Title:
RFID MODULE
Document Type and Number:
WIPO Patent Application WO/2024/075735
Kind Code:
A1
Abstract:
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on the first main surface-side of the first substrate such that at least a part of the radiation element is set apart from the first main surface; and a second radiation element disposed on the second main surface-side of the first substrate. The second radiation element has a first end and a second end that face each other in the longitudinal direction of the first substrate. The first end is electrically connected to one terminal of the RFIC chip. The first radiation element has a third end and a fourth end that face each other in the longitudinal direction of the first substrate. The third end is electrically connected to the other terminal of the RFIC chip. The second end of the second radiation element and the fourth end of the first radiation element are electrically connected to each other. The second radiation element has a first opening.
Inventors:
UEKI NORIYUKI (JP)
Application Number:
PCT/JP2023/036075
Publication Date:
April 11, 2024
Filing Date:
October 03, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/04; G06K19/077; H01L23/12; H01L25/18; H01Q13/08; H05K1/14
Domestic Patent References:
| WO2020079962A1 | 2020-04-23 | |||
| WO2017110570A1 | 2017-06-29 | |||
| WO2020079961A1 | 2020-04-23 |
Foreign References:
| JP2019128706A | 2019-08-01 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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