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WO/2024/080195A1 |
The present invention pertains to: a prepreg which contains a fiber base material and a resin composition containing (A) a thermosetting resin and (B) a spherical zinc molybdate, and in which the weight per unit area of the fiber base ma...
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WO/2024/080270A1 |
An electronic device 1 comprises: a wiring board 10 having a first main surface 11 and a second main surface 12 that oppose each other in the thickness direction; a first electronic component 20 mounted on the first main surface 11 of th...
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WO/2024/081466A1 |
The present disclosure relates to a base station antenna, comprising: a reflector; a first frequency band radiating element located on the front side of the reflector; and a feed board located on the front side of the reflector, the feed...
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WO/2024/079923A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200°C or higher, and has a low dielectric dissipation factor...
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WO/2024/080830A1 |
A camera module, disclosed in one embodiment of the present invention, comprises: an optical member for reflecting light, and a first lens assembly for controlling the tilt of the optical member; a plurality of lens holders, and a second...
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WO/2024/080644A1 |
According to various embodiments, an electronic device may comprise: a first housing; a second housing slidably coupled to the first housing; a flexible display having a display area that changes on the basis of the slide-in or slide-out...
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WO/2024/077529A1 |
The present application relates to a chip to module (C2M) cable assembly and a PCB circuit. The cable assembly comprises: a first joint part comprising a plurality of first interface terminals, one end of each first interface terminal be...
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WO/2024/078972A1 |
There is described a component carrier (100), wherein the component carrier (100) comprises: i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structu...
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WO/2024/079926A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating ...
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WO/2024/080642A1 |
According to various embodiments, the electronic device may comprise: a first housing; a second housing slidably coupled to the first housing; a flexible display having a display area varying on the basis of the slide-in or slide-out sta...
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WO/2024/079924A1 |
Provided are a resin composition that does not inhibit a photocuring reaction in an exposure step and that can provide excellent alkali developability in a development step, and a resin sheet, a multilayer printed wiring board, and a sem...
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WO/2024/075816A1 |
This wiring board comprises a base portion, a dielectric board, and a first signal conductor. The base portion has a first upper surface, a first lower surface, a first side surface, and a first opening portion having an opening in the f...
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WO/2024/076143A1 |
An electronic device according to one embodiment of the present disclosure comprises: a camera module having a viewing angle formed in a first direction; and a recess for accommodating the camera module, wherein: the camera module includ...
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WO/2024/075791A1 |
Provided are a dielectric and a method of manufacturing the same that reduce the frequency dependency of relative permittivity in a terahertz high-frequency band (110 to 330 GHz) of the relative permittivity. In the dielectric, the slope...
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WO/2024/075864A1 |
The present disclosure relates to a printed circuit board capable of improving heat dissipation performance, comprising: a substrate; a solder formed in a predetermined area of the substrate; and a heat transfer metal layer formed betwee...
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WO/2024/075735A1 |
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on ...
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WO/2024/075456A1 |
This circuit board comprises a fluorine resin layer, a to-be-adhered layer, and an adhesive layer adhering the fluorine resin layer with the to-be-adhered layer. The fluorine resin layer includes polytetrafluoroethylene and a first inorg...
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WO/2024/075218A1 |
In the present invention, an optical device (1) includes a feedthrough substrate (2). The feedthrough substrate (2) is connected to one end of a flexible substrate (3). A cap (4) is fitted onto one end of the flexible substrate (3). The ...
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WO/2024/074743A1 |
The invention relates to a microthruster applicable to space engineering that comprises printed circuit boards (PCBs) connected to each other, wherein the first board comprises a fuel tank (1) and an outlet nozzle (2) and the second boar...
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WO/2024/074905A1 |
Methods, systems, and apparatus for logical reverse computing and circular compression and decompression. In one aspect, a method for compressing a classical binary data input includes obtaining a classical binary data input; performing ...
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WO/2024/076113A1 |
An electronic device according to an embodiment of the present invention may comprise: a housing including a first surface, a second surface, and a lateral surface surrounding a space between the first surface and the second surface; a p...
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WO/2024/076211A1 |
A semiconductor package according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a fourth insulati...
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WO/2024/075629A1 |
One aspect of the present invention relates to a resin composition comprising: (A) a preliminary reaction product obtained by preliminarily reacting a mixture that includes a maleimide compound (a1) and a phosphorus-containing compound (...
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WO/2024/076040A1 |
According to various embodiments, an electronic device may include a base plate, a side frame connected to the base plate, a front cover covering one side of the base plate, a back cover covering one side of the side frame and provided o...
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WO/2024/075758A1 |
Provided are a composition for obtaining fluororesin sheets excellent in terms of low permittivity, low loss, and low thermal expansion, a fluororesin sheet, and a method for producing the fluororesin sheet. The composition comprises: a ...
