is produced from this resin...
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WO/2024/099803A1 |
The present invention relates to a method for monitoring a joining process of a flex cable (10) and to such a flex cable (10). The method comprises: a first step for using a first mounting portion (12) and a second mounting portion (14) ...
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WO/2024/101296A1 |
The present invention pertains to: a resin composition which contains a polyimide precursor and fillers, and in which the fillers include a filler A1 that satisfies the following condition 1 and/or condition 2 and a filler B that is diff...
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WO/2024/101056A1 |
One aspect of the present invention relates to a resin composition containing: a compound (A) containing at least one selected from polyfunctional vinyl aromatic copolymers (A-1) that have a repeating unit (a1) derived from a divinyl aro...
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WO/2024/099800A1 |
The invention relates to an electro-acoustic multi-functional module (100), comprising a module body (1) with a first outer side (11) on which an electrical interface (13) is provided, and a second outer side (12) on which an acoustic in...
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WO/2024/101361A1 |
Provided is a glass substrate for reinforcing a wiring board, the glass substrate being excellent in low dielectric loss characteristics. The glass substrate for reinforcing a wiring board is formed from plate glass that contains, as t...
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WO/2024/101932A1 |
This camera module comprises: a lens holder having a first hole; a lens module of which at least a part is coupled to the first hole, and which protrudes above the lens holder; a mounting holder disposed on the lens holder and having a s...
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WO/2024/101316A1 |
The purpose of the present invention is to obtain a resin that is adjusted in advance, so that, in a configuration in which the resin is filled into gaps between wiring patterns, the influence of stress that occurs in the filled resin is...
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WO/2024/100181A1 |
Described is a block copolymer, which is an AB diblock copolymer with a first block A of structure (I) and a second block B of structure (II), wherein R and Ri are individually selected from a C-1 to C-4 alkyl, where the mole % of repeat...
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WO/2024/102003A1 |
An adapter handset (10) is provided for electrically interfacing with a desk controller (2) of an electrically powered sit-stand desk (1). The adapter handset (10) includes a multi-pin handset connector (7) and a processor (4). The desk ...
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WO/2024/101348A1 |
[Problem] To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. [Solution] An electronic component wiring structure 1 is characterized in that a...
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WO/2024/101718A1 |
According to an embodiment of the present disclosure, a wearable electronic device may comprise: a housing including an opening; a display module disposed in the housing and configured to output a visual image; a battery disposed in the ...
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WO/2024/101054A1 |
One aspect of the present invention relates to a resin composition comprising: a hydrocarbon-based compound (A) represented by formula (1) [in formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and including at l...
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WO/2024/100805A1 |
Provided is a three-dimensional substrate comprising a plurality of flat mounting surfaces, one mounting surface among the plurality of flat mounting surfaces being inclined at a prescribed angle in relation to the other mounting surface...
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WO/2024/101821A1 |
An electronic device comprises: a housing; and a connector disposed within the housing, wherein the connector includes: a case forming an outer surface of the connector and having an opening formed in at least a portion of the outer surf...
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WO/2024/099817A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive battery contacts used to facilitate the supply of power to, for example, a medical device. T...
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WO/2024/101707A1 |
A resin composition according to one embodiment disclosed in the present application comprises: an epoxy resin; a curing agent including a cyanate ester-based resin and a phenol-based resin; inorganic particles including silica particles...
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WO/2024/100573A1 |
The invention relates to a printable paste 20 for producing an electrical component, comprising a printable, non-conductive coating 22, electrically conductive particles 25 and and ceramic NTC particles 30, wherein the electrically condu...
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WO/2024/095812A1 |
The present invention provides a circuit board which is configured such that gaps in a wiring pattern are filled with a resin and in which attachment of the resin to the surface of the wiring pattern is easily prevented or suppressed. ...
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WO/2024/094901A1 |
The present disclosure relates to a circuit board for transmitting and/or receiving electromagnetic waves, the circuit board comprising : - a linear array of N connectors, where N is equal to at least four, each connector being suitable ...
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WO/2024/096377A1 |
A heating fiber having a plurality of through holes comprises a fiber fabric, a fiber circuit, and a heating element pattern. The fiber circuit includes a first wire and a second wire. Each of the first and second wires is formed by weav...
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WO/2024/096131A1 |
This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second...
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WO/2024/094434A1 |
There is described a component carrier (100), comprising: i) a stack (101) comprising at least two electrically conductive layer structures (130, 130') and at least one electrically insulating layer structure (102); ii) a plurality of co...
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WO/2024/093585A1 |
The present disclosure provides a display device. The display device comprises a display panel, a flexible circuit board, and a driving chip; the display panel comprises a display region and a non-display region bent to the back side of ...
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WO/2024/094430A1 |
There is described a component carrier (100), comprising: i) a stack (110) comprising at least two electrically conductive layer structures (130, 131) and at least one electrically insulating layer structure (102); ii) an electrically co...
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WO/2024/097676A1 |
Systems and methods are disclosed for routing differential communication lines to different integrated circuits based on printed circuit board (PCB) unit variants. In one example, a system for routing signals comprises a location for mou...
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WO/2024/093022A1 |
A fine-line circuit board based on a semi-additive process, a preparation method therefor, a surface treatment method, and a use, which relate to the technical field of chip packaging. An embodiment comprises the following steps: 1) carr...
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WO/2024/045735A9 |
Embodiments of the present application provide a computing node and a computing apparatus. The computing node comprises a mainboard and a current conducting structure, and an electronic device is mounted on a first surface of the mainboa...
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WO/2024/095422A1 |
The purpose of the present invention is to provide an electronic control device with which the long-term reliability of the soldered section between a leadless package and a circuit board can be ensured. An electronic control device 1 co...
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WO/2024/095641A1 |
Provided are: a polymer film comprising a layer A and a layer B provided on at least one surface of the layer A, wherein the layer A comprises a polymer having a dielectric tangent of 0.01 or less, the layer B has a moisture permeability...
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WO/2024/095742A1 |
The present disclosure provides a curable composition from which it is possible to obtain a resin which has excellent adhesiveness to substrates, which has excellent heat resistance, and in which the dielectric loss tangent (Df) at high ...
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WO/2024/097615A1 |
A ball-grid-array assembly (BGA assembly) includes: a printed circuit board having: outer Non-Solder-Mask-Defined (NSMD) pads that are positioned close to edges, including close to a plurality of corners, of the BGA footprint on the prin...
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WO/2024/094544A1 |
There is described a single component carrier (100), comprising: a stack (101) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (102), wherein the at least one...
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WO/2024/095967A1 |
A wiring board according to an embodiment of the present invention comprises: a first wiring board 11 including first insulating layers 111, first conductor layers 112, and first via conductors 113; and a second wiring board 12 including...
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