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WO/2024/075398A1 |
The present invention reduces the device size of an imaging device that performs rotation correction. This camera module comprises a lens group, a translational actuator, a rotational actuator, and a mounting board. In this camera modu...
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WO/2024/070835A1 |
This glass substrate includes a glass layer and an opening open on a first main surface side of the glass layer. The thickness of the glass layer is 10 to 300 μm inclusive, and there is no burr at a first main surface-side edge of the o...
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WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
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WO/2024/067249A1 |
A circuit board (120), a backlight module (220), a display module, and an electronic device. The circuit board (120) comprises at least two sub-boards (10) spaced apart from each other; the sub-boards (10) extend in a first direction (y)...
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WO/2024/070087A1 |
Provided is a joint structure for a flexible printed-wiring board, with which it is possible to enhance the short circuit-suppressing effect. The present invention is characterized in that: an FPC 10 comprises a base film 100, a plural...
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WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
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WO/2024/070529A1 |
This capacitor element 1 comprises: a capacitor unit 10 that includes an anode plate 11 having a porous part 11B on at least one main surface of a core part 11A, a dielectric layer 13 provided on the surface of the porous part 11B, and a...
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WO/2024/070247A1 |
Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/...
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WO/2024/072097A1 |
An embodiment comprises: a fixed part; and a moving part that includes a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and moves, in a direction perpendicular to an optical axis ...
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WO/2024/066782A1 |
The present application relates to the technical field of electronic products. Provided are a circuit board assembly and an electronic device, which are used for solving the problem of high-density layouts of surfaces of circuit boards. ...
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WO/2024/071069A1 |
A wiring board according to the present disclosure comprises: an insulating board that has a first surface and a second surface which is positioned on the reverse side from the first surface; and a solder resist that is positioned on the...
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WO/2024/068546A1 |
The invention relates to an electrical device with at least one circuit carrier comprising a carrier substrate made of an electrical insulation material. On at least one outer face of the circuit carrier, an electrical conductor structur...
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WO/2024/070026A1 |
The present invention concerns a method for manufacturing a package of a power semiconductor and a package comprising a power semiconductor. The package comprises: conducting layers over each electrode of the power semiconductor, nanowir...
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WO/2024/071129A1 |
Provided are: an epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board uses; and an active ester resin that provides ...
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WO/2024/070959A1 |
This wiring board comprises a substrate, a signal line positioned on the substrate, and a waveguide-type waveguide path positioned on the substrate. The signal line has a first end portion, which is one end in a direction in a signal tra...
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WO/2024/070808A1 |
Provided is a photosensitive film provided with a photosensitive resin composition layer comprising a photosensitive resin composition, in which the photosensitive resin composition layer has a thickness of 20 μm or more, the photosensi...
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WO/2024/070495A1 |
Provided are: a resin composition capable of ensuring adhesion of a fluororesin, when employed in a substrate material in which the fluororesin is laminated on a metal substrate or the like, while enhancing the filling properties of an i...
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WO/2024/066356A1 |
Disclosed are a differential arrangement structure (100) and a printed circuit board. The differential arrangement structure (100) comprises one or more differential units (10), wherein each differential unit (10) at least comprises a fi...
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WO/2024/067668A1 |
The present application discloses a circuit board apparatus and an electronic device. The disclosed circuit board apparatus comprises a circuit board, a first chip, and a cooling element; the circuit board is provided with an accommodati...
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WO/2024/068349A1 |
A method for fabricating a circuit board arrangement (14) comprises: providing a circuit board panel (140) forming at least one circuit board section (140A-140D), a remaining panel section (142) and at least one support portion (144A, 14...
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WO/2024/066481A1 |
The present application provides a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, a chip, a shielding cover and a conductive structure. The circuit board comprises a first surface a...
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WO/2024/071083A1 |
This circuit board comprises a board, a first multilayered ceramic capacitor, and a second multilayered ceramic capacitor adjacent to the first multilayered ceramic capacitor. The dimension of the first multilayered ceramic capacitor in ...
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WO/2024/072120A1 |
According to an embodiment of the present invention, an electronic device may comprise a wireless communication circuit, an antenna structure, a non-conductive dielectric, and a conductive path. The antenna structure may comprise a print...
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WO/2024/070619A1 |
The present invention addresses the problem of providing a laminate that has excellent level difference conformability and excellent adhesion when the laminate is bonded to an object having a level difference by thermocompression. The pr...
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WO/2024/072050A1 |
An electronic device may be provided. The electronic device may comprise: a first housing including a first cover member and a frame positioned inside the first cover member; a second housing including a second cover member at least part...
